The invention provides an MEMS 
wafer level vacuum 
package structure and a manufacturing method thereof. The 
package structure comprises a 
silicon cover plate and an MEMS 
wafer with a movable structure, wherein a vertical through hole is formed on the cover plate, the through hole is internally filled with a conductive material, a bonding surface of the cover plate is provided with a groove, a layer of 
getter film is arranged at the bottom of the groove, and the 
silicon cover plate and the MEMS 
wafer with the movable structure form the vacuum 
package structure by 
wafer bonding. The manufacturing method provided by the invention comprises the following steps: at first, manufacturing the through hole on the cover plate, and filling the conductive material in the hole; and then, forming the groove on the bonding surface, depositing a layer of 
getter film on the bottom of the groove, depositing a layer of multilayer 
metal film in a bonding area, and 
wafer bonding the cover plate with the MEMS wafer with the movable structure in a vacuum environment. According to the MEMS wafer level vacuum package structure provided by the invention, the groove with the 
getter and the through hole are formed on the 
silicon cover plate to export an 
electrode from the closed groove without carrying out 
wire bonding, so that the procedures are simple, meanwhile, the vacuum maintenance ability in the package structure is improved, 
contamination of granules to the movable structure during 
cutting is avoided, and performance of the device is guaranteed.