31results about How to "Lower curing reaction temperature" patented technology

The invention provides a high-temperature resistant halogen-free fire-resistant adhesive used in flexible copper-clad baseplates and a preparation method thereof. The adhesive consists essentially of aromatic amine modified bismaleimide performed polymer, phosphorus epoxy resin, chemigum, phenolic resin, inorganic filler, a curing catalyst and a solvent. The preparation method comprises the steps that: first of all, toluene is taken as the solvent; under the reflow temperature of the toluene, aromatic diamine, aniline and bismaleimide polymerize to obtain a aromatic amine modified bismaleimide performed polymer solution which is then added with the phosphorus epoxy resin and then added with the chemigum, the phenolic resin, the inorganic filler, the curing catalyst and the solvent after chemical reaction or physical mixture so as to form the high-temperature resistant halogen-free fire-resistant adhesive which is used for bonding the polyimide film and copper foil of the flexible copper-clad baseplate; the prepared flexible copper-clad baseplate has excellent heat resistance, flame resistance, dimensional stability and comparatively high peeling strength.

The invention provides a high-strength high-permeability chemical sand prevention agent, and a preparation method and an application thereof. The high-strength high-permeability chemical sand prevention agent is composed of a proppant, a cementing agent, an accelerator, a curing agent and a coupling agent according to a certain ratio. The preparation method comprises the following steps: above raw materials are mixed at a specific temperature, and are stirred, and the obtained mixture is cured for a certain period of time to obtain the high curing strength sand prevention agent. The sand prevention agent has good tolerance to acid, water, salt and oil, has high stability in high temperature and high humidity environment, and is mainly used in chemical sand prevention well extract production, serious casing deformation well sand prevention, and sand prevention of wells without mechanical sand prevention and oil water wells with low reservoir temperature in order to increase liquid production of the oil well, prolong the period of validity of well sand prevention, increase the amount of oil and reduce the production cost.

The invention relates to a poly-amino-bismaleimide resin composite, a preparation method and the applications thereof in copper clad plates. The composite essentially consists of a poly-amino-bismaleimide resin, a phosphorous epoxy, a cyanate resin, a novolac epoxy resin, an inorganic stuffing, a curing catalyst and a solvent. The poly-amino-bismaleimide resin in use is pre-polymerized from bismaleimide and aromatic amine under the reflow temperature with toluene as the solvent. The poly-amino-bismaleimide resin composite used in copper clad plates has good processing properties, low curing temperature (195 DEG C) and short high temperature curing time (1 to 1.5 hours). The prepared copper clad plates have excellent heat resistance, with the vitrification transition temperature ranging from 204 DEG C to 230 DEG C, good fire retardant effect, comparatively high peeling strength, bending strength and comparatively low water absorption ratio.

The invention relates to the field of epoxy resin production, in particular to an epoxy resin system and a preparation method thereof. The epoxy resin system is prepared from, by weight, 85-95 parts of bisphenol-F epoxy resin, 0-10 parts of bisphenol-A epoxy resin, 0-5 parts of toughening agents, 5-7 parts of latent curing agents and 1-3 parts of accelerators. The preparation method is simple, easy to operate, strong in scientificity and applicable to industrial production.

The invention relates to a high-toughness flame-retardant medium-and-low-temperature cured epoxy resin system and a preparation method thereof. The high-toughness flame-retardant medium-and-low-temperature cured epoxy resin system is composed of silicon-phosphorus-nitrogen containing hyperbranched polysilicophosphate, bisphenol A type epoxy resin, tetraglycidyl amine type epoxy resin and an anhydride curing agent. The silicon-phosphorus-nitrogen synergistic flame retardant with the hyperbranched structure contains various flame retardant elements at the same time, the active terminal primary amine group of the silicon-phosphorus-nitrogen synergistic flame retardant can directly participate in a curing crosslinking reaction of epoxy resin and has good compatibility with a resin matrix, andmeanwhile, an Si-O-Si flexible chain segment is introduced into the epoxy resin, so that the toughness of the resin system is effectively improved. A tertiary amine functional group in the hyperbranched polysilicophosphate plays a role in promoting resin curing, can promote the reaction between an anhydride curing agent and epoxy resin, has a certain catalytic effect on curing, and can complete acuring reaction at a relatively low temperature. The system has a wide application prospect in the aspects of flame retardance of coatings, textiles, furniture, buildings and thermosetting resins.

The invention belongs to the technical field of electronic packaging materials, and particularly relates to a low-modulus epoxy resin system and a preparation method thereof. The low-modulus epoxy resin system of the invention comprises the following main components: epoxy resin, a polymercaptan curing agent, a tertiary amine curing accelerator and the like, and has the characteristics of low curing temperature, adjustable gel reaction speed, low modulus of curing products, and adjustable modulus by the addition of inorganic fillers. The low-modulus epoxy resin system can be used as a substrate resin of electronic packaging materials such as bottom fillers, encapsulation agents, chip adhesives and the like for reducing packaging internal stress, and has wide application prospects in the electronic packaging field.

The invention relates to a polyphenyl ether resin composition and application thereof. The composition specifically comprises hydroxyl-terminated polyphenyl ether, cyanate ester, hydroxyl-terminated polybutadiene, an organic metal salt catalyst, an organic acid promoter as well as an inorganic filler, a flame retardant and an organic solvent. Compared with the prior art, the polyphenyl ether resincomposition has the advantages that a reaction temperature for curing hydroxyl-terminated polybutadiene and cyanate ester can be greatly reduced by introducing the organic acid promoter, cyanate ester resin further can be prevented from being crystallized and separated out from a glue solution, and storage stability of the glue solution is improved; and hydroxyl-terminated polybutadiene is introduced, so that a copper-clad plate prepared from the resin composition effectively improves toughness and solvent resistance, and further improves adhesive property of a copper foil.

The invention provides a light pressure-resistant buoyancy material for a deep submergence vehicle and a preparation method of the buoyancy material. The buoyancy material is prepared from, in parts by mass, 50-60 parts of bisphenol-A epoxy resin, 20-40 parts of a reinforced modifier, 10-20 parts of a low-viscosity modifier, 40-60 parts of a first curing agent, 2-8 parts of a second curing agent and 30-40 parts of hollow glass beads, wherein the reinforced modifier is hexahydrophthalic diglycidyl ester, the low-viscosity modifier is neopentyl glycol diglycidyl ether, the first curing agent is a liquid-state organic acid anhydride curing agent, and the second curing agent is a liquid-state imidazole curing agent. The prepared light pressure-resistant buoyancy material for the deep submergence vehicle has the density of 0.50-0.57 g/cm<3>, the compression strength reaching 40-60 MPa and the isostatic hydrostatic pressure water absorption rate smaller than 1% and can meet requirements of the deep sea submergence vehicle at 3,000-5,000 m underwater.

The invention discloses an ultralow-temperature curable epoxy anticorrosive coating. The ultralow-temperature curable epoxy anticorrosive coating is composed of a component A and a component B; the component A consists of film-forming resin, an auxiliary agent, filler, pigment and deionized water, wherein the film-forming resin consists of 25-45 parts of bisphenol F epoxy resin and 20-40 parts ofsilane modified epoxy resin, the weight parts of the auxiliary agent are 2-4 parts, the filler comprises 15-25 parts of nano silicon dioxide and 2-10 parts of lignocelluloses, the pigment is 3-5 partsof titanium dioxide, and the weight parts of the deionized water are 10-20 parts; and the component B is a curing agent and is composed of 3-10 parts of phenolic amine, 2-5 parts of ethylenediamine,2-5 parts of polyamide and 5-10 parts of deionized water. Through the formula system, climate tolerance of the coating can be effectively improved, cracking is prevented, and the coating has the advantages of good corrosion resistance and relatively high adhesive force. The used curing agent is a mixed curing system taking the phenolic amine as a main body, so that the reaction speed of epoxy resin can be effectively accelerated, the curing reaction temperature is reduced, and consumption of curing energy is reduced.

The invention discloses an epoxy polyester orange-figure powder coating and a preparation method thereof and belongs to the field of chemical engineering and solves the problem that a proper oil absorbency cannot be provided as a conventional epoxy polyester orange-figure powder coating uses single filler. The coating is prepared from the following raw materials in parts by weight: 20-22 parts ofepoxy resin, 29-30 parts of polyester resin, 6-7 parts of titanium dioxide, 9-11 parts of barium sulfate, 27-30 parts of calcium carbonate, 1-1.5 parts of an electric power increaser, 1-1.2 parts of adry powder flowing agent, 1-1.2 parts of a wetting dispersant, 0.5-0.8 part of benzoin, 0.1-0.2 part of a phenol accelerant, 0.3-0.5 parts of an antioxidant and 0.04-0.06 part of a pigment. The product design is free of any curing agent. Based on a way of matching filler with different oil absorbencies as a design concept, the raw materials are environment-friendly and non-toxic, and the coatingdoes not harm the physical health of constructors and is an environment-friendly product.

The present invention provides a modified epoxy resin prepared from the following raw materials in parts by mass: 1.5-3 parts of a saturated polyester resin and 7-8.5 parts of an epoxy resin. The modified epoxy resin is a colorless and transparent solid, the modified epoxy resin epoxy equivalent is 900g / eq to 1050g / eq, and the softening point is 90-100 DEG C. The modified epoxy resin has good mechanical properties, and good chemical resistance. The present invention further provides a preparation method of the modified epoxy resin, the preparation method is simple, with the introduction of active groups with low temperature curing activity, the activation energy of the curing reaction is reduced, the curing reaction temperature of powder coating can be reduced, performances of the unsaturated polyester ester resin and epoxy resin can be complementary, energy is saved, and environmental pollution is reduced.

The invention belongs to the technical field of fiberboard materials, particularly relates to a high-density fiberboard with an antibacterial function and a manufacturing process of the high-density fiberboard, and solves the problems that in the prior art, the antibacterial effect of a high-density fiberboard is poor and not lasting. The high-density fiberboard with an antibacterial function comprises the following raw materials in parts by weight: 30-50 parts of wood chips, 30-50 parts of straws, 15-25 parts of a polyethylene-maleic anhydride copolymer, 10-20 parts of poly (p-phenylene benzobisoxazole) fibers, 4-10 parts of solid paraffin, 3-5 parts of an adhesive, 3-7 parts of an antibacterial agent, 1-3 parts of carboxymethylcellulose and 2-5 parts of methyl tetrahydrophthalic anhydride. The high-density fiberboard with the antibacterial function is scientific in formula, rigorous in proportion, simple in preparation process and mild in preparation condition, and the obtained high-density fiberboard with the antibacterial function has excellent antibacterial performance and mechanical performance, almost does not release formaldehyde in the using process, is safe and environmentally-friendly and can be widely applied.