Large-volume and room-temperature cured epoxy resin glue filling material

An epoxy resin, room temperature curing technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve problems such as harmful gas leakage, achieve good sealing performance, low gas leakage rate, and good sealing effect Effect

Inactive Publication Date: 2019-05-21
63653 FORCES PLA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In underground engineering, cable troughs are used to lay and shield electromagnetic signals, but there are certain gaps between cables and between cables and steel plates in cable troughs, which can easily become channels for harmful gas leakage

Method used

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  • Large-volume and room-temperature cured epoxy resin glue filling material
  • Large-volume and room-temperature cured epoxy resin glue filling material
  • Large-volume and room-temperature cured epoxy resin glue filling material

Examples

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Embodiment and comparative example

[0036] Weigh 100 parts of epoxy resin, 12 parts of dibutyl phthalate, 8 parts of acetone, 4.15 parts of triethylenetetramine and 20 parts of DMP-30. Put epoxy resin, dibutyl phthalate and acetone into the mixing tank first, stir continuously with a mixer at low speed for 3~5min, then pour triethylenetetramine and DMP-30 into the mixing tank, stir quickly for 5min, and finally pour Put it into a steel channel of 50cm×50cm×50cm. Insert a pt100 thermal resistance temperature probe in the center of the steel tank, and use a paperless recorder to continuously monitor the curing reaction temperature. The curing time is measured by indentation method. When the probe cannot penetrate the surface of the sample, it is considered cured; digital viscosity is adopted The tester measures the viscosity of the epoxy glue. Put the above glue into a 10cm×10cm×10cm mold, and test its compressive strength under standard curing conditions. The quality of epoxy resin is 0.5kg, 2.5kg, 12.5kg, 60kg...

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Abstract

The invention discloses a large-volume and room-temperature cured epoxy resin glue filling material which is divided into glue filling formulas of different quality grades and can reach a maximum of grade 150 kg. The formula of grade 150 kg is prepared by the following raw materials by weight: 100 parts by weight of epoxy resin, 12 parts by weight of dibutyl phthalate, 8 parts by weight of acetone, 4.15% of triethylene tetramine and 0.2 percent of DMP-30. The epoxy resin glue filling material disclosed by the invention adopts a manner of mechanical mixing and stirring of bisphenol A epoxy resin, a non-reactive diluent, a fatty amine curing agent and an accelerant at a normal temperature; through performing an amplification experiment step by step, the dosages of a diluent and a curing agent are optimized; on the premise of ensuring the appropriate curing time, the curing reaction temperature is reduced to below 55 DEG C, so that the curing reaction heat and the curing temperature riseare greatly reduced, and the problem of high explosive polymerization possibility of the epoxy resin in the normal-temperature curing under large volume is solved.

Description

technical field [0001] The invention belongs to the field of building materials, and relates to a large-volume, room-temperature-cured and low-temperature-rising epoxy resin potting material, which is mainly used for dense filling of large-volume cable gaps and large-volume hole projects in underground engineering, and plays a role in sealing and anti-seepage role. Background technique [0002] In underground engineering, cable troughs are used to lay and shield electromagnetic signals, but there are certain gaps between cables and between cables and steel plates in cable troughs, which can easily become channels for harmful gas leakage. Epoxy resin potting materials have excellent mechanical properties, electrical insulation properties and stable chemical properties. At the same time, due to its simple preparation process and easy molding, it has been widely used in the fields of potting of electronic circuits, device insulation and moisture resistance. Through the invest...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/00C08G59/50
Inventor 不公告发明人
Owner 63653 FORCES PLA
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