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Thermoelectric module and package thereof

A technology of thermoelectric and transducer elements, which is applied in thermoelectric device components, manufacturing/processing of thermoelectric devices, thermoelectric device node lead-out materials, etc., and can solve the problem of wire bonding strength offset, damage, and insufficient thermoelectric transduction modules etc., to achieve the effect of reducing the resistance of wiring, good bonding strength, and excellent wettability

Inactive Publication Date: 2008-07-30
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in conventional thermoelectric transducer modules, there are insufficient thermoelectric transducer modules in reliability tests such as impact, energization cycle tests, and high-temperature operation.
Defects in these reliability tests are caused by various factors such as deterioration of the thermoelectric transducer itself, deterioration of the junction between the thermoelectric transducer and the wiring conductor, and deterioration of the connection between the thermoelectric transducer module and the outside.
[0022] In the connection between the thermoelectric transducer module and the outside, there are types in which lead wires are connected by solder and types in which lead wires are connected by wire bonding, but there are always problems in reliability
That is, when the lead wire is bonded to the thermoelectric transducer module with solder, there is a deviation in the bonding strength of the lead wire, and sometimes the wiring is easy to fall off.
In addition, in the type where the thermoelectric transducer module is electrically connected by wire bonding, there is a problem that the resistance of the lead wire is high, and there is a problem that the thermoelectric transducer element is damaged due to the impact of the wire bonding.

Method used

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  • Thermoelectric module and package thereof
  • Thermoelectric module and package thereof
  • Thermoelectric module and package thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0151] (Fabrication of thermoelectric transducer elements)

[0152] First, various N-type and P-type thermoelectric materials are fabricated. The production method is: prepare Bi, Te, Sb, Se metal powder with a purity of 99.99% or more and SbI as a dopant for thermoelectric transducer elements 3 Powder and SbBr 3 powder. As an N-type thermoelectric material, Bi 2 Te 2.85 Se 0.15 Based on the composition, the amount of the dopant is adjusted in order to adjust the specific resistance.

[0153] In addition, the P-type uses thermoelectric materials with Bi x Sb 2-x Te 3 As a basis, make x vary from 0.3 to 0.7, and adjust the specific resistance.

[0154] (a) Formation of sintered body

[0155] After the raw materials were weighed to a desired composition, they were filled into a carbon crucible and sealed with a lid. Put it into a quartz tube, perform vacuum replacement, and produce a molten alloy at 800° C. for 5 hours in an argon atmosphere.

[0156] The molten allo...

Embodiment 2

[0189] The initial feedstock was prepared by Bi 2 Te 2.85 Se 0.15 A thermoelectric transducer element 2 composed of a sintered body. The shape is a square prism, and the size is 0.6mm in length, 0.6mm in width, and 1mm in height. In addition, as the support substrate 1, alumina having a size of 6 mm×8 mm was prepared.

[0190] Cu wiring conductors 3 are formed on the supporting substrate 1 by a plating-etching method. A cover layer 7 of Au is formed on the surface.

[0191] On the wiring conductor 3a of the lower supporting substrate 1a, solder paste composed of solder 6 such as Au-Sn is printed, and the thermoelectric transducer elements 2 are arranged on it, and heated from the reverse side of the lower supporting substrate 1a to fix the thermoelectric element. Transducer element 2. The number of thermoelectric transducer elements 2 is the same number of N-type thermoelectric transducer elements 2a and P-type thermoelectric transducer elements 2b respectively. Similar...

Embodiment 3

[0201] A thermoelectric transducer module was produced in the same manner as in Example 2 except that the composition of the solder for connecting the leads was changed.

[0202] Place the obtained thermoelectric transducer module in a high-temperature atmosphere at 170°C, and measure the resistance change (ΔR) after 100 hours by the AC 4-terminal method. If ΔR exceeds 5%, it is unqualified, that is, ×, and if it is less than 5%, it is qualified. ○.

[0203] [table 3]

[0204] sample

No.

Lead solder composition

Component gas

Porosity (%)

Thermoelectric transducer element

ΔR(%)

Judgment

Sn(wt%)

Other composition (weight%)

P type

N type

1

20

Au

80

2

Bi 0.5 Sb 1.5 Te 2

Bi 2 Te 2.85 Se 0.15

0.2

◎

2

12

Au

88

2

Bi 0.5 Sb 1.5 Te 2

Bi 2 Te 2.85 Se 0.15

0.3

◎

3

30

Au

...

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Abstract

A thermoelectric transducer module and its package, the thermoelectric transducer module has a support substrate, a plurality of thermoelectric transducer elements arranged on the support substrate, wiring conductors electrically connecting the thermoelectric transducer elements, and the The external connection terminal to which the wiring conductor is electrically connected, wherein the cross-sectional shape of the wiring conductor is a rectangle or a trapezoidal shape in which the upper side on the element bonding surface side is longer than the lower side on the supporting substrate side. Accordingly, reliability can be improved.

Description

[0001] This application is a divisional application, the application number of its parent application: 200410089674.X filing date: 2004.10.29, the name of the invention: thermoelectric energy conversion module technical field [0002] The invention relates to a thermoelectric conversion module suitable for temperature control, low-temperature heat insulation and power generation and its package. Background technique [0003] A thermoelectric transducer element utilizes the Peltier effect in which one end generates heat and the other end absorbs heat when a current flows through a PN junction composed of a P-type semiconductor and an N-type semiconductor. Its modularized thermoelectric transducer module can perform precise temperature control, and is small in size and simple in structure. Therefore, it is expected to be widely used in CFC-free cooling devices, photodetection devices, electronic cooling devices such as semiconductor manufacturing devices, and temperature contr...

Claims

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Application Information

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IPC IPC(8): H01L35/08H01L35/10C23C30/00H01L35/16H01L35/32H01L35/34
Inventor 田岛健一田中广一
Owner KYOCERA CORP
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