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75results about How to "Sufficient transparency" patented technology

Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof

A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.
Owner:OPTOPAC

Method of homo- or co-polymerization of alpha-olefin

The present invention relates to a method of homo- or co-polymerization of alpha-olefin by means of using a catalyst system which comprises the following components: (1) a solid complex titanium catalyst produced by means of a production method comprising the following steps: (a) preparing a magnesium compound solution by dissolving a magnesium halide compound and a compound of Group IIIA of the Periodical Table in a solvent of mixture of cyclic ester, one or more types of alcohol, a phosphorus compound, and an organic silane; (b) precipitating the solid particles by reacting said magnesium compound solution with a transitional metal compound, a silicon compound, a tin compound, or the mixture thereof; and (c) reacting said precipitated solid particles with a titanium compound and electron donors; (2) an organometallic compound of metal of Group IIIA of the Periodical Table; and (3) external electron donors comprising three or more types of organo-silicon compounds, wherein the melt flow rates of the homopolymers obtained from polymerization by individually using said organo-silicon compounds under the same polymerization conditions are 5 or less, 5~20, and 20 or higher, respectively. According to the present invention, it has an advantage of obtaining polymers of broad molecular weight distribution with high hydrogen reactivity and melt flow rates while maintaining high stereoregularity and yields for olefin homo- or co-polymers during homo- or co-polymerization of alpha-olefin having three or more carbon atoms.
Owner:SAMSUNG GENERAL CHEMICALS CO. LTD

Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof

A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.
Owner:OPTOPAC

Method of homo- or co-polymerization of alpha-olefin

The present invention relates to a method of homo- or co-polymerization of alpha-olefin by means of using a catalyst system which comprises the following components: (1) a solid complex titanium catalyst produced by means of a production method comprising the following steps: (a) preparing a magnesium compound solution by dissolving a magnesium halide compound and a compound of Group IIIA of the Periodical Table in a solvent of mixture of cyclic ester, one or more types of alcohol, a phosphorus compound, and an organic silane; (b) precipitating the solid particles by reacting said magnesium compound solution with a transitional metal compound, a silicon compound, a tin compound, or the mixture thereof, and (c) reacting said precipitated solid particles with a titanium compound and electron donors; (2) an organometallic compound of metal of Group IIIA of the Periodical Table; and (3) external electron donors comprising three or more types of organo-silicon compounds, wherein the melt flow rates of the homopolymers obtained from polymerization by individually using said organo-silicon compounds under the same polymerization conditions are 5 or less. 5~20, and 20 or higher, respectively. According to the present invention, it has an advantage of obtaining polymers of broad molecular weight distribution with high hydrogen reactivity and melt flow rates while maintaining high stereoregularity and yields for olefin homo- or co-polymers during homo- or co-polymerization of alpha olefin having three or more carbon atoms.
Owner:SAMSUNG GENERAL CHEMICALS CO. LTD

Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof

A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.
Owner:OPTOPAC
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