Preparation method for tantalum oxide film with high laser damage threshold under high-temperature environment
A technology of laser damage threshold and high temperature environment, applied in the direction of ion implantation plating, metal material coating process, coating, etc. The effect of good stability
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Embodiment 1
[0019] Example 1: The BK7 glass substrate was soaked in petroleum ether, ultrasonically cleaned for 15 minutes, then rinsed with deionized water, and finally dried with high-purity nitrogen. A tantalum oxide film was deposited on the cleaned BK7 substrate by dual ion beam sputtering, and the vacuum degree of the background was 2×10 -4 Pa, the baking temperature is 80°C, and the oxygenation pressure is 5×10 -2 Pa, the argon flow of the sputtering source is 15mL / min, the argon flow of the RF neutralizer is 5mL / min, the flow ratio of argon and oxygen in the auxiliary source is 0.5, and the tantalum target is cleaned for 5 minutes before sputtering , and then plated thin film. The standard damage threshold of the prepared tantalum oxide film was tested at room temperature in a 1-on-1 manner, according to the ISO11254-1 standard, and the energy density at zero damage probability was used as the laser damage threshold of the film. The measured 1064nm The threshold under laser is 1...
Embodiment 2
[0022] Example 2: Soak the quartz substrate in a mixture of petroleum ether and acetone with a volume ratio of 1:1, ultrasonically clean it for 20 minutes, then rinse it with deionized water, and finally dry it with high-purity nitrogen. The tantalum oxide film was plated on the cleaned quartz substrate by double ion beam sputtering, and the vacuum degree of the background was 2.4×10 -4 Pa, the baking temperature is 120°C, and the oxygenation pressure is 8×10 -2 Pa, the argon flow rate of the sputtering source is 20mL / min, the argon flow rate of the RF neutralizer is 4mL / min, the flow ratio of argon gas and oxygen gas in the auxiliary source is 0.4, and the tantalum target is cleaned for 5 minutes before sputtering , and then plated thin film. The standard damage threshold of the prepared tantalum oxide film was tested at room temperature in a 1-on-1 manner, according to the ISO11254-1 standard, and the energy density at zero damage probability was used as the laser damage th...
Embodiment 3
[0023] Example 3: Soak the quartz substrate in a mixture of acetone and ethanol with a volume ratio of 8:1, ultrasonically clean it for 30 minutes, then rinse it with deionized water, and finally dry it with high-purity nitrogen. A tantalum oxide film was deposited on a cleaned quartz substrate by dual ion beam sputtering, and the background vacuum was 1×10 -5 Pa, the baking temperature is 150°C, and the oxygenation pressure is 6×10 -2 Pa, the argon flow of the sputtering source is 80mL / min, the argon flow of the radio frequency neutralizer is 25mL / min, the flow ratio of argon and oxygen in the auxiliary source is 0.1, and the tantalum target is cleaned for 5 minutes before sputtering , and then plated thin film. The standard damage threshold of the prepared tantalum oxide film was tested at room temperature in a 1-on-1 manner, according to the ISO11254-1 standard, and the energy density at zero damage probability was used as the laser damage threshold of the film. The measur...
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