Thermoelectric module and package thereof
A technology of thermoelectric and transducer elements, which is applied in thermoelectric device components, manufacturing/processing of thermoelectric devices, thermoelectric device node lead-out materials, etc., and can solve the problem of wire bonding strength offset, damage, and insufficient thermoelectric transduction modules etc., to achieve the effect of reducing the resistance of wiring, good bonding strength, and excellent wettability
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Example Embodiment
[0150] Example 1
[0151] (Creation of thermoelectric transducer elements)
[0152] First, make various N-type and P-type thermoelectric materials. The production method is as follows: prepare Bi, Te, Sb, Se metal powder with a purity of 99.99% or more and SbI as a dopant for thermoelectric energy conversion elements 3 Powder and SbBr 3 powder. As a thermoelectric material for N type, with Bi 2 Te 2.85 Se 0.15 The composition is basic, and the amount of dopant is adjusted in order to adjust the specific resistance.
[0153] In addition, P-type thermoelectric materials are made of Bi x Sb 2-x Te 3 For the basics, change x from 0.3 to 0.7 to adjust the specific resistance.
[0154] (a) Preparation of sintered body
[0155] After the raw materials are weighed to the required composition, they are filled into a crucible made of carbon and sealed with a lid. Put it into a quartz tube, perform vacuum replacement, and make a molten alloy at 800°C for 5 hours in an argon atmosphere.
[01...
Example Embodiment
[0188] [Example 2]
[0189] The initial raw materials are prepared by Bi 2 Te 2.85 Se 0.15 A thermoelectric transducer element 2 composed of a sintered body. The shape is a quadrangular prism, the size is 0.6mm in length, 0.6mm in width and 1mm in height. In addition, as the supporting substrate 1, alumina having a size of 6 mm×8 mm was prepared.
[0190] The wiring conductor 3 of Cu is produced on the supporting substrate 1 by a plating-etching method. A coating layer 7 of Au is formed on the surface.
[0191] A solder paste composed of solder 6 such as Au-Sn is printed on the wiring conductor 3a of the lower supporting substrate 1a, and thermoelectric transducer elements 2 are arranged on the wiring conductor 3a. The thermoelectric transducer 2 is heated from the opposite surface of the lower supporting substrate 1a to fix the thermoelectric Transduction element 2. The number of thermoelectric transducer elements 2 is the same number of N-type thermoelectric transducer elements ...
Example Embodiment
[0200] [Example 3]
[0201] Except for changing the composition of the solder of the connection lead, a thermoelectric transducer module was produced in the same manner as in Example 2.
[0202] Place the obtained thermoelectric transducer module in a high temperature atmosphere of 170°C, and measure the resistance change (ΔR) after 100 hours by the AC 4-terminal method. If the ΔR exceeds 5%, it is considered as unqualified, and if 5% or less is considered to be qualified. ○.
[0203] [table 3]
[0204] Sample
[0205] *Outside the scope of the present invention
[0206] Sample Nos. 1 to 4 and 10 to 16 in which the Sn content is in the range of 12% by weight or more and 40% by weight or less have good resistance changes of 5% or less. Among them, sample Nos. 1 to 4, 10 to 12, and 14 to 16 in which the porosity of the thermoelectric transducer element is 10% or less have a resistance change of 3% or less, which is particularly excellent in all evaluations within the error...
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