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67results about How to "Low in free phenols" patented technology

Method for preparing environmentally-friendly adhesive for lignin-based timber

The invention discloses a method for preparing an environmentally-friendly adhesive for a lignin-based timber. The method comprises the following steps of: 1) adding phenol, formaldehyde solution, lignin, first alkali liquor and diluting water into a reactor, heating to the temperature of between 75 and 85 DEG C and reacting for 2.5 to 3.5 hours, wherein the molar ratio of formaldehyde to the phenol is 2.20:1-2.40:1; the formaldehyde solution is added for three times in a mass ratio of 1.5 to 1.0 to 1.0; and the reaction time ratio of the added formaldehyde solution is 1.2 to 1.0 to 1.0; 2) cooling to 70 DEG C, adding a formaldehyde collector and second alkali liquor, and reacting at the temperature of between 65 and 70 DEG C for 20 to 50 minutes; and 3) cooling to the temperature of between 30 and 40 DEG C, adding an intensifier, stirring for 10 to 30 minutes, cooling and discharging. In the method, a 50 to 60 percent petroleum-based phenol raw material can be substituted; the methodis stable in reaction, easy to control and easy for industrial production; formaldehyde emission of a plywood reaches E0 level; adhesive strength meets the requirements of national class I plates; and a new approach is provided for the development of an environmentally-friendly biomass-based timber adhesive and recycling of wastes.
Owner:青岛生物能源与过程研究所

Method of preparing alkali lignin modified phenolic resin

A method for preparing alkali lignin modified phenol-formaldehyde resin comprises the following steps: phenol, a first batch of formaldehyde solution, alkali lignin, metal oxide and dilution water are added into a reactor; a second batch of formaldehyde solution is added into the reactor; and a third batch of formaldehyde solution and a first batch of alkaline solution are added, formaldehyde trapping agent and a second batch of alkaline solution are added, and then material is discharged after cooling. The invention adopts the copolymerization technique to prepare an alkali lignin phenol formaldehyde adhesive, lignin and the phenol are added simultaneously, obtained hydroxymethylated lignin is reacted with hydroxymethyl phenol, a small part of the obtained hydroxymethylated lignin participates in the polycondensation of the hydroxymethyl phenol to form a main chain, and a large part of the obtained hydroxymethylated lignin forms branch chains through graft copolymerization, therefore, the lignin is introduced into a molecular chain and the aim of modifying phenol-formaldehyde resin is achieved. The invention can replace the use of 30-50 percent of the phenol, realizes stable and easy reaction control and easy industrial production; the bonding strength satisfies the requirements of national I-level plates; formaldehyde release reaches E0 level; therefore, the invention provides a new approach to the development of environment-friendly biomass-based wood adhesive and resource utilization of waste materials.
Owner:INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY

Preparation method of anti-damping resin grinding wheel

The invention provides a preparation method of an anti-damping resin grinding wheel. The preparation method of the anti-damping resin grinding wheel comprises 0.5-1.0 mass part of silane coupling agent, 8-12 mass parts of phenolic resin liquid, 50-80 mass parts of 46# plated white corundum, 20-40 mass parts of 54# plated white corundum, 0.5-1.0 mass part of carbon black, 8-12 mass parts of potassium fluoroaluminate, 3-5 mass parts of calcium sulfate whiskers, and 18-23 mass parts of modified phenolic resin powder. Plated white corundum abrasives are adopted; high-temperature coating layers are arranged on the surfaces of the abrasives; the coating layers facilitate improvement of the resin and abrasive interface bonding strength; silane coupling agent molecules contain reaction radicals chemically bonded with inorganic matter materials, and reaction radicals chemically bonded with organic matter materials; inorganic and organic interfaces are bonded to promote the interface fusion to improve the performances; secondly, the modified phenolic resins adopted in the method contain no radicals easy to oxidize in molecular structures compared with general phenolic resins; and the free phenol content in the method is low, so that the performance degradation of hardened resins can be effectively relieved.
Owner:珠海泰达砂轮有限公司

Production method for electronic-grade phenolic resin

The invention discloses a production method for electronic-grade phenolic resin. The production method includes the steps as follows: suctioning 10%-20% total amount of formaldehyde solution into a reaction kettle with a vacuum method, adding catalyst, stirring for 4-6 minutes, adding phenol, starting increasing temperature after charging materials, starting timing when the temperature achieves 70-100 DEG C, continuously dropping 65%-75% total amount of the formaldehyde solution within 1-2 hours, conducting temperature-insulation reaction for 1-10 hours after dropping is finished, then continuously and totally dropping the residual formaldehyde solution within 1-2 hours, and finishing reaction after conducting temperature-insulation reaction for 1-2 hours after dropping is finished. By adding formaldehyde solution in batches to react and by washing, vacuum dewatering, distillation, second vacuum dewatering and final refining, the electronic-grade phenolic resin with high purity can be prepared. The phenolic resin produced by the method is low in impurity content, free phenol content and volatile matter content, has good electrical property and can serve as a curing agent for 'epoxy moulding compounds for encapsulating semiconductor devices and integrated circuits'.
Owner:LIANYUNGANG ZHONGHE SCI & TECH +1

Phenolic resin glue containing potassium ion alkali compound and preparation method thereof

The invention relates to phenolic resin glue containing a potassium ion alkali compound and a preparation method thereof. The phenolic resin glue containing the potassium ion alkali compound comprises the following components in percentage by weight: 19-23.5wt% of phenol, 36.5-41.5% of industrial formaldehyde with weight concentration of 37%, 0.8-12wt% of potassium ion alkali compound, 0-12wt% of extender and the balance of solvent. The preparation method comprises the following processing steps: 1) taking the components; 2) preparing the potassium ion alkali compound into solution with the weight concentration of 30% or 50%; 3) starting a stirrer, placing phenol, potassium ion alkali compound, formaldehyde with the weight concentration of 37%, extender and solvent into a reaction vessel, performing reaction for 1-3 hours, cooling to the temperature below 40 DEG C, and discharging, so that the phenolic resin glue containing the potassium ion alkali compound is obtained, wherein solid content of the phenolic resin glue is 36.5-45wt%, and viscosity determined under the condition of coating four cups of the phenolic resin is 17-90 seconds. The phenolic resin glue containing the potassium ion alkali compound has the advantages that bonding strength is high, cost is low (phenol raw material amount is less), content of free phenol and free formaldehyde in the phenolic resin glue containing the potassium ion alkali compound is low, environmental performance is good, and the traditional phenolic resin glue can be replaced.
Owner:刘启明

Method of preparing alkali lignin modified phenolic resin

InactiveCN101492522BAdequate responseTo achieve the purpose of modifying phenolic resinAldehyde/ketone condensation polymer adhesivesResource utilizationAdhesive
A method for preparing alkali lignin modified phenol-formaldehyde resin comprises the following steps: phenol, a first batch of formaldehyde solution, alkali lignin, metal oxide and dilution water are added into a reactor; a second batch of formaldehyde solution is added into the reactor; and a third batch of formaldehyde solution and a first batch of alkaline solution are added, formaldehyde trapping agent and a second batch of alkaline solution are added, and then material is discharged after cooling. The invention adopts the copolymerization technique to prepare an alkali lignin phenol formaldehyde adhesive, lignin and the phenol are added simultaneously, obtained hydroxymethylated lignin is reacted with hydroxymethyl phenol, a small part of the obtained hydroxymethylated lignin participates in the polycondensation of the hydroxymethyl phenol to form a main chain, and a large part of the obtained hydroxymethylated lignin forms branch chains through graft copolymerization, therefore, the lignin is introduced into a molecular chain and the aim of modifying phenol-formaldehyde resin is achieved. The invention can replace the use of 30-50 percent of the phenol, realizes stable and easy reaction control and easy industrial production; the bonding strength satisfies the requirements of national I-level plates; formaldehyde release reaches E0 level; therefore, the invention provides a new approach to the development of environment-friendly biomass-based wood adhesive and resource utilization of waste materials.
Owner:INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY

Preparation method of urea-phenol-formaldehyde resin adhesive used for E0 grade solid wood composite floorboard

The invention discloses a preparation method of a urea-phenol-formaldehyde resin adhesive used for an E0 grade solid wood composite floorboard. In the first step, a formaldehyde solution, phenol and urea are mixed, an oxide or salt of divalent metal ion is added, or an alkali metal hydroxide is added, a heating reaction is carried out, wherein, the mol ratio of formaldehyde to the total amount of phenol and urea is 0.72-0.82; in the second step, the formaldehyde solution, urea and the alkali metal hydroxide are added, the mol ratio of formaldehyde to the total amount of phenol and urea is 1.03-1.13; in the third step, the formaldehyde solution and the alkali metal hydroxide are added, and the mol ratio of formaldehyde to the total amount of phenol and urea is 1.05-1.20; and in the fourth step, urea and the alkali metal hydroxide are added, and the final mol ratio of formaldehyde to the total amount of phenol and urea is 0.95-1.03, and a reaction is carried out until the viscosity can reach the requirement. The glue storage life is greater than 30 days. The plywood strength of the solid wood composite floorboard compacted by the glue accords with an II type plywood requirement.
Owner:INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY

Modified phenolic resin adhesive and preparation method and application thereof and preparation method of bamboo-wood composite board

The invention provides a modified phenolic resin adhesive and a preparation method thereof. Tea polyphenol is used for replacing part of phenol; and through combination of the effects of two modifyingagents, the obtained phenolic resin adhesive is high in viscosity, so that quick impregnation of bamboos can be realized, high gluing strength is achieved, firm bonding between bamboo boards and woodboards can be realized, the glue sucking quantity is increased without prolonging the impregnation time, and reduction of the energy consumption is facilitated. Results of the embodiment show that when the modified phenolic resin adhesive is adopted to prepare bamboo-wood composite boards, the water content of the bamboos is only controlled within the range from 25% to 45% without enabling the bamboo water content to be below 6%, so that the composite boards meeting corresponding performance requirements can be obtained. The invention further provides a preparation method of the bamboo-wood composite boards; and the modified phenolic resin adhesive is used as impregnation liquid, and a centrifugal impregnation mode is adopted to dehydrate the bamboos during impregnating, so that impregnation can be realized in a high-moisture state, and the bamboo drying energy consumption is saved.
Owner:FUJIAN HEQIZU FORESTRY SCI & TECH CO LTD +1

Modified thermoplastic phenolic resin adhesive used in automobile brake pad and preparation method thereof

The invention provides a modified thermoplastic phenolic resin adhesive used in automobile brake pads and a preparation method thereof. The adhesive is prepared from following components, by weight: 100 parts of phenols, 73-80 parts of aldehydes, 0.05-0.08 parts of acids, 1-7 parts of nano organic modified montmorillonite, 2-4 parts of D-glucose and 1-7 parts of dialdehydes. The preparation method comprises following steps: (A) adding the nano organic modified montmorillonite and the acid into a reaction container according to ratio and stirring the mixture for 30 min at 50-60 DEG C; (B) increasing the temperature to 90-100 DEG C, adding 73-80 parts of aldehydes to the reaction liquid within 60-90 min, and continuously performing the reaction with temperature maintained for 30-60 min; (C) adding 2-4 parts of D-glucose to the reaction liquid, and performing a reaction for 10-20 min at 90-100 DEG C; (D) adding 1-7 parts of dialdehydes to the reaction liquid,, and performing a reaction at 90-100 DEG C for 25-40 min; and (E) starting a vacuum pump to control the pressure in the reaction container to be -0.08 MPa, and performing dehydration for 5 h to prepare the modified thermoplastic phenolic resin adhesive. The method increases the heat resistance and toughness of phenolic resin and reduces the contents of free phenols and volatiles in the resin.
Owner:ZHEJIANG HANGMO SYNTHETIC MATERIAL

Halide-containing brake material and preparation method and application thereof

The invention relates to a halide-containing brake material and a preparation method and application thereof, and belongs to the technical field of brake materials. The preparation method comprises the following steps: adding aromatic alcohol phenolic resin, butadiene rubber, feldspar powder, argil, kaolin, calcined petroleum coke powder and halide into a mixer according to a proportion, mixing and stirring for 20-25min, then adding carbon fibers, potassium titanate whiskers and magnesium borate whiskers according to a proportion, and mixing and stirring for 12-18min until the mixture is uniform to obtain the halide-containing brake material; and placing a steel backing and the brake material into a mold for compression molding, placing the mold into an oven for heating and curing after demolding, and finally machining to obtain an automobile brake pad or a rail transit vehicle brake pad. The friction material of the automobile brake pad and the rail transit vehicle brake pad is particularly suitable for a brake disc with a dual material being aluminum alloy, the porosity of a microporous material is large, the hardness is low, and damage to the brake disc is reduced. The microporous material and the aluminum alloy brake disc are high in heat dissipation speed, the working temperature of a friction pair can be reduced, and the friction pair can bear larger load.
Owner:SHANGHAI REINPHEN NEW MATERIAL TECH CO LTD

Phenol-polyaldehyde prepolymer modified environment-friendly phenolic resin and preparation method thereof

The invention relates to a phenol-polyaldehyde prepolymer modified environment-friendly phenolic resin and a preparation method thereof. The phenolic resin in the method is prepared from phenol, formaldehyde and a phenol-polyaldehyde prepolymer through catalytic synthesis. The preparation method comprises the following steps: synthesizing the phenol-polyaldehyde prepolymer from a polyaldehyde monomer and phenol at a certain temperature in the presence of a catalyst; and introducing the phenol-polyaldehyde prepolymer into a phenolic resin system. The introduction of the phenol-polyaldehyde prepolymer increases the aldehyde equivalent in the system, and can effectively decrease the free phenol content in the resin; and the replacement of part of the formaldehyde with the polyaldehyde can effectively decrease the free formaldehyde content in the resin. Besides, the long-chain structure of the phenol-polyaldehyde prepolymer can enhance the flexibility of the phenolic resin and reduce the internal stress in the curing process, so that a pressed sheet has favorable adhesion strength and can meet the requirements for Class I waterproof plywood. The phenolic resin prepared by the invention has the advantages of low free phenol/free aldehyde content, simple process and the like, and is applicable to the field of production of functional environment-friendly artificial boards.
Owner:BEIJING UNIV OF CHEM TECH
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