Low-modulus epoxy resin system and preparation method thereof

Abstract

The invention belongs to the technical field of electronic packaging materials, and particularly relates to a low-modulus epoxy resin system and a preparation method thereof. The low-modulus epoxy resin system of the invention comprises the following main components: epoxy resin, a polymercaptan curing agent, a tertiary amine curing accelerator and the like, and has the characteristics of low curing temperature, adjustable gel reaction speed, low modulus of curing products, and adjustable modulus by the addition of inorganic fillers. The low-modulus epoxy resin system can be used as a substrate resin of electronic packaging materials such as bottom fillers, encapsulation agents, chip adhesives and the like for reducing packaging internal stress, and has wide application prospects in the electronic packaging field.

Description

technical field [0001] The invention belongs to the technical field of microelectronic packaging materials, and in particular relates to a low-modulus epoxy resin system and a preparation method thereof. Background technique [0002] Epoxy resin has the advantages of excellent adhesion, good thermal stability and electrical insulation, low curing shrinkage, light weight, and low cost, and has been widely used in microelectronic packaging. Epoxy resin-based composite materials are used Used as underfill material (Underfill) to increase the reliability of flip-chip interconnection; epoxy molding compound is widely used in the molding and encapsulation process of various electronic packaging products to provide various protection for electronic products. In recent years, with the continuous reduction of the size of the integrated circuit manufacturing process, the integration and performance of the electronic system have been continuously improved. However, the signal delay cau...

AI Technical Summary

Problems solved by technology

Compared with traditional dielectric materials, low dielectric constant materials have less mechanical strength and poorer bonding strength, while existing packaging materials such as underfills and molding compounds have larger moduli, when they When directly applied to the packaging of copper / low dielectric constant material process devices, the internal stress generated by the excessive modulus of the packaging material will lead to the destruction of the low dielectric constant material layer, advanced packaging (such as stacked chip packaging, through silicon vias ( TSV) technology, etc.) may also warp or crack due to excessive internal stress in the package

In order to solve the problem of excessive modulus of packaging materials, the researchers tried to reduce the overflow angle and height of the underfill material to reduce the stress of the packaging system and improve the reliability of the package. Cannot completely fill the space between the chip and the substrate, which may cause performance degradation or even package failure due to the intrusion of moisture and other impurities into the packaging system

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