Method for producing terminal for electronic component, and terminal for electronic component produced by the production method

A technology of electronic parts and manufacturing methods, which is applied in the direction of capacitor terminals, capacitor parts, electrical components, etc., can solve problems such as the inability to use lead-free tinned copper wires, the inability to improve the bonding strength of copper leads and aluminum electrodes, and achieve good bonding intensity effect

Active Publication Date: 2011-07-27
KOHOKU KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the method of adding silver or the like to tin plating, the plating process itself must be changed, and there is a problem that commercially available lead-free tin-plated copper wires cannot be used.
[0010] In addition, in the method of bonding the lead wire while heating the aluminum electrode, the lead wire (CP wire) covered with copper on the iron wire is used as the lead wire. The pole plate is firmly bonded to the iron wire, but in the case of using a copper lead that does not have such an iron core, the bonding strength between the copper lead and the aluminum electrode cannot be improved even if the method described above is used

Method used

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  • Method for producing terminal for electronic component, and terminal for electronic component produced by the production method
  • Method for producing terminal for electronic component, and terminal for electronic component produced by the production method
  • Method for producing terminal for electronic component, and terminal for electronic component produced by the production method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] As the lead terminal member, a 0.6 mmφ copper lead wire to which lead-free tin plating (plating thickness: 12 μm) was applied was used, and the lead copper wire was cut into a length of 20 mm. In addition, as an aluminum electrode terminal member, an aluminum wire of 1.2 mmφ was used, and the aluminum wire was cut into a length of 9 mm.

[0051] The copper lead wire and the aluminum wire cut into predetermined lengths are respectively held on respective electrodes of the impact welding device. Then, using a halogen lamp heater (IHU-A: manufactured by USHIO Electric Co., Ltd.), the irradiated light was condensed through a lens, and irradiated onto the aluminum electrode side tip portion of the lead member. When the temperature of the tip portion of the lead member was measured with a non-contact thermometer, the temperature was 260°C.

[0052] Then, in this state, a voltage (approximately 50 V) was applied to both electrodes to cause plasma discharge, and welding was pe...

Embodiment 2

[0054] As the lead terminal member, a 1.0 mmφ copper lead wire to which lead-free tin plating (plating thickness: 12 μm) was applied was used. The copper lead was cut to a length of 10.0 mm, and one end portion was processed into a 60° conical shape (taper processing). In addition, in the sealing plate member in which the aluminum base material is tightly fitted into the resin by integral molding, the welded surface of the aluminum base material is smoothed by pressing. These copper leads and the sealing plate member were respectively used as respective base materials of the impact welding device.

[0055] Next, in this state, a voltage (approximately 50 V) is applied to both electrodes to cause plasma discharge, and the tapered end of the copper lead wire is pressed against the core of the sealing plate member, and welding is performed. The copper lead was joined to the sealing plate member to obtain a sealing plate lead terminal for capacitors.

Embodiment 3

[0057] A lead terminal was obtained in the same manner as in Example 2, except that one tip portion of the copper lead in Example 2 was processed into a wedge shape with a tip angle of 60°.

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PUM

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Abstract

The present invention provides a method for producing a terminal for an electronic component, which enables the production of a terminal for an electronic component wherein a lead-free tin-plated lead terminal part and an electrode terminal part that is formed from aluminum are bonded together with excellent bonding strength. Specifically disclosed is a method for producing a terminal for an electronic component, said terminal being obtained by bonding a lead-free tin-plated lead terminal part with an electrode terminal part that is formed from aluminum. In the method, the lead terminal part and the electrode terminal part are arranged at a distance, and a voltage is applied between the lead terminal part and the electrode terminal part, thereby generating a plasma. Then, while melting orsemi-melting the lead-free tin plating by the plasma, one end of the lead terminal part and the axial core of the electrode terminal part are pressed together and percussion welded.

Description

technical field [0001] The present invention relates to a method of manufacturing a terminal for electronic components having a structure in which an electrode terminal made of an aluminum member is joined to a lead terminal such as a copper wire or a CP wire. A method for producing a terminal for electronic components on an aluminum electrode and a terminal for electronic components obtained by the production method. Background technique [0002] Terminals used for electronic components such as batteries, condensers, and capacitors have a structure in which lead terminals are joined to a pair of caulking portions functioning as a pair of electrodes. In addition, a tab terminal used in an electrolytic condenser or the like has a structure in which lead wires are bonded to a pair of electrode terminals. Each of these terminals is formed by joining aluminum and copper. [0003] Conventionally, in stud terminals and snap terminals, electrode terminals and lead wires are joine...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/008
CPCH01G9/008Y02T10/7022H01G9/045H01G9/10Y02T10/70
Inventor 吉泽修平横浜与志夫石井太
Owner KOHOKU KOGYO CO LTD
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