Electroless gold plating liquid for forming gold plating film for wire bonding

A gold electroplating and metal technology, used in electrical components, printed circuits, liquid chemical plating, etc., can solve problems such as unresolved, easy peeling of leads, and achieve the effect of increasing surface area, improving adhesion, and good bonding strength

Inactive Publication Date: 2008-06-11
恩伊凯慕凯特股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, when wire bonding is performed on the gold plating film formed by the gold plating treatment, the bonded wires tend to peel off, and this problem has not been solved.

Method used

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  • Electroless gold plating liquid for forming gold plating film for wire bonding
  • Electroless gold plating liquid for forming gold plating film for wire bonding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A resin test plate (line width 50-100 μm, pad for bonding, bonded area diameter for share strength 0.6 mm) with a size of 50×50 mm formed with a solder preventive was prepared. An electroless nickel plating film with a thickness of 5 μm was formed on the test substrate using a commercially available electroless nickel plating solution (SN-150 manufactured by Kanigen, Japan). Hereinafter, the board|substrate to which this electroless nickel plating was given is called a nickel plating sample.

[0049] Dissolve potassium gold cyanide in pure water at 2 g / L in terms of Au, potassium oxalate hydrate at 20 g / L, ethylenediammonium tetraacetic acid at 5 g / L, and potassium dihydrogen phosphate at 5 g / L to prepare substrate gold Displacement type electroless gold plating solution for electroplating.

[0050] The pH value of the substrate gold electroplating solution was adjusted to 5.0, the liquid temperature was controlled at 85° C., and the above-mentioned nickel electroplati...

Embodiment 2

[0052] The pH value of the electroplating solution prepared in Example 1 was adjusted to 7.0 with potassium hydroxide, the liquid temperature was controlled at 85° C., and the nickel electroplating sample was soaked therein for 5 minutes. After 5 minutes, the substrate gold plating sample was taken out, and the thickness of the precipitated film was measured with a film fluorescent X-ray thickness measuring device. The gold film thickness of the gold plated sample on the substrate is 0.05 μm.

Embodiment 3

[0062] Except not having added EDTA, the same operation as in Example 1 was performed using the displacement type electroless gold plating solution for substrate gold plating in the same manner as in Example 1.

[0063] The thickness of the precipitated film was measured with a film fluorescent X-ray thickness measuring device. The gold film thickness of the gold plated sample on the substrate is 0.05 μm. The performance profile of the gold plating film is the same as in Example 1. Further, the same operation was performed three times without any abnormality, and the performance and shape of the gold plating film was good.

[0064] Example 1

Example 2

Comparative example 1

Comparative example 2

Electroplating solution pH

5.0

7.0

5.0

7.0

85°C, 5 minutes electricity

Gold film thickness during plating

0.05μm

0.05μm

0.04μm

0.03μm

Wire Bonding Test Results

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Abstract

Disclosed is an electroless gold plating liquid for forming a gold plating film for wire bonding which is characterized by containing a gold cyanide compound and oxalic acid and/or a salt thereof, but not containing a foundation metal dissolution inhibitor. The gold cyanide compound is preferably contained in an amount of 0.5-10 g/L in terms of gold ion concentration, and the oxalic acid and/or a salt thereof is preferably contained in an amount of 5-50 g/L. Preferably, the electroless gold plating liquid also contains a masking agent for dissolved foundation metal, and the masking agent is preferably composed of ethylenediaminetetraacetic acid and/or a salt thereof.

Description

technical field [0001] The present invention relates to an electroless gold plating solution. More specifically, the present invention relates to an electroless gold plating solution suitable for use when forming a gold plating film for wire bonding on a fine wiring surface of a fine wiring substrate. Background technique [0002] In wiring substrates such as printed circuit boards, nickel plating is usually performed on the surface of fine copper wiring formed on the substrate, and gold plating is further performed thereon. In recent years, along with miniaturization of electronic components, wiring has also been miniaturized, and wiring substrates in which a plurality of independent circuit wirings are formed on a substrate have become mainstream. When thick-film gold plating is applied to independent wiring of a circuit, a coating film forming method using an electroless gold plating solution is used (Japanese Patent No. 3146757). [0003] In general, when thick-film go...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42
CPCH05K3/244C23C18/42C23C18/54
Inventor 松本雄
Owner 恩伊凯慕凯特股份有限公司
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