Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

94results about How to "Gel fast" patented technology

Method for preparing reinforcing epoxy resin material capable of being fast cured at medium/low temperature

InactiveCN103554835AModerate curing temperatureGuaranteed dimensional stabilityPolymer scienceFirming agent
The invention discloses a method for preparing a reinforcing epoxy resin material capable of being fast cured at medium / low temperature and belongs to the technical field of materials. The epoxy resin material is characterized in that the epoxy resin material is formed by mixing a resin component A and a curing agent component B, wherein the resin component A consists of epoxy resin and an epoxy diluent; the curing agent component B consists of a curing agent and an accelerant. The method comprises the following steps: uniformly mixing and stirring the component A and the component B, and performing vacuum defoamation treatment; pouring the components into a preheated die, heating the components under the vacuumizing condition until the components are completely cured, thus obtaining the reinforcing epoxy resin system capable of being fast cured. The problems that the epoxy resin product is high in energy consumption during high-temperature curing and the dimensional accuracy of the product is difficultly controlled are solved. The composite material prepared by the method has the advantages of being fast cured and low in manufacturing cost. The method is simple and feasible in operation; the cured product is high in strength, excellent in heat resistance and high in adhesive property and is particularly suitable for repairing and reinforcing various equipment, pipelines and other epoxy resin composite material products.
Owner:佛山市沃隆化工有限公司

Polyurethane coating material for shoe coating and preparation method of polyurethane coating material

The invention provides a polyurethane coating material for shoe coating and a preparation method of the polyurethane coating material. The preparation method comprises the following steps that step (1) isocyanate, polyester polyol, a moisture scavenger and a diluent are added into a reaction kettle in proportion and mixed evenly, reaction is carried out for 6-8 hours under the condition of 80-120DEG C, vacuum bubble removal is carried out, and cooling is performed to obtain a component A; step (2) polyester polyol, a chain extender, a catalytic agent and a glycerin solution of dehydrated aluminum potassium sulfate dodecahydrate are added into the reaction kettle in proportion and mixed evenly and vacuumized for 2-3 hours to remove bubbles, and a component B is obtained; and step (3) the component A and the component B are evenly mixed in proportion, vacuum bubble removal is carried out for 30s, and the polyurethane coating material is obtained. The prepared polyurethane coating material is used for coating the surface of a shoe, once-forming can be achieved, and the problem that bubbles generated in the coating due to the fact that a known spraying polyurethane elastomer reacts with moisture is further solved.
Owner:FOSHAN NANHAI QIHONG SHOES MATERIAL CO LTD

A kind of high temperature resistant flexible one-component epoxy sealing adhesive and preparation method thereof

The invention relates to the field of adhesives, in particular to a high-temperature-resistant flexible single-component epoxy sealing adhesive and a preparation method thereof. The high-temperature-resistant flexible single-component epoxy sealing adhesive is prepared from the following raw materials in parts by weight: 10-40 parts of epoxy resin, 10-30 parts of a mixed softening resin, 5-20 parts of an active diluent, 5-20 parts of a mixed curing agent, 0.01-1 part of a polymerization inhibitor, 0.1-5 parts of fumed silica, 0.01-1 part of an infiltration flow promoter and 5-30 parts of spherical silica powder, the mixed curing agent is a mixture of a modified amine latent heat curing agent and a modified imidazole latent heat curing agent, and the mixed softening resin is prepared from at least two of F100, F300, Capa3050, H2004, HEF750, HEF751, EP-4000L and EP-4000S. The adhesive disclosed by the invention can be widely applied to sealing processes of USB ports and high-temperature-resistant reflow soldering processes, has good bonding performance on PA46, stainless steel, PC and the like, and ensures excellent waterproof sealing performance and plugging resistance of the USB ports of electronic products.
Owner:COLLTECH DONGGUAN BONDING TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products