A kind of high temperature resistant flexible one-component epoxy sealing adhesive and preparation method thereof

Abstract

The invention relates to the field of adhesives, in particular to a high-temperature-resistant flexible single-component epoxy sealing adhesive and a preparation method thereof. The high-temperature-resistant flexible single-component epoxy sealing adhesive is prepared from the following raw materials in parts by weight: 10-40 parts of epoxy resin, 10-30 parts of a mixed softening resin, 5-20 parts of an active diluent, 5-20 parts of a mixed curing agent, 0.01-1 part of a polymerization inhibitor, 0.1-5 parts of fumed silica, 0.01-1 part of an infiltration flow promoter and 5-30 parts of spherical silica powder, the mixed curing agent is a mixture of a modified amine latent heat curing agent and a modified imidazole latent heat curing agent, and the mixed softening resin is prepared from at least two of F100, F300, Capa3050, H2004, HEF750, HEF751, EP-4000L and EP-4000S. The adhesive disclosed by the invention can be widely applied to sealing processes of USB ports and high-temperature-resistant reflow soldering processes, has good bonding performance on PA46, stainless steel, PC and the like, and ensures excellent waterproof sealing performance and plugging resistance of the USB ports of electronic products.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a high-temperature-resistant flexible one-component epoxy sealing adhesive and a preparation method thereof. Background technique [0002] With the increasing emphasis on environmental protection and the development of electronic components in the direction of high density and miniaturization, the requirements for the performance of electronic packaging materials are also getting higher and higher. The rapid development of mobile Internet technology has enabled China to quickly enter the Internet era, and people's needs in various aspects such as food, clothing, housing, and transportation can be met through the Internet platform. The basis for realizing the mobile Internet society is ubiquitous electronic devices. These devices include mobile phones, notebook computers, tablet computers, and vehicle-mounted systems, etc. The development of portable and easy-to-carry electronic devices ...

AI Technical Summary

Problems solved by technology

At present, most of the commonly used sealing and waterproofing of USB ports on the market use addition-type silica gel or epoxy adhesives with high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE). Although the addition type can meet the process of high-temperature reflow soldering requirements, but the bonding strength of silica gel is extremely low, and usually can only reach a thrust of about 120N; while high Tg, low CTE epoxy adhesives can meet the requirements, but the yield rate is not high when reflowing at high temperature

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