Medium temperature curing high temperature resistant phenolic adhesive

A curing type, high temperature resistant technology, used in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of poor temperature resistance, high curing temperature of phenolic adhesives, and achieve good bonding strength. Effect

Inactive Publication Date: 2012-08-08
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention solves the technical problems of high curing temperature and poor temperature resistance of exi

Method used

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  • Medium temperature curing high temperature resistant phenolic adhesive
  • Medium temperature curing high temperature resistant phenolic adhesive
  • Medium temperature curing high temperature resistant phenolic adhesive

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0015] Specific embodiment one: In this embodiment, the medium-temperature curing type high-temperature-resistant phenolic adhesive is composed of 100 parts by mass of modified phenolic resin solution, 5-40 parts of toughening agent, 10-55 parts of curing agent, 20-100 parts It is made of heat-resistant reinforced resin and 50-400 parts of filler.

specific Embodiment approach 2

[0016] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the toughening agent is nitrile rubber, polyvinyl alcohol, polyvinyl furfural, polyvinyl butyral and polyvinyl furfural One or a mixture of several aldehydes. Others are the same as in the first embodiment.

[0017] When the toughening agent described in this embodiment is a mixture, the ratio of each component is arbitrary.

specific Embodiment approach 3

[0018] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that the curing agent is hexamethylenetetramine or paraformaldehyde. Others are the same as in the first or second embodiment.

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Abstract

A medium temperature curing high temperature resistant phenolic adhesive relates to an adhesive. The invention solves technical problems of phenolic high curing temperature and weak temperature tolerance of adhesive. The adhesive of the present invention consists of modified phenolic resin solution, toughening agent, curing agent, heat-resistant reinforced resin and filler. The adhesive of the invention has a low curing temperature, can be cured at 100 DEG C and obtain good adhesive strength. Curing at 100 DEG C for 6 hours, the adhesive can reach shear strength of 13.5MP and still have shear strength of 2.3MPa at 1000 DEG C. The adhesive further conducts complex reaction in high temperature usage environment and generates product with better heat resistance, thereby realizing the echelon curing and echelon temperature resistance, which are difficult for other type of high temperature resistant glue to achieve.

Description

technical field [0001] The present invention relates to an adhesive. Background technique [0002] In recent years, with the advancement of science and technology, the performance of high-temperature-resistant adhesives has been continuously improved, and has been widely used in various high-tech fields, especially in the fields of aviation, aerospace and electronics, where high-temperature-resistant adhesives play an irreplaceable role; At the same time, the high temperature resistance requirements of adhesives in these fields are also getting higher and higher. For example, when supersonic aircraft fly in the air, the temperature is as high as 260-270 ° C. Some structural parts of these aircraft need to use high-strength titanium alloys instead of aluminum alloys. Accordingly, high-temperature-resistant adhesives need to be used to bond titanium alloys in large areas; On missiles, high-temperature-resistant adhesives are required to be maintained at a high temperature of ...

Claims

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Application Information

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IPC IPC(8): C09J161/14C08G8/28C08G77/22C08G81/00
Inventor 张斌孙明明薛刚张绪刚李坚辉王磊赵明李奇力
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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