Copper-silver alloy conductor size and its preparing method

Abstract

This invention provides Cu-Ag alloy conductor slurry and its manufacturing method including: preparing nm particles of Cu-Ag alloy, matching conductor slurry and sintering the slurry, in which, the nm particles are prepared under the mixed atmosphere of H and Ar with the DC arc plasma method and the preparation for the slurry includes: fully mixing terpinyl, EC and absolute alcohol then adding nm particles and fully beating them up to be vibrated by supersonic waves then to be added with glass power to beat them up again and vibrate them with supersonic waves to get the conductor slurry. The sinter temperature is bellow 220deg.C under 1.33Pa. Advantage: the sinter temperature is low not needing protection gas while sintering, the conductive stability is higher than Cu power slurry and ití»s possible to replace Au, Ag and Pd slurry.

Description

Technical field:

[0001] The invention relates to the fields of nanotechnology and microelectronics, in particular to a thick-film conductor paste with copper-silver alloy nanoparticles as the main raw material and a preparation method thereof. Background technique:

[0002] Conductive paste is widely used in the electronics industry, and the commonly used conductive materials in the conductive paste include gold, silver, palladium, nickel, copper and other metal powders and carbon powders. Gold, silver, and palladium conductor pastes have good conductivity, but are expensive, especially silver pastes are prone to ion migration in an external electric field, which affects insulation. The price of carbon powder paste is cheap, but the conductivity is poorer than other materials. Printed circuit boards that require high conductivity of nickel powder paste. The conductivity of copper powder paste is good and the price is cheap, but its conductivity is easily affected by the en...