Modeling and packaging method for process tolerance and electric performance coupling characteristics in radio frequency integration

A technology of radio frequency integration and packaging methods, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the limitation of the application range of modeling algorithms, cannot effectively apply process tolerance electrical performance, and integrated manufacturing links cannot provide process Issues such as IP modeling and library building methods can reduce the difficulty of model compilation and development, facilitate application, update and maintenance, and shorten the design verification cycle.

Active Publication Date: 2018-07-31
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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AI Technical Summary

Problems solved by technology

At present, the process fluctuation tolerance range in this field is relatively large. If the influence of process tolerance in the system integration process is ignored in the simulation design, there will often be a large difference between the expected performance of the product and the final performance.
Due to the complex relationship between the electrical properties of RF transmission structures and integrated process parameters, there is currently a lack of a method that can quickly and effectively model process tolerances, and there are differences in process levels among manufacturers, so it is difficult to provide standard A general-purpose process IP model that can reflect the manufacturing level, and the need for rapid response in the development of RF and microwave products also makes the role of process IP gradually prominent
[0006] In addition, the radio frequency transmission structure is developing rapidly and has a wide variety, and the model structure and modeling methods involved also need to be researched...

Method used

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  • Modeling and packaging method for process tolerance and electric performance coupling characteristics in radio frequency integration
  • Modeling and packaging method for process tolerance and electric performance coupling characteristics in radio frequency integration
  • Modeling and packaging method for process tolerance and electric performance coupling characteristics in radio frequency integration

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Embodiment Construction

[0040] The design concept of the present invention is: the present invention starts with the development and application of the process IP model, and proposes a method that can be compatible with the existing modeling algorithm, and uses electromagnetic simulation combined with test data to quickly and accurately realize model development, integrated packaging and update maintenance. The integrated solution is especially suitable for modeling and simulation of process tolerance and electrical performance coupling characteristics in RF microwave integration. The present invention processes and models the process tolerance data in integrated manufacturing, and truly feeds back the manufacturing process level to the designer in the form of a standard IP library for their calling, and furthermore, the system-level simulation can cover the process tolerance Analysis and simulation can quickly and effectively verify the influence of process manufacturing level on system performance, ...

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Abstract

The invention provides a modeling and packaging method for process tolerance and electric performance coupling characteristics in radio frequency integration. The method starts from development and application of process IP models to put forward an integrated scheme which is compatible with existing modeling algorithms and rapidly and correctly realizes model development, integrated packaging andupdating maintenance by utilizing data of electromagnetic simulation combined test, and the integrated scheme is particularly suitable for modeling and simulation of process tolerance and electric performance coupling characteristics in radio frequency microwave integration. According to the method, processing and modeling are carried out on process tolerance data in integrated manufacturing, andmanufacture process levels are truly fed back to designers for calling through a standard IP library form, so that system-level simulation can cover analysis of process tolerance, the simulation is capable of rapidly and effectively verifying influences, on system performance, of the process manufacturing levels, and benefit is brought to shorten the design verification period.

Description

technical field [0001] The invention belongs to the technical field of radio frequency microwave modeling and simulation, and in particular relates to a modeling and packaging method of radio frequency integration process tolerance and electrical performance coupling characteristics. Background technique [0002] As the main link in the integrated manufacturing of RF and microwave systems, RF and microwave integration processes, such as gold wire bonding, vertical interconnection, and horizontal transition structures commonly used in typical components or device packaging, are important for ensuring the electrical performance of RF and microwave systems, especially RF signal transmission. very important role. [0003] The representative existing radio frequency modeling methods are mainly methods based on neural network modeling combined with vector fitting modeling and empirical models. The core of such methods is to adapt prior knowledge base functions for different model...

Claims

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Application Information

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IPC IPC(8): G06F17/50
CPCG06F30/398G06F2113/18
Inventor 张晏铭李阳阳
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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