Epoxy resin system and preparation method thereof
An epoxy resin system and epoxy resin technology, applied in the field of epoxy resin system and its preparation, can solve the problems of surface stickiness, irritating taste, etc., and achieve the effects of increased toughness, simple operation, and simple preparation method
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Embodiment 1
[0023] The preparation method of epoxy resin system is realized through the following steps:
[0024] (1) Mix 85-95 parts of bisphenol F epoxy resin, 0-10 parts of bisphenol A epoxy resin and 0-5 parts of toughening agent by weight and heat to 80°C-90°C. Stir until a clear liquid is obtained, then cool down to room temperature for later use;
[0025] (2) Add 5-7 parts of latent curing agent and 1-2 parts of accelerator to the liquid obtained in step (1) by weight, and then stir with a high-speed dispersing disc until there is no powder and no particles larger than 1mm exist;
[0026] (3) Grinding the liquid obtained in step (2) with a three-roll mill for at least three times to obtain the final product, namely the epoxy resin system;
[0027] Wherein the standard of each part by weight in step (1) and step (2) is the same.
[0028] The epoxy equivalent of the bisphenol F type epoxy resin selected above can be 50-1000g / mol, and the viscosity at 25°C is 200cps-10000cps. As a ...
Embodiment 2
[0036] The specific steps are the same as in Example 1, except that in step (1), 88-92 parts of bisphenol F epoxy resin, 3-8 parts of bisphenol A epoxy resin and 1-3 parts of The toughening agent is mixed and heated to 83°C-87°C, stirring while heating until a transparent liquid is obtained, and then cooled to room temperature for later use; polyalcohol, polymer elastomer and polyurethane elastomer mixture are used as tougheners; imidazoles and A mixture of dicyandiamide is used as a latent curing agent; a mixture of triphenylphosphine and triphenylphosphine salt is used as an accelerator.
Embodiment 3
[0038] The specific steps are the same as in Example 1, except that in step (1), 90 parts by weight of bisphenol F type epoxy resin, 5 parts of bisphenol A type epoxy resin and 2 parts of toughening agent are mixed and heated to 85 ℃, stirring while heating until a clear liquid is obtained, and then cooled to room temperature for later use; thermoplastic resins are used as toughening agents; organic acid hydrazides are used as latent curing agents; organic carboxylates are used as accelerators.
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