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Preparation method for 3D nano porous metal materials

A nanoporous, metal technology, applied in the field of preparation of 3D nanoporous metal materials, can solve the problems that cannot be used to prepare large-sized bulk materials, and the strength of metal materials is poor, so as to avoid thermal stress and interlayer thermal diffusion, Avoid pollution, the effect of uniform and controllable structure

Inactive Publication Date: 2017-05-31
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current conventional dealloying method, which is often used to prepare thin strip-type porous metals, cannot be used to prepare large-sized bulk materials, and the strength of metal materials is poor.

Method used

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  • Preparation method for 3D nano porous metal materials
  • Preparation method for 3D nano porous metal materials
  • Preparation method for 3D nano porous metal materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Example 1: Preparation of nanoporous nickel material.

[0039] Step 1, substrate pretreatment is performed on the foamed Ni.

[0040] 1a) Commercially purchased Ni foam was pressed into thin slices, polished and polished, then ultrasonically cleaned with deionized water, analytically pure acetone and analytically pure ethanol for 5 minutes each, and then dried with nitrogen for 5 minutes;

[0041] 1b) Immerse the surface-pretreated substrate in a 5M HCl solution for 3 minutes for surface activation, then rinse the sample several times with deionized water and put it into an electrolytic cell.

[0042] Step 2, electroplating a Zn thin film on the foamed Ni substrate.

[0043] 2a) In the electrochemical three-electrode test system, the foam Ni substrate is set as the working electrode, the saturated calomel SCE electrode is the reference electrode, and the metal platinum sheet is the auxiliary electrode, and these three electrodes are placed in the electrolytic cell;

...

Embodiment 2

[0054] Example 2: Preparation of nanoporous Au-Cu alloy material.

[0055] In step 1, substrate pretreatment is performed on the foamed Au-Cu alloy.

[0056] The process of this step is the same as Step 1 of Embodiment 1.

[0057] Step 2, electroplating a Cu thin film on the foamed Au-Cu alloy.

[0058] 2.1) In the electrochemical three-electrode test system, the foamed Au-Cu alloy is set as the working electrode, the Ag / AgCl electrode is used as the reference electrode, and the platinum plate electrode is used as the auxiliary electrode, and these three electrodes are placed in the electrolytic cell;

[0059] 2.2) Configure the mixed solution as the electroplating solution, and its component is 0.5M H 2 S0 4 and 0.2M CuS0 4 , pour the configured solution into the electrolytic cell;

[0060] 2.3) In the test system, take the Ag / AgCl electrode as the reference electrode, set the deposition potential to -0.15V, set the deposition time to 5min, and plate copper on the foamed...

Embodiment 3

[0069] Example 3: Preparation of nanoporous Ag-Au-Cu alloy material.

[0070] Step A, performing substrate pretreatment on the foamed Au-Ag alloy.

[0071] The process of this step is the same as Step 1 of Embodiment 1.

[0072] Step B, electroplating a Cu thin film on the foamed Au-Ag alloy substrate.

[0073] B1) In the electrochemical three-electrode test system test system, the Ag-Au alloy substrate is set as the working electrode, the reference electrode is the saturated calomel SCE electrode, and the metal platinum sheet is the auxiliary electrode, and these three electrodes are placed in the electrolytic cell;

[0074] B2) configuration mixed solution is as electroplating liquid, and its component is the CuS of 0.35M. 4 .5H 2 0 and 0.4M of HB0 3 , pour the configured solution into the electrolytic cell;

[0075] B3) In the test system, take the saturated calomel SCE electrode as the reference electrode, set the deposition voltage to -0.9V, set the deposition time t...

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Abstract

The invention discloses a preparation method for 3D nano porous metal materials, and mainly solves the problem that metal or alloy prepared in the prior art is large in aperture size, small in specific surface area, low in porosity and difficult to briquette. The implementation scheme of the preparation method for the 3D nano porous metal materials comprises the steps that 1) a foam metal / alloy substrate is subjected to cleaning and activating pretreatment; 2) a transition metal thin film is electroplated on the pretreated foam metal / alloy substrate; 3) the substrate and the transition metal thin film are subjected to alloy melting; and 4) an electrochemical selective corrosion method is adopted for molten alloy, electroplated transition metal in the alloy is corroded, dealloying is carried out, and preparation for the porous metal materials is completed. According to the the preparation method for the 3D nano porous metal materials, the specific surface area and the porosity of the nano-porous metal materials are increased, the aperture size is controllable, and the nano-porous metal materials can serve as a substrate for growing other porous nano-scale structural materials.

Description

technical field [0001] The invention belongs to the field of material preparation, and in particular relates to a method for preparing a 3D nanoporous metal material, which can be used as a base template to grow other 3D materials. Background technique [0002] Electrochemical deposition is a liquid-phase method used to prepare various polycrystalline thin films and nanostructures. It has successfully prepared metals, ceramic materials, semiconductors, superlattice and superconductor thin films and other materials. Metal electrochemical deposition was applied as early as the early 19th century, and the electroplating process has been around for about a century. At the same time, the electrochemical deposition method is a process of electrolytic coating, and the focus of its research is "cathode electrodeposition". Electrochemical deposition is to pass direct current in an aqueous solution or non-aqueous solution, molten salt, etc. containing metal ions to be plated, so that...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/40C25D5/34C25D3/22C25D5/50C25D3/38C25F3/02C22C1/08
CPCC25D5/40C22C1/08C25D3/22C25D3/38C25D5/34C25D5/505C25F3/02
Inventor 宁静冯欣王东张进成钟瑞霞吕宝琴郝跃
Owner XIDIAN UNIV
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