Preparation method for tantalum oxide film with high laser damage threshold under high-temperature environment
A technology of laser damage threshold and high temperature environment, which is applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problem that laser thin film components cannot withstand high temperature for a long time, and achieve improved limitations and good stability , Improve the effect of easy moisture absorption
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Embodiment 1
[0019] Example 1: The BK7 glass substrate was soaked in petroleum ether, ultrasonically cleaned for 15 minutes, then rinsed with deionized water, and finally dried with high-purity nitrogen. A tantalum oxide film was deposited on the cleaned BK7 substrate by dual ion beam sputtering, and the vacuum degree of the background was 2×10 -4 Pa, the baking temperature is 80°C, and the oxygenation pressure is 5×10 -2 Pa, the argon flow of the sputtering source is 15mL / min, the argon flow of the RF neutralizer is 5mL / min, the flow ratio of argon and oxygen in the auxiliary source is 0.5, and the tantalum target is cleaned for 5 minutes before sputtering , and then plated thin film. The standard damage threshold of the prepared tantalum oxide film was tested at room temperature in a 1-on-1 manner, according to the ISO11254-1 standard, and the energy density at zero damage probability was used as the laser damage threshold of the film. The measured 1064nm The threshold under laser is 1...
Embodiment 2
[0022] Example 2: Soak the quartz substrate in a mixture of petroleum ether and acetone with a volume ratio of 1:1, ultrasonically clean it for 20 minutes, then rinse it with deionized water, and finally dry it with high-purity nitrogen. The tantalum oxide film was plated on the cleaned quartz substrate by double ion beam sputtering, and the vacuum degree of the background was 2.4×10 -4 Pa, the baking temperature is 120°C, and the oxygenation pressure is 8×10 -2 Pa, the argon flow rate of the sputtering source is 20mL / min, the argon flow rate of the RF neutralizer is 4mL / min, the flow ratio of argon gas and oxygen gas in the auxiliary source is 0.4, and the tantalum target is cleaned for 5 minutes before sputtering , and then plated thin film. The standard damage threshold of the prepared tantalum oxide film was tested at room temperature in a 1-on-1 manner, according to the ISO11254-1 standard, and the energy density at zero damage probability was used as the laser damage th...
Embodiment 3
[0023] Example 3: Soak the quartz substrate in a mixture of acetone and ethanol with a volume ratio of 8:1, ultrasonically clean it for 30 minutes, then rinse it with deionized water, and finally dry it with high-purity nitrogen. A tantalum oxide film was deposited on a cleaned quartz substrate by dual ion beam sputtering, and the background vacuum was 1×10 -5 Pa, the baking temperature is 150°C, and the oxygenation pressure is 6×10 -2 Pa, the argon flow of the sputtering source is 80mL / min, the argon flow of the radio frequency neutralizer is 25mL / min, the flow ratio of argon and oxygen in the auxiliary source is 0.1, and the tantalum target is cleaned for 5 minutes before sputtering , and then plated thin film. The standard damage threshold of the prepared tantalum oxide film was tested at room temperature in a 1-on-1 manner, according to the ISO11254-1 standard, and the energy density at zero damage probability was used as the laser damage threshold of the film. The measur...
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