236 results about "Ag alloy" patented technology

The invention discloses a semiconductor device structure, a preparation method thereof and a chip, and belongs to the technical field of semiconductor devices. The semiconductor device structure comprises a gold-silver alloy bump and a UBM layer, and the UBM layer is composed of a seed layer, a diffusion barrier layer and an adhesion layer or composed of the diffusion barrier layer and the adhesion layer. The diffusion barrier layer is composed of a platinum group element simple substance and / or an alloy containing a platinum group element, preferably composed of platinum, rhodium, iridium or an alloy thereof; the bottom of the gold-silver alloy bump is connected with the seed layer or the diffusion barrier layer, and the adhesion layer is connected with a chip electrode. By improving the UBM layer, the combination reliability of the gold-silver alloy bump and the UBM layer is improved, the obtained semiconductor device structure can pass a high-end chip reliability test, and a flip chip is prepared by replacing gold with gold-silver alloy.

The present invention relates to the technical field of metal composite material processing and preparation, and provides a Cu-Ag alloy wire reinforced with endogenous Ag fiber and a preparation method thereof. The silver content in the copper-silver alloy is 4-8%, the oxygen content is below 3ppm, and the total content of copper and silver is above 99.995%. The preparation method comprises: preparing a copper-silver alloy rod by continuous casting under vacuum; preparing an initial copper-silver alloy wire by solid solution, aging, and drawing of the copper-silver alloy rod; recovery annealing of the initial copper-silver alloy wire; softening annealing of the initial copper-silver alloy wire, micro-wire drawing, and recovery annealing of the micro-wire. The diameter of the obtained copper-silver alloy wire is 0.1-0.3mm, and the diameter of the copper-silver alloy micro-wire is 0.02-0.05mm, and its tensile strength is not less than 1GPa, and its conductivity is not less than 80%IACS. The copper-silver alloy wire prepared by the present invention avoids problems such as uneven organization while reducing the silver content, and significantly improves its electrical conductivity and mechanical properties.

The invention belongs to the technical field of electro-catalysis, and particularly relates to a one-pot preparation method of a high-alloying gold-silver alloy aerogel material and application of the high-alloying gold-silver alloy aerogel material in electro-catalytic reduction of CO2. According to the preparation method, chloroauric acid and silver nitrate are selected as precursors for synthesizing the AuAg alloy aerogel, the AuAg alloy aerogel is prepared through a simple one-pot preparation method, and complex processes such as ultrafiltration centrifugal purification and concentration and heat treatment are not needed. Compared with an existing two-step method, the preparation process is complex, time and labor are consumed, and heat treatment is needed. However, according to the one-pot preparation method used in the invention, the high-alloying AuAg alloy aerogel can be obtained only by simply feeding, stirring and standing at room temperature. Moreover, the alloying degree of the obtained AuAg aerogel is higher, higher CO selectivity is shown in CO2RR application, and compared with AuAg alloy aerogel obtained through an existing two-step method, the CO Faraday efficiency of the AuAg aerogel is improved by about 37.1%.

Provided are: a method for manufacturing a Cu-Ag alloy wire material, the method being characterized by including the following steps in the stated order; and a Cu-Ag alloy wire material manufactured by the method. Step 1: a metal rod is obtained by melting metal raw materials that have been blended so that, excluding inevitable impurities, the composition is 10.0 wt% to 30.0 wt% Ag and the remainder Cu. Step 2 to step 4: cold drawing and heat treatment are repeated three times while gradually increasing the rate of cross-sectional reduction between before and after processing. Step 5 to step 7: the cold drawing and the heat treatment are repeated three times so that the rate of cross-sectional reduction between before and after processing becomes larger than that in step 2 to step 4. Step 8: a Cu-Ag alloy wire material having a diameter of 0.1 mm or less is obtained by subjecting the metal rod to cold drawing such that the rate of cross-sectional reduction is 99.0% to 99.9999%.

The invention discloses a copper-silver alloy and a preparation method thereof.The preparation method comprises the following steps that silver alloying is conducted, specifically, a silver raw material and rare earth elements are added into a vacuum induction furnace to be mixed, and a silver alloy melt is obtained after heating and melting are conducted in the vacuum atmosphere; copper alloying is conducted, specifically, electrolytic copper is added into a non-vacuum induction furnace to be smelted, phosphorus and rare earth elements are added for alloying after heating melting, and a copper alloy melt is obtained; horizontal continuous casting: respectively carrying out horizontal continuous casting on the silver alloy melt and the copper alloy melt to obtain a silver alloy plate and a copper alloy plate; the multiple layers of silver alloy plates and the multiple layers of copper alloy plates are alternately stacked in a silver-copper-silver-... mode and placed in hot extrusion equipment to be subjected to hot extrusion, and a composite plate is formed; and cold drawing is conducted, specifically, the composite board is subjected to cold drawing to obtain the copper-silver alloy, the copper-silver alloy can be used as an electric contact material, the preparation method is low in cost, and the prepared copper-silver alloy has high conductivity, high hardness and arc erosion resistance.

The invention discloses an enhanced Raman scattering substrate for chiral molecule detection and a preparation method, and relates to the technical field of spectral analysis and chiral recognition. Chiral cysteine is induced at the core of the gold nanorod to form a spiral chiral gold-silver alloy layer and then wraps the zirconium-based metal organic framework, the synthesized chiral gold rod (at) MOF material has excellent LPSR effect and chiral electromagnetic field, and the MOF layer on the surface can well adsorb molecules to be detected to enter a plasma hot spot area. The Raman substrate is excellent in SERS performance. According to the composite material, through the dual effects of molecular enrichment and electromagnetic enhancement, enantiomers are distinguished directly through SERS intensity, and labeling or catalytic conversion is not needed.

Active solder paste compositions for cladding ceramic with copper, methods for cladding ceramic with copper, and copper-clad ceramic materials. Active solder paste compositions comprise, on the basis of the total weight of the active solder paste composition, 1-20 wt % of a first metal powder and 75-94 wt % of a second metal powder, with the balance being a flux, wherein the first metal powder contains titanium hydride and the second metal powder contains a copper-phosphorus-silver alloy. The active solder paste compositions can not only decrease the silver content, but can also reduce the welding temperature. Moreover, the connection strength of Ti and Cu is further enhanced, and the welding strength is improved, such that the material is less prone to segregation.

The invention provides a preparation method of a graphdiyne-loaded bimetallic nano material for VOCs adsorption. The preparation method comprises the following steps: S1, synthesizing a large-area and low-defect graphdiyne film by using an in-situ interface growth method; and S2, loading bimetallic nanoparticles on the surface of graphdiyne by adopting a co-impregnation-step reduction method. Meanwhile, the invention provides the graphdiyne-loaded bimetallic nano-material for VOCs adsorption, the graphdiyne-loaded bimetallic nano-material is prepared by adopting the preparation method, the graphdiyne-loaded bimetallic nano-material comprises Cu-Ag alloy nano-particles and Cu + active sites, Cu + accounts for 90% or above of the total copper content, and the nano-particles are anchored to the graphdiyne ring through a Cu-O-C equivalent key; in the aspects of stability and regeneration performance, after 20 times of adsorption-desorption cycle tests, the material capacity retention rate is gt; 90%.

The present invention discloses a gold-silver alloy bump for replacing a pure gold bump in flip-chip packaging and a preparation method thereof, belonging to the technical field of electroplating gold-silver alloys. The gold-silver alloy bump is composed of two layers of gold-silver alloy layers, namely a connection layer and a protective layer; the content of gold in the connection layer is 20-50 wt%; the thickness of the protective layer is much smaller than that of the connection layer, and the content of gold is above 60 wt%; the average grain size of the grains in the gold-silver alloy layer is 0.10-0.30 μm. The gold-silver alloy bump provided by the present invention has hardness, roughness and anti-sulfuration performance comparable to those of a pure gold bump, can meet the technical requirements of flip-chip packaging, and can greatly reduce costs at the same time. The method for the gold-silver alloy bump provided by the present invention can obtain the double-layer gold-silver alloy bump of the present invention by only changing the current density through the same equipment and plating solution, simplifies the preparation process, improves the production efficiency, and reduces the production cost.

The invention relates to the technical field of silver alloy, in particular to a method for effectively inhibiting migration of silver ions in silver alloy, which comprises the following steps: step 1, putting electrolytic silver with the purity of more than 99.99% into a smelting furnace for smelting, covering by using a covering agent, and obtaining molten silver after smelting; 2, modified silicon dioxide is added into the silver melt in the step 1, and silver alloy melt is obtained; 3, the smelting furnace is vacuumized, then mixed gas of hydrogen and nitrogen is introduced into the smelting furnace, and heat preservation is conducted for 20-60 min; and 4, the silver alloy melt is subjected to converter casting after standing. According to the method for effectively inhibiting migration of the silver ions in the silver alloy, grains can be refined through indium in the alloy, the grain boundary structure can be improved, and migration of the silver ions along the grain boundary is inhibited; indium on the surface of the alloy can form a compact indium oxide film on the surface of the silver alloy to isolate direct contact of external moisture, electrolyte and silver, so that electrochemical dissolution and migration of silver ions are reduced.

The invention discloses a contact, a reed structure and an electromagnetic relay, a contact surface of the contact comprises a first contact area and a second contact area, and the first contact area comprises an initial contact position when the contact is closed; the second contact area comprises a final contact position when the contact is closed and is used for conducting current; the first contact area and the second contact area are different areas, the first contact area is made of a first silver alloy, the second contact area is made of a second silver alloy, and the first silver alloy and the second silver alloy are different silver alloy materials. The silver alloy design of the contact is optimized, the limitation that in the prior art, a single silver alloy material cannot meet multiple functional requirements at the same time is overcome, and the contact can achieve diversified functions, so that the comprehensive performance of the contact can be remarkably improved, the capacity of the contact for adapting to complex working conditions can be improved, and the application range can be expanded.

The invention discloses an anti-corrosion process for chemically plating nickel and gold on a gold-silver alloy or pure silver bump, which is characterized by comprising the following steps of: forming a metal bump structure on the surface of a substrate; performing patterning processing on the metal bump structure to form a metal bump of a target pattern; performing pretreatment on the metal bump, wherein the pretreatment comprises acid pickling, micro-etching, dilute nitric acid cleaning and deionized water rinsing; performing zinc replacement treatment on the pretreated metal bump for at least two times to activate the surface; the activated metal bump is placed in a chemical nickel plating solution for reaction, so that a continuous nickel metal layer is formed on the surface of the metal bump; after the nickel layer is formed, the nickel layer is further placed in a chemical gold plating solution for reaction, and a continuous metal gold layer is formed on the surface of the nickel layer; and rinsing and drying the gold-plated structure to obtain the metal bump structure with the anti-corrosion performance.

A metallic sealing tape has a metallic layer and a layer of a pressure-sensitive adhesive disposed on one side of the metallic layer. The metallic layer is comprised of a brazing alloy, and may, e.g., comprise a thin foil of the brazing alloy. The brazing alloy may be, e.g., a copper-phosphorus alloy or a copper-phosphorus-silver alloy. A method for using the metallic sealing tape includes sealing a joint between two pipes with the metallic sealing tape and brazing the joint without removing the metallic sealing tape. The brazing may include heating the metallic sealing tape and may also include adding additional filler metal to the joint.

The invention provides a metallographic corrosion method of a Ti-Ag alloy and the Ti-Ag alloy, and relates to the technical field of metallographic detection. The metallographic corrosion method comprises the following steps: machining Ti-Ag alloy so as to form a microscopic structure observation plane on the Ti-Ag alloy; the microscopic structure observation plane is ground on a metallographic phase pre-grinding machine, and the ground microscopic structure observation plane is placed on a polishing machine to be subjected to mechanical polishing; etching the mechanically polished microscopic structure observation plane by using an etchant solution to obtain a microscopic structure observation plane to be observed; wherein the corrosion solution comprises ammonium hydrogen fluoride, hydrofluoric acid and water, and the ratio of the ammonium hydrogen fluoride to the hydrofluoric acid to the water is (5-10) g: (10-20) mL: 100 mL. According to the method, the metallographic corrosion effect of the Ti-Ag alloy can be improved.

The invention discloses an Ag-Cu-Al alloy thin film and a preparation method thereof. By atomic content percentage, Cu is 4-28%, Al is 3-18.3%, and the rest is Ag. The Ag-Cu-Al alloy thin film is prepared by magnetron sputtering co-sputtering. The obtained thin film has uniform composition and dense structure. In magnetron sputtering co-sputtering, the content of Cu and Al in the Ag-Cu-Al alloy thin film is adjusted by controlling the deposition power, so that the microstructure of the alloy thin film forms a nanocrystalline, ultrafine nanocrystalline or crystal-amorphous dual-phase nanostructure. The alloying of Cu and Al can effectively improve the mechanical properties of the Ag alloy thin film, and its strengthening effect increases with the increase of the content of Cu and Al.

The present invention belongs to the field of target material technology, and specifically discloses a silver alloy target material, its preparation method and application. The raw material components of the silver alloy target material include, by weight percentage: Ag 99.25-99.93%, Ce 0.05-0.55%, aluminum-copper alloy 0.01-0.05%, and manganese-copper alloy 0.01-0.15%. On the one hand, the present invention performs microalloying by adding a certain amount of Ce, Al-Cu alloy and Mn-Cu alloy to Ag; on the other hand, the microstructure morphology is regulated by combining forging and hot rolling treatments during the manufacturing process. Ultimately, without reducing the reflectivity, a significant improvement in anti-sulfurization and oxidation performance is achieved, and the target material has high hardness and is easy to process. The silver alloy target material starts to turn black and sulfurized in 8.0-11.2 hours, starts to turn black and oxidized in 7.5-10.6 hours, and has a Vickers hardness of 97-138.

A fusible link element (10; 15; 25; 35) comprising a metal composite material in which a first fusible metal (11; 21; 31) and a second fusible metal (12; 22; 32) are layered on top of each other, wherein the second fusible metal (12; 22; 32) has a lower melting temperature than the first fusible metal (11; 21; 31), characterized by the fact that the first fusible metal (11; 21; 31) is a Sn-Ag alloy and the Sn-Ag alloy contains at least 20 wt% and at most 30 wt% Ag, and the second fusible metal (12; 22; 32) is a Sn-Bi alloy and the Sn-Bi alloy contains at least 40 wt% and at most 70 wt% Bi, wherein at a common working temperature at least part of a component of the second fusible metal (12; 22; 32) is melted and part of a component of the first fusible metal (11; 21; 31) is melted, and where, at the common working temperature, the difference between a liquidus temperature and a solidus temperature of the first fusible metal (11; 21; 31) and the second fusible metal (12; 22; 32) is reduced by a shift in the equilibrium of Sn between the first fusible metal (11; 21; 31) and the second fusible metal (12; 22; 32) and by a mutual diffusion of Ag and Bi between the first fusible metal (11; 21; 31) and the second fusible metal (12; 22; 32).

An aqueous composition including (a) metal ions including tin ions and silver ions and (b) at least one complexing agent of formula C11RC12-XC11-RC11   (C11)and their salts,whereXC11 is selected from(a) a divalent 5 or 6 membered aromatic N-heterocyclic group;(b) a divalent 6 membered aromatic carbocyclic group; and(c) a divalent 5 or 6 membered aliphatic N-heterocyclic group including one N atom and optionally a second heteroatom selected from N and O; all of which may be unsubstituted or substituted by one or more OH or one or more RC14;RC11 is selected from ; andRC12 is selected from RC11, XC11-RC11, H, OH, NRC142, C1 to C10 alkyl, and C1 to C10 alkoxy

The present application discloses a copper-silver alloy and a preparation method thereof, which comprises the following steps: silver alloying: adding a silver raw material and a rare earth element into a vacuum induction furnace for mixing, heating and melting in a vacuum atmosphere to obtain a silver alloy melt; copper alloying: adding electrolytic copper into a non-vacuum induction furnace for smelting, heating and melting, and then adding phosphorus and rare earth elements for alloying to obtain a copper alloy melt; horizontal continuous casting: horizontally continuous casting the above-mentioned silver alloy melt and copper alloy melt respectively to obtain silver and copper alloy plates; hot extrusion molding: alternately stacking multiple layers of silver alloy plates and copper alloy plates in a "silver-copper-silver-..." manner, placing them in a hot extrusion device for hot extrusion to form a composite plate; cold drawing: cold drawing the composite plate into a material to obtain a copper-silver alloy, which can be used as an electrical contact material. The preparation method is low in cost, and the obtained copper-silver alloy has high conductivity, high hardness and resistance to arc erosion.

The invention discloses a metal conductive film for EC, a method, an assembly and application, and the conductive film comprises a first hardening layer, a flexible substrate, a second hardening layer, a bottom sealing cover layer, a first silver function layer, an intermediate dielectric layer, a second silver function layer, a first top sealing cover layer and an external sealing cover layer which are sequentially arranged. The total thickness of the first silver functional layer and the second silver functional layer is 14-18nm, d2-d1 < = 4nm, d1 is the thickness of the first silver functional layer, and d2 is the thickness of the second silver functional layer. Through the optical design of the film layer, the high light transmittance of the product is kept, and the light transmittance of the visible light band is larger than or equal to 83%. Meanwhile, by means of the technological means, Ag alloy is used, special sealing cover layer gold is added, and the durability and reliability of the product can be greatly improved.

The invention discloses a composite solder ball, a preparation method and a stacked packaging structure, and the composite solder ball comprises a composite inner core which is composed of a continuous phase matrix and a strengthening phase, the strengthening phase accounts for 15-30% of the total volume of the inner core, the compression modulus of the composite inner core is larger than or equal to 3 GPa, and the thermal expansion coefficient of the composite inner core is smaller than or equal to 55 ppm / DEG C; the polymer core is coated with the metal transition layer; and the tin-silver alloy outer layer covers the metal transition layer. The composite inner core is composed of a continuous phase polymer matrix and a strengthening phase fiber network, high-temperature compression resistance and low thermal expansion characteristics are achieved through a specific volume ratio and a specific mass ratio, the solid-state rigidity characteristic is kept in a welding high-temperature interval, mechanical loads are directly borne, the interlayer height collapse risk is thoroughly eliminated, and the welding quality is improved. The metal transition layer forms a mechanical interlocking combination interface with the inner core, and the tin-silver alloy outer layer provides weldability and an electric connection function, so that double-function technology fusion that the composite solder ball can play a supporting role and also can play a welding role is realized.

The application provides a superfine nanocrystalline silver alloy and a preparation method thereof, and belongs to the technical field of superfine crystal preparation.The superfine nanocrystalline silver alloy is prepared by the following steps: firstly, rolling the silver alloy; secondly, breaking the original grains in the silver alloy by rolling; thirdly, transforming the broken grains into equiaxed grains by annealing; fourthly, cross-extruding under ultralow temperature to inhibit recovery recrystallization; fifthly, breaking the equiaxed grains into superfine equiaxed grains by cross-extruding; sixthly, further refining the grains by ultralow-temperature rolling; and finally, recrystallizing the broken grains by annealing after rolling, so that the superfine nanocrystalline silver alloy with nanometer grain size is obtained; the superfine nanocrystalline silver alloy has uniform microstructure, obvious strength improvement, good conductivity and ductility, and the preparation method is simple, easy to popularize in large scale, and has wide application prospect in industry.

The present invention relates to the technical field of semiconductor devices, and disclosed are a semiconductor device structure, a preparation method therefor, and a corresponding chip. The semiconductor device structure comprises a gold-silver alloy bump and an UBM layer, the UBM layer being composed of a seed layer and an adhesion layer, a bottom portion of the gold-silver alloy bump being connected to the seed layer, the adhesion layer being connected to a chip electrode, and a difference in thermal expansion coefficients between the gold-silver alloy bump and the adhesion layer being below 9 ppm / K. The technical solution provided in the present invention can solve the technical problem that gold-silver alloy bumps and existing UBM layers cannot pass high-low temperature cycle reliability testing. The semiconductor device structure and the corresponding chip obtained by the technical solution of the present invention can pass various reliability tests, thus it is feasible to replace a pure gold bump with a gold-silver alloy, thereby greatly reducing production costs of a flip-chip.

The high-strength high-conductivity copper-silver alloy disclosed by the application has the following weight percentage composition: 0.5-12% of Ag, 0.1-1.5% of B, 0.1-2.0% of Mn, the balance of Cu and inevitable impurities. The application simultaneously adds Mn and B elements in the Cu-Ag alloy to form a high-melting-point B-Mn compound at high temperature, thereby improving the strength of the alloy, having little influence on the electrical conductivity, and due to the combined action of the dispersion strengthening of the high-melting-point hard B-Mn compound and the work hardening of the Ag fiber phase and Cu matrix, the alloy has excellent comprehensive properties such as thermal stability, tensile strength, hardness and electrical conductivity. The tensile strength of the alloy is above 600 MPa, the electrical conductivity is above 65% IACS, the Vickers hardness is above 200 HV, and after being kept at 180 DEG C for 24 hours, the reduction rate of the tensile strength is not more than 8%, and the alloy can be applied to the power, electronic, communication and electromagnetic conversion industries.

The invention discloses a preparation method of an in-situ Ag NWs fiber reinforced Cu-Ag alloy wire. The method comprises the following steps: 1, synthesizing Ag NWs in situ based on a liquid phase polyol method; 2, preparing a pre-dispersed Ag NWs fiber solution; 3, Cu powder is poured into the pre-dispersed Ag NWs fiber solution to be stirred and dried; 4, performing heat treatment to obtain Cu / Ag NWs composite powder; 5, performing spark plasma sintering to obtain a Cu / Ag NWs composite bar; and sixthly, cold drawing machining is conducted after tubing. Through in-situ synthesis of Ag NWs, mixing, sintering and drawing deformation processes, a microstructure of a large-length-diameter-ratio Ag NWs fiber reinforced submicron copper matrix is constructed from the angles of low Ag content, avoidance of grain growth and reduction of electron scattering, and a Cu-Ag alloy wire with good strength and conductivity matching is obtained under the low Ag content; the magnet is suitable for the fields of electronic communication, power transmission, high-field pulse magnets and the like.

The invention provides a preparation method and application of a silver alloy target material. According to the preparation method disclosed by the invention, a powder metallurgy process is adopted, the mixed powder of the silver powder and the alloy elements is subjected to alloy smelting and water atomization powder preparation, the compact metal ingot is obtained through compression molding and sintering, and the sintered metal ingot is subjected to calendering processing, so that the silver and the alloy target material of the silver with the required size can be obtained. Compared with the silver and alloy smelting ingot forming process, the powder process can efficiently obtain the uniform and fine-grain silver metal target blank, the traditional multi-pass large-deformation forging process is avoided, and alloy elements are evenly distributed. The invention further provides application of the prepared silver alloy target material in preparation of semiconductor devices.

The invention relates to the technical field of new materials, in particular to an Al-Cu-Li-Mg-Ag-Zn-Mn-Zr series high-strength and high-heat-resistance aluminum lithium alloy and a preparation method thereof. According to the invention, Al-Cu-Li-Mg-Ag-Zn-Mn-Zr is used as an alloy system, a certain amount of Cu, Li, Mg and Ag alloy elements are added to obtain a core-shell structure strengthening phase T1-AgMg phase which is stable at a high temperature, a certain amount of Zn element is added to improve the intrinsic stability of the T1 phase, and a certain amount of Mn and Zr alloy elements are added to obtain strengthening phases of a T phase and an Al3Zr phase. The novel high-strength and high-heat-resistance aluminum-lithium alloy with excellent tensile property at room temperature, 250 DEG C and 300 DEG C is obtained by combining proper preparation processes such as casting, homogenization, thermal deformation, solid solution aging and the like.

The instrument (10) according to the invention has an electrode (11) which is arranged in a gas-guiding lumen (16) and is held centered. The electrode (11) has an electrode body (22) which is made of a thermally stable material, such as hard metal, tungsten, steel, stainless steel, etc. The electrode (11) is equipped with a coating (23) which is made of a low-melting material, such as silver, a silver alloy or other low-melting metals. An adhesive layer (24), in particular a gold layer, can be provided between the coating (23) and the electrode body (22). This adhesive layer can contribute to the retraction of the coating (23) during the first commissioning and thus during the formation of the desired shape of the electrode (11) for operation.

A preparation method of a high-strength and high-conductivity Cu-Y2O3-Ag composite material, which relates to the field of preparation of high-strength and high-conductivity copper alloys. First, a copper-yttrium precursor powder is prepared from a metal yttrium salt and electrolytic copper powder, and then the copper-yttrium precursor powder and Cu-Ag alloy powder are prepared through a mechanical alloying process and reduction combined with field-assisted sintering. In the present invention, the addition of Ag and Y2O3 realizes the high strength and high conductivity of copper alloys through the combined action of the solid solution strengthening mechanism and the dispersion strengthening mechanism. The present invention uses mechanical alloying technology to achieve the uniform distribution of Y2O3 and Ag atoms in the copper matrix at the atomic level. After Ag atoms enter the copper lattice, a small amount of Ag atoms can improve the conductivity of the material with less Y2O3, and at the same time greatly increase the strength of the copper alloy, achieving the effect of solid solution strengthening.

To provide a terminal material and an electrical connection terminal which have an Ag coating layer having improved wear resistance due to addition of an additive and in which corrosion is suppressed.SOLUTION: A terminal material 1 includes: a base material 11; an intermediate layer 14 that is configured from Ag or an Ag alloy, the intermediate layer covering a surface of the base material 11; and a surface layer 15 that contains Ag and at least one of a sulfur-containing organic compound and a carbon material, the surface layer being in contact with the surface of the intermediate layer 14 and covering the surface of the intermediate layer 14. The purity of Ag in the intermediate layer 14 is higher than the purity of Ag in the surface layer 15, and the thickness of the intermediate layer 14 is 0.4 μm or more and 3.0 μm or less. Also, an electrical connection terminal is configured to contain the terminal material 1 and is such that, at an electrical contact part in contact with a counterpart electroconductive member, at least the intermediate layer 14 and the surface layer 15 are formed on the surface of the base material 11.SELECTED DRAWING: Figure 1