Modeling and packaging method for process tolerance and electric performance coupling characteristics in radio frequency integration
A technology of radio frequency integration and packaging methods, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the limitation of the application range of modeling algorithms, cannot effectively apply process tolerance electrical performance, and integrated manufacturing links cannot provide process Issues such as IP modeling and library building methods can reduce the difficulty of model compilation and development, facilitate application, update and maintenance, and shorten the design verification cycle.
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[0040] The design concept of the present invention is: the present invention starts with the development and application of the process IP model, and proposes a method that can be compatible with the existing modeling algorithm, and uses electromagnetic simulation combined with test data to quickly and accurately realize model development, integrated packaging and update maintenance. The integrated solution is especially suitable for modeling and simulation of process tolerance and electrical performance coupling characteristics in RF microwave integration. The present invention processes and models the process tolerance data in integrated manufacturing, and truly feeds back the manufacturing process level to the designer in the form of a standard IP library for their calling, and furthermore, the system-level simulation can cover the process tolerance Analysis and simulation can quickly and effectively verify the influence of process manufacturing level on system performance, ...
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