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Foaming phenolic resin preparation method and phenolic resin foam

A technology for foaming phenolic resin and phenolic resin foam, which is applied in the field of phenolic resin preparation, can solve the problems of foam opening rate, increase in pore size, reduce the flame retardancy of phenolic foam, affect the thermal insulation performance of foam, etc., and achieve low odor. , Small pore size, small effect of environment and human body

Inactive Publication Date: 2010-11-10
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The method of improving the toughness of phenolic foam is generally to add toughening components in the foaming process of phenolic resin. Although the addition of various toughening components can improve the toughness of the foam, it reduces the flame retardancy of the phenolic foam, etc. performance
The addition of a large amount of toughening components will also affect the microstructure of the foam, increase the foam opening ratio, pore size, and thermal conductivity, thereby affecting the thermal insulation performance of the foam

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0015] A preparation method of foamed phenolic resin, comprising the following steps:

[0016] 1. Add phenolic compounds, formaldehyde aqueous solution and alkali catalyst in sequence according to the ratio in the three-necked flask equipped with mechanical stirring, thermometer and reflux condenser, and heat in a water bath under stirring to maintain the condensation reaction at 70-90°C. The total condensation reaction time is About 5 to 8 hours;

[0017] 2. Cool down the system to 50-60°C, add acid to neutralize to pH 6.0-8.0;

[0018] 3. The resin system is dehydrated under reduced pressure in a water bath with a vacuum degree of 0.080-0.082MPa and 60-70°C until the viscosity is 2500-7000mPa.s, then the dehydration is stopped, and the temperature is lowered to 52°C to discharge.

[0019] Preferably, the phenol is selected from cresol, xylenol, p-alkylphenol and resorcinol. The aldehyde is selected from formaldehyde and acetaldehyde. The basic catalyst is selected from po...

Embodiment 1

[0023] Add 15 parts by weight of phenol, 25 parts by weight of 37% aqueous solution of formaldehyde and 0.3 parts by weight of sodium hydroxide in the three-necked flask equipped with mechanical stirring, thermometer, and reflux condenser according to the ratio, and heat in a water bath under stirring to maintain the reaction within 70 °C Condensation reaction, the total condensation reaction takes about 7 hours; cool the system to 60°C, add acid to neutralize to pH 7.5; dehydrate the resin system under reduced pressure in a water bath with a vacuum degree of 0.080-0.082MPa and 70°C to a viscosity of 4000mPa.s Stop dehydration, cool down to 52°C and discharge to obtain Resin A, whose performance index is listed in Table 1.

[0024] 100 parts by weight of resin A, 1 part by weight of polysiloxane, 25 parts by weight of pentane and 5 parts by weight of benzenesulfonic acid are fully mixed at 20°C, foamed at 70°C, and carried out at 70°C After post-curing, phenolic foams A-F were...

Embodiment 2

[0026] Add 15 parts by weight of phenol, 21 parts by weight of 37% aqueous solution of formaldehyde and 0.3 parts by weight of sodium hydroxide in the three-neck flask equipped with mechanical stirring, thermometer, and reflux condenser according to the ratio, and heat in a water bath under stirring to maintain the reaction within 90 °C Condensation reaction, the total condensation reaction takes about 8 hours; cool down the system to 50°C, add acid to neutralize to pH 7.0; dehydrate the resin system in a vacuum of 0.082MPa, 60°C water bath under reduced pressure to a viscosity of 6000mPa.s to stop dehydration , cooled to 52°C and discharged to obtain resin B, whose performance index is listed in Table 1.

[0027] Mix 100 parts by weight of resin B, 6 parts by weight of block copolymer of polyoxyethylene and polyoxypropylene, 5 parts by weight of hexane and butane, and 25 parts by weight of xylenesulfonic acid at 20°C Finally, foam at 60°C and post-cure at 70°C to prepare phen...

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Abstract

The invention discloses a foaming phenolic resin preparation method. The method comprises the following steps: A, phenol, aldehyde and alkali catalyst are added into a reactor, the mole ratio is 1 : 1-3 : 0.01-0.1, and the components are stirred for 5 to 8 hours at 70 to 90 degrees centigrade; B, the temperature of reaction liquid in step A is reduced to 50 to 60 degrees centigrade, acid is added and stirred until the pH value is 6.0 to 8.0; and C, the reaction liquid in step B is decompressed and dehydrated to 60 to 70 degrees centigrade and 2500 to 7000 m Pa.s viscosity. The invention further discloses phenolic resin foam made of the phenolic resin. The invention makes the foaming phenolic resin which can gel quickly have low free monomer content and high curing activity through controlling the synthesis technology condition accurately. The aperture of the prepared phenolic foam body is only 50 to 60 microns. The structure of the micro holes of the foam body is regular and the foam holes are fine and compact. The prepared phenolic foam body does not need any toughening modifier and no residue falls.

Description

technical field [0001] The invention relates to the preparation of phenolic resin, in particular to a preparation method of foamed phenolic resin and phenolic foam containing the phenolic resin. Background technique [0002] Phenolic foam is a kind of foam plastic obtained by foaming phenolic resin. Compared with the polystyrene foam, polyvinyl chloride foam, polyurethane foam and other materials that dominated the market in the early stage, it has special excellent performance in terms of flame retardancy, its light weight, high rigidity, good dimensional stability, and chemical resistance. Corrosion, good heat resistance, flame retardant, self-extinguishing, low smoke, resistance to flame penetration, no spillage in case of fire, low price; therefore, it is an ideal insulation material for electrical appliances, instruments, construction, petrochemical and other industries , has received widespread attention. At present, phenolic foam has become one of the fastest-growin...

Claims

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Application Information

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IPC IPC(8): C08G8/04C08G8/10C08L61/06C08L61/10
Inventor 唐路林赵彤王娟李枝芳
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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