High-performance building adhesive
An adhesive, high-performance technology, applied in the direction of adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc., to achieve the effect of good bonding strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0017] The weight proportion of table 1 embodiment 1~embodiment 3
[0018]
[0019] In the above examples, industrial grade 1799 is used for vinyl alcohol; the molecular weight of epoxy resin is 8000-200000, and the epoxy value is 0.48-0.54; the molecular weight of polyamide is 2000-12000; the molecular weight of polyacrylamide is 50000-120000 ; The initiator is a mixture of ammonium persulfate and sodium sulfite, the molar ratio is 1:1; the particle size range of bentonite is 5-500 microns; the surfactant is sodium dodecylsulfate.
[0020] The preparation method of each embodiment is:
[0021] S1 Add polyvinyl alcohol, surfactant and part of deionized water into the reaction kettle, stir and raise the temperature to about 70~80°C to completely dissolve the polyvinyl alcohol;
[0022] S2 Epoxy resin, epoxy acrylate diester, polyamide, polyacrylamide, nonylphenol polyoxyethylene ether, ethylene-vinyl acetate emulsion, initiator, octyltrimethoxysilane, γ-methacryloyl Put ox...
PUM
Property | Measurement | Unit |
---|---|---|
Peel strength | aaaaa | aaaaa |
Tensile shear strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com