Gold and silver alloy bonding wire with gold-plated layer on surface and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 辽宁凯立尔电子科技有限公司
- Publication Date
- 2013-12-25
Smart Images
Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention belongs to the technical field of metal bonding wires for microelectronic packaging, and in particular relates to a gold-silver alloy bonding wire with a gold-plated layer on the surface and a preparation method thereof. Background technique
[0002] Microelectronic wire bonding is a kind of microelectronic wire bonding that can be tightly welded to the substrate pad by using heat, pressure, and ultrasonic energy to realize the electrical interconnection between the chip and the substrate and the information exchange between the chips. Under ideally controlled conditions, electron sharing or interdiffusion of atoms occurs between the lead and the substrate, enabling atomic-scale bonding between the two metals.
[0003] At present, in LDE, COB and multi-pin integrated circuit packages, gold wires and pure silver alloy gold-plated wires are mostly used for bonding wires. Due to the high price of the bonding gold wire, the packaging cost in...