Manufacturing method of circuit board plated hole

Abstract

The invention discloses a manufacturing method of a circuit board plated hole. The manufacturing method comprises the following steps of material cutting, internal layer, inspection, pressing, manufacturing the drilling target locating hole for drilling the resin filling hole, drilling the resin filling hole, primary copper plating, whole plate copper plating, film drying before hole plating, holeelectroplating, film stripping, resin hole filling, resin grinding, manufacturing the drilling target locating hole for drilling the non-resin-filling hole, drilling the non-resin-filling hole, secondary copper plating and secondary whole plate electroplating. The method that the resin filling hole is completed and then the non-resin-filling hole and the external line are completed is adopted sothat the phenomenon of non-uniform copper thickness after whole plate copper thickening and chemical copper thinning can be successfully solved, the porthole pit abnormity of the resin filling hole after chemical copper thinning can be avoided, the manufacturing yield rate can be greatly enhanced, the process manufacturing capability can be powerfully enhanced and thus wide application and preference of the circuit board manufacturers can be received. The manufacturing method of the circuit board plated hole is widely suitable for the technical field of circuit board production.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing plated holes of a circuit board. Background technique [0002] Electronic products are developing towards diversification and portability. Precise circuits, micro-holes and high density have become common phenomena. There are also printed circuits with special structures, such as resin-plugged boards (VOP holes). Conventional process design Drill out the holes that need to be plugged with resin, and through the hole metallization (full board electroplating) to meet the hole copper requirements, resin plug the holes, then chemically thin the copper, subtract a certain surface copper thickness, and then proceed to the subsequent process. With the development of electronic products towards precision circuits and small circuits, the above-mentioned production method, through the whole board electroplating and copper thinning process, has un...

AI Technical Summary

Problems solved by technology

With the development of electronic products towards precision circuits and small circuits, the above-mentioned production method, through the whole board electroplating and copper thinning process, has uneven copper thickness on the surface, and the pit hole hole is caused by the chemical thinning process of copper. Copper sinking in the subsequent process did not sink copper, resulting in the lack of covering copper, which brought great difficulties to the production line in the subsequent process

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