Resin Composition
A technology of resin composition and cured product, which is applied in the direction of epoxy resin coatings, coatings, circuits, etc., can solve the problems of poor adhesion strength of metal layers, and achieve the effect of excellent adhesion strength
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[0246] [Example]
[0247] Hereinafter, the present invention will be explained more specifically through examples, but the present invention is not limited by these examples. It should be noted that, in the following description, unless otherwise specified, "parts" and "%" indicating amounts refer to "parts by mass" and "% by mass", respectively.
[0248]
[0249] (1) Base treatment of inner circuit board
[0250] The glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18μm, substrate thickness 0.3mm, R5715ES manufactured by Panasonic) on which the inner circuit is formed is immersed in CZ8100 manufactured by MEC, and the copper surface is immersed Roughening treatment.
[0251] (2) Laminating of resin sheet
[0252] Using a batch vacuum pressure laminator (2-Stage Buildup Laminator "CVP700" manufactured by Nikko-Materials), the resin sheets produced in the Examples and Comparative Examples were laminated inside On both sides of the layer circuit boa...
Example Embodiment
[0283]
[0284] G-3000 (bifunctional hydroxyl-terminated polybutadiene, number average molecular weight = 5047 (GPC method), hydroxyl equivalent = 1798 g / eq., solid content 100% by mass: manufactured by Nippon Soda) was mixed in a reaction vessel 69 g , Ipsol 150 (aromatic hydrocarbon-based mixed solvent: manufactured by Idemitsu Petrochemical Co., Ltd.) 40 g, dibutyltin dilaurate 0.005 g, and uniformly dissolved. After becoming uniform, the temperature was raised to 50°C, and 8 g of isophorone diisocyanate (manufactured by Evonik Degussa Japan, IPDI, isocyanate group equivalent = 113 g / eq.) was further added while stirring, and the reaction was performed for about 3 hours. Next, the reactant was cooled to room temperature, and 23 g of cresol phenol resin (KA-1160, manufactured by DIC Corporation, hydroxyl equivalent = 117 g / eq.), and diethylene glycol ethyl ether acetate (ethyldiglycol acetate, Daicel Corporation) were added thereto. (Production) 60 g, heated to 80°C while sti...
Example Embodiment
[0285]
[0286] In a reaction vessel, 80 g of polycarbonate diol (number average molecular weight: about 1,000, hydroxyl equivalent: 500, non-volatile content: 100%, "C-1015N" manufactured by Kuraray), and 0.01 g of dibutyltin dilaurate It was uniformly dissolved in 37.6 g of diethylene glycol monoethyl ether acetate ("Diethylene glycol ethyl ether acetate" manufactured by Daicel). Next, the mixture was heated to 50°C, and 27.8 g of toluene-2,4-diisocyanate (isocyanate group equivalent: 87.08) was added while stirring, and the reaction was performed for about 3 hours. Next, the reactant was cooled to room temperature, and then 14.3 g of benzophenone tetracarboxylic dianhydride (anhydride equivalent: 161.1), 0.12 g of triethylene diamine, and diethylene glycol monoethyl ether acetate (Daicel 84.0 g of "Diethylene glycol ethyl ether acetate" manufactured by the company) was heated to 130°C while stirring, and the reaction was performed for about 4 hours. Confirm 2250cm with FT-I...
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