Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Resin Composition

A technology of resin composition and cured product, which is applied in the direction of epoxy resin coatings, coatings, circuits, etc., can solve the problems of poor adhesion strength of metal layers, and achieve the effect of excellent adhesion strength

Active Publication Date: 2018-10-09
AJINOMOTO CO INC
View PDF14 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of curing a resin composition containing a thermally conductive filler to form an insulating layer, by increasing the content of the thermally conductive filler in the resin composition, the thermal conductivity of the resulting insulating layer can be improved, but if the thermal conductivity is sufficient If the content of the thermally conductive filler is increased to a certain extent, the resulting insulating layer tends to have poor adhesion strength to the metal layer used to form the wiring.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin Composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0247] Hereafter, although an Example demonstrates this invention more concretely, this invention is not limited to these Examples. In addition, in the following description, unless otherwise stated, "part" and "%" which show an amount mean "mass part" and "mass %", respectively.

[0248]

[0249] (1) Substrate treatment of inner layer circuit board

[0250] Dip both sides of a glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.3 mm, R5715ES manufactured by Panasonic Corporation) with an inner layer circuit formed in CZ8100 manufactured by MEC Co., Ltd. Roughening treatment.

[0251] (2) Lamination of resin sheets

[0252] Using a batch-type vacuum pressure laminator (2-Stage Buildup Laminator (2-stage stack laminator) "CVP700" manufactured by Nikko-Materials Co., Ltd.), the resin sheets produced in Examples and Comparative Examples were laminated inside On both sides of the layered circuit board, the resin c...

Synthetic example 1

[0283]

[0284] 69 g of G-3000 (difunctional hydroxyl-terminated polybutadiene, number average molecular weight = 5047 (GPC method), hydroxyl equivalent = 1798 g / eq., solid content 100% by mass: manufactured by Nippon Soda Co., Ltd.) was mixed in a reaction container , 40 g of Ipsol (イプゾール) 150 (aromatic mixed solvent: manufactured by Idemitsu Petrochemical Co., Ltd.), and 0.005 g of dibutyltin dilaurate were uniformly dissolved. After becoming uniform, the temperature was raised to 50° C., and 8 g of isophorone diisocyanate (manufactured by Evonik Degussa Japan, IPDI, isocyanate group equivalent=113 g / eq.) was further added with stirring, and reacted for about 3 hours. Next, the reactant was cooled to room temperature, and 23 g of cresol novolac resin (KA-1160, manufactured by DIC Corporation, hydroxyl equivalent = 117 g / eq.), diethylene glycol ether acetate (ethyldiglycol acetate, Daicel Corporation) were added thereto. System) 60g, while stirring, the temperature was rais...

Synthetic example 2

[0285]

[0286] In a reaction container, 80 g of polycarbonate diol (number average molecular weight: about 1000, hydroxyl equivalent: 500, non-volatile content: 100%, "C-1015N" manufactured by Kuraray Co., Ltd.) and 0.01 g of dibutyltin dilaurate It was uniformly dissolved in 37.6 g of diethylene glycol monoethyl ether acetate ("diethylene glycol monoethyl ether acetate" manufactured by Daicel). Next, this mixture was heated up to 50 degreeC, and 27.8 g of toluene-2, 4- diisocyanates (isocyanate group equivalent weight: 87.08) were further added, stirring, and it reacted for about 3 hours. Next, the reactant was cooled to room temperature, and 14.3 g of benzophenone tetracarboxylic dianhydride (acid anhydride equivalent: 161.1), 0.12 g of triethylenediamine, and diethylene glycol monoethyl ether acetate (Daicel 84.0 g of "diethylene glycol ethyl ether acetate" manufactured by the company was heated up to 130 degreeC, stirring, and it reacted for about 4 hours. 2250cm confi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
The average particle sizeaaaaaaaaaa
Specific surface areaaaaaaaaaaa
Login to View More

Abstract

The objective of the invention is to provide a resin composition capable of obtaining excellent heat conduction coefficient and excellent peeling strength on a metal layer, a resin sheet using the resin composition, a circuit substrate and a semiconductor chip package. The solution of the invention is a resin composition which contains: (A) a high-molecular compound with a molecular structure selected from the group consisting of polybutadiene structure, a polysiloxane structure and a poly (methyl ) acrylic ester structure, a polyalkylene structure, a polyalkylene oxide structure and a polyisoprene structure, a polyisobutylene structure and polycarbonate structure, (B) an epoxy resin, (C) a heat-conducting filler, AND (D) an active ester curing agent.

Description

technical field [0001] The present invention relates to resin compositions. Furthermore, it is related with the resin sheet which used the resin composition, a circuit board, and a semiconductor chip package. Background technique [0002] In recent years, miniaturization and higher functionality of electronic equipment have progressed, and the mounting density of semiconductor elements on printed wiring boards tends to increase. In conjunction with higher functionality of mounted semiconductor elements, technology for efficiently dissipating heat generated by semiconductor elements is required. In the case of curing a resin composition containing a thermally conductive filler to form an insulating layer, by increasing the content of the thermally conductive filler in the resin composition, the thermal conductivity of the resulting insulating layer can be improved, but if the thermal conductivity is sufficient If the content of the thermally conductive filler is increased t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09D175/14C09D175/04C09D163/00C09D7/62C08J7/04H01L23/29H01L23/498C08L67/02
CPCH01L23/295H01L23/49894C08L2203/206C08L2205/025C08L2205/02C08L2205/035C08K2003/2227C08K2201/003C08K2201/006C08K2201/014C08L75/14C08L75/06C08J5/18C08J2375/14C08J2375/04C08J2463/00C08J2463/02C08L63/00C08K9/06C08K3/22H01L2224/18H01L24/20H01L2224/04105H01L2224/12105H01L2924/3511C08G59/42C08L101/02C08K3/013H01L23/145H05K1/0353
Inventor 奥山英惠
Owner AJINOMOTO CO INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com