Poly(amino bimaleimide) resin composition, preparation and use thereof in copper clad laminate

Abstract

The invention relates to a poly-amino-bismaleimide resin composite, a preparation method and the applications thereof in copper clad plates. The composite essentially consists of a poly-amino-bismaleimide resin, a phosphorous epoxy, a cyanate resin, a novolac epoxy resin, an inorganic stuffing, a curing catalyst and a solvent. The poly-amino-bismaleimide resin in use is pre-polymerized from bismaleimide and aromatic amine under the reflow temperature with toluene as the solvent. The poly-amino-bismaleimide resin composite used in copper clad plates has good processing properties, low curing temperature (195 DEG C) and short high temperature curing time (1 to 1.5 hours). The prepared copper clad plates have excellent heat resistance, with the vitrification transition temperature ranging from 204 DEG C to 230 DEG C, good fire retardant effect, comparatively high peeling strength, bending strength and comparatively low water absorption ratio.

Description

technical field [0001] The invention relates to a polyurethane bismaleimide resin composition and a preparation method thereof in the field of polymer materials, in particular to a high-temperature resistant halogen-free flame-retardant polyurethane bismaleimide composition applied to copper-clad laminates things. technical background [0002] With the rapid development of the electronics industry, electronic products tend to develop in the direction of short, thin, high density and high reliability, which not only puts forward higher requirements for the heat resistance of printed circuit It also puts forward environmental protection requirements for the flame retardancy of printed circuit boards. [0003] In recent years, some patents and publications have reported some high-temperature-resistant flame-retardant adhesive formulations, such as European patent EP 424135, which discloses copolymerization of bismaleimide, aromatic diamine and tribromophenyl monomaleimide The...

AI Technical Summary

Problems solved by technology

However, the additive-type organic phosphorus-containing flame retardants inevitably have some disadvantages, such as organic flame retardants are easily dissolved or extracted by organic solvents during processing; the addition of organic phosphorus flame retardants will lead to some performance degradation of copper clad laminates , such as moisture resistance, heat resistance and electrical performance reduction, etc.

[0006] Chinese Patent Publication No. CN 1297618C, published on January 31, 2007, the name of the invention is a halogen-free flame-retardant adhesive for laminates. The application discloses a composition of benzoxazine, phosphorous epoxy resin, Adhesives composed of phenolic resins and / or cyanate resins and inorganic fillers have good heat resistance and meet the requirements of halogen-free flame retardancy. However, their glass transition temperature is about 180°C, which is difficult to meet the requirements of higher heat-resistant materials. need

Japanese patent JP 2001294689 discloses a halogen-free flame-retardant adhesive composed of bismaleimide, cyanate resin and inorganic flame-retardant filler, which has high heat resistance and excellent electrical properties, but must meet UL94V-0 A large amount of inorganic flame retardant fillers need to be added for the flame retardant effect of the grade. Due to the low viscosity of bismaleimide and cyanate resin and the presence of a large amount of inorganic fillers, the wettability of the adhesive to the glass fiber cloth is poor, and a large amount of Inorganic fillers can also make PCB processability worse

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