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Modified waterborne polyaniline epoxy resin coating and preparation method thereof

A polyaniline epoxy resin, epoxy resin technology, applied in the direction of coating, can solve the problems of poor solubility and dispersion, lack of coating, anti-corrosion performance, anti-scratch and anti-pitting performance, etc., to achieve dielectric properties Good, excellent bond strength, small effect of set shrinkage

Inactive Publication Date: 2016-05-25
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the research on polyaniline anti-corrosion coatings mainly focuses on polyaniline electrochemical polymerization or conductive polyaniline resin blending system, because polyaniline direct polymerization is difficult to protect metal devices with a large area, and polyaniline macromolecules have strong interactions. Conjugated large bonds, the coatings prepared with it as the backbone have poor solubility and dispersion, so the cost performance of using pure polyaniline to prepare anti-corrosion coatings is not high
If the general coating lacks polyaniline, the anti-corrosion performance, anti-scratch and anti-pitting performance are relatively poor
At present, there is a lack of methods that can effectively improve the technology

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A modified water-based polyaniline epoxy resin coating, measured according to the number of parts, including: 36 parts of epoxy resin, 12 parts of hydrochloric acid, 6 parts of aniline, 18 parts of ammonium persulfate, 9 parts of acrylic acid, 2 parts of dodecylbenzenesulfonic acid parts, 6 parts of polyamide resin, 25 parts of N-methallylamine, and 22 parts of diethanolamine.

[0020] The preparation method of described a kind of modified waterborne polyaniline epoxy resin coating, comprises the steps:

[0021] (1) Preparation of aqueous epoxy resin solution

[0022] In the flask, add epoxy resin, co-solvent and polymerization inhibitor in sequence, heat up to 40°C, feed nitrogen, add N-methallylamine dropwise, the temperature is 40°C, the time is 45 minutes, and the product Cool down to 40°C, add diethanolamine dropwise, the temperature is at 40°C, the time is 75 minutes, add acrylic acid and stir, neutralize to pH 6.5, and add a certain amount of deionized water to ...

Embodiment 2

[0028] A modified water-based polyaniline epoxy resin coating, measured according to the number of parts, including: 45 parts of epoxy resin, 20 parts of hydrochloric acid, 15 parts of aniline, 30 parts of ammonium persulfate, 26 parts of acrylic acid, 11 parts of dodecylbenzenesulfonic acid parts, 17 parts of polyamide resin, 45 parts of N-methallylamine, and 40 parts of diethanolamine.

[0029] The preparation method of described a kind of modified waterborne polyaniline epoxy resin coating, comprises the steps:

[0030] (1) Preparation of aqueous epoxy resin solution

[0031] In the flask, add epoxy resin, co-solvent and polymerization inhibitor in sequence, heat up to 40°C, feed nitrogen, add N-methallylamine dropwise, the temperature is 45°C, the time is 60 minutes, and the product Cool down to 40°C, add diethanolamine dropwise at 45°C for 90 minutes, add acrylic acid and stir, neutralize to pH 6.5, and add a certain amount of deionized water to dilute at 20°C;

[0032]...

Embodiment 3

[0037]A modified water-based polyaniline epoxy resin coating, measured according to the number of parts, including: 38 parts of epoxy resin, 15 parts of hydrochloric acid, 9 parts of aniline, 20 parts of ammonium persulfate, 10 parts of acrylic acid, 8 parts of dodecylbenzenesulfonic acid parts, 9 parts of polyamide resin, 27 parts of N-methallylamine, and 30 parts of diethanolamine.

[0038] The preparation method of described a kind of modified waterborne polyaniline epoxy resin coating, comprises the steps:

[0039] (1) Preparation of aqueous epoxy resin solution

[0040] In the flask, add epoxy resin, co-solvent and polymerization inhibitor in sequence, heat up to 40°C, feed nitrogen, add N-methallylamine dropwise, the temperature is 42°C, the time is 50 minutes, and the product Cool down to 40°C, add diethanolamine dropwise, the temperature is at 42°C, the time is 80 minutes, add acrylic acid and stir, neutralize to pH 6.5, and add a certain amount of deionized water to ...

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PUM

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Abstract

The invention relates to a modified waterborne polyaniline epoxy resin coating. The modified waterborne polyaniline epoxy resin coating comprises 36-45 parts of epoxy resin, 12-20 parts of hydrochloric acid, 6-15 parts of aniline, 18-30 parts of ammonium persulfate, 9-26 parts of acrylic acid, 2-11 parts of dodecylbenzene sulfonic acid, 6-17 parts of polyamide resin, 25-45 parts of N-allylmethylamine and 22-40 parts of diethanol amine. The modified waterborne polyaniline epoxy resin coating has the advantages that a water-soluble redox system is used for initiating double-bond curing, so that the problems of system emulsion breaking and layering are avoided effectively; the coating is excellent in anti-corrosion performance and highly resistant to scratch and pitting; the coating with excellent physical and chemical performance is excellent in bonding strength for the surfaces of metal and non-metal materials, good in dielectric performance and small in setting shrinkage ratio.

Description

technical field [0001] The invention relates to the field of coatings, in particular to a modified water-based polyaniline epoxy resin coating and a preparation method thereof. Background technique [0002] Epoxy resins generally refer to organic compounds containing two or more epoxy groups in their molecules. Except for a few, their relative molecular weights are not high. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can undergo cross-linking reactions with various types of curing agents to form insoluble polymers with a three-way network structure. All polymer compounds containing epoxy groups in their molecular structure are collectively referred to as epoxy resins. The cured epoxy resin has good physical and chemical properties. It has excellent bonding...

Claims

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Application Information

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IPC IPC(8): C09D4/02C09D4/00C09D4/06C09D7/12C08G73/02C08G59/60
CPCC09D4/06C08G59/60C08G73/0266C09D7/61C09D7/65
Inventor 张玉华
Owner GUANGXI UNIV
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