Adhesive composition, circuit connection structure, semiconductor device, and solar cell module

A composition and adhesive technology, which is applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of difficult storage stability and low activation energy, and achieve excellent bonding strength , seek the effect of production volume and shorten the working time

Inactive Publication Date: 2012-04-04
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in order to achieve this low-temperature rapid curing, it is necessary to use a thermal latent c

Method used

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  • Adhesive composition, circuit connection structure, semiconductor device, and solar cell module
  • Adhesive composition, circuit connection structure, semiconductor device, and solar cell module
  • Adhesive composition, circuit connection structure, semiconductor device, and solar cell module

Examples

Experimental program
Comparison scheme
Effect test

Example

[0205] (Examples 1 to 9, Comparative Examples 1 to 2)

[0206] The acrylic rubbers shown in Table 2, the urethane acrylates described above, the phenoxy resins described above, and bis(2-methacrylic acid) as phosphoric acid esters were blended at the respective solid content mass ratios in the ratios shown in Table 2. Acyloxyethyl) acid phosphate (manufactured by Kyeisha Chemical Co., Ltd., trade name P-2M), tert-hexyl peroxy-2-ethylhexanoate (manufactured by NOF Corporation, trade name) as a radical polymerization initiator Named Percure HO (パ一キ Youa HO)), an adhesive composition containing liquid was prepared. Then, 3 volume % of electroconductive particles were dispersed in this adhesive composition containing liquid based on the total volume of solid content in an adhesive composition, and the circuit connection material containing liquid was prepared.

[0207] This circuit-connecting material-containing solution was left to stand in an environment of 25° C. and 60% RH fo...

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Abstract

The invention provides an adhesive composition, a circuit connection structure, a semiconductor device and a solar cell module. The adhesive composition comprises acrylic rubber, urethane acrylate and free radical polymerization initiators from 5-18 weight percentages of structural units of acrylonitrile.

Description

technical field [0001] The present invention relates to an adhesive composition, a circuit connection structure, a semiconductor device and a solar cell module. Background technique [0002] In a semiconductor element, a liquid crystal display element, etc., in order to join various members in an element, various adhesive compositions have been used conventionally. The properties required for the adhesive composition include adhesiveness as a representative and relate to many aspects such as heat resistance and reliability in a high-temperature and high-humidity state. [0003] In addition, the adherends used for bonding are represented by organic substrates such as printed wiring boards and polyimide, and metals such as copper and aluminum, or ITO, IZO, SiN, and SiO can be used. 2 and other substrates with various surface states. Therefore, the adhesive composition sometimes needs to be adapted to the molecular design of the adherend. [0004] Conventionally, as an adhes...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J133/08C09J9/02H05K3/32H01L23/488H01L21/60H01L31/0224H01L31/18
CPCH01L2924/07811H01L2924/10253H01L2224/2929H01L2224/27334H01L2224/83851H01L2224/293Y02E10/50Y02P70/50H01L2924/00C09J9/02C09J109/02C09J133/14H01L31/04
Inventor 工藤直伊泽弘行有福征宏小林宏治藤枝忠恭松田和也藤绳贡
Owner HITACHI CHEM CO LTD
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