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Phenolic resin glue containing potassium ion alkali compound and preparation method thereof

A phenolic resin glue and compound technology, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesives, adhesive types, etc., can solve the problems of high free phenol content, high price and high cost, and achieve low free phenol content. , The effect of wide gluing range and high gluing strength

Inactive Publication Date: 2014-06-18
刘启明
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Phenolic resin glue is a wood adhesive with excellent properties. The boards made of it have high bonding strength, weather resistance, water resistance, and heat resistance. It is one of the important types of glue in the wood industry. However, it also has shortcomings. , high cost (phenol accounts for 30% of the weight of the glue), expensive, high free phenol content in the glue, not environmentally friendly, and harmful to the human body. In addition, due to the high price of phenol, the cost of phenolic resin glue has greatly increased, affecting its However, it is predicted that the output of phenolic resin glue for the wood industry will reach 1 million tons (that is, the amount of phenol used will reach 300,000 tons) during the "Twelfth Five-Year Plan" period.
With the continuous exploitation of petroleum resources, petroleum resources are becoming increasingly tense, and the price of petroleum resources has risen rapidly, resulting in a continuous rise in the price of petroleum products, which greatly increases the cost of chemical products that use petroleum products as raw materials, and greatly affects sales. More than 10,000 yuan / ton at present. Due to the rise in the price of phenol, the price of phenolic resin glue with phenol as raw material has risen sharply, making it difficult for users to accept

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Embodiment 1: the preparation method of the phenolic resin glue containing potassium ion basic compound:

[0012] Weigh each component according to the weight of the following components (weight unit gram or kilogram): 349.6 grams of industrial phenol, 629.6 grams of industrial formaldehyde with a weight concentration of 37%, 100 grams of potassium hydroxide, 62 grams of potassium silicate, and 380 grams of water. Dissolve potassium hydroxide in water and cool it for later use, and add the rest of the raw materials into the reaction bottle according to the above ratio. After stirring well, add potassium hydroxide aqueous solution, control the temperature to rise to 90°C within 1 hour, keep the temperature for 45 minutes, and then cool to 40°C to discharge. , which is the phenolic resin glue containing potassium ion basic compound, the solid content of the glue is 40.8%, the viscosity is measured by coating 4 cups (25°C) for 90 seconds, and it is used to press poplar plyw...

Embodiment 2

[0013] Embodiment 2: the preparation method of the phenolic resin glue containing potassium ion basic compound:

[0014] Take the following components in proportion: 349.6 grams of industrial phenol, 629.6 grams of industrial formaldehyde with a weight concentration of 37%, 165.5 grams of potassium hydroxide, 50 grams of potassium carbonate, and 551.7 grams of water. Dissolve potassium hydroxide and potassium carbonate in water for cooling After mixing for later use, add the rest of the raw materials into the reaction bottle according to the above ratio, stir well, add potassium hydroxide mixed aqueous solution, control the temperature to rise to 90°C within 1 hour, keep warm for 35 minutes, cool to 40°C and discharge the material to contain potassium. Phenolic resin glue of ionic basic compound, the solid content of the glue is 36.5%, and the viscosity is measured as 35 seconds by coating 4 cups (25°C). Use this glue to impregnate the glass fiber cloth, dry it at low temperat...

Embodiment 3

[0015] Embodiment 3: the preparation method of the phenolic resin glue containing potassium ion basic compound:

[0016] Take by weighing the following components in proportion: 300 grams of industrial phenol, 540 grams of industrial formaldehyde with a weight concentration of 37%, 10 grams of potassium hydroxide, 50 grams of sodium hydroxide, 50 grams of urea, and 350 grams of water, according to the method described in Example 1 , mix and dissolve potassium hydroxide and sodium hydroxide in water, cool, mix and set aside, add the remaining raw materials into the reaction flask according to the above ratio, stir well, add potassium hydroxide mixed solution, and react at a temperature of 60°C for 0.5 hours, Then heat up to 90°C and keep it warm for 0.5 hours, then cool to 40°C and discharge, which is the phenolic resin glue containing potassium ion basic compound. Second. Use this glue to press poplar particle board, its internal bonding strength reaches 0.6MPa, water absorpt...

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Abstract

The invention relates to phenolic resin glue containing a potassium ion alkali compound and a preparation method thereof. The phenolic resin glue containing the potassium ion alkali compound comprises the following components in percentage by weight: 19-23.5wt% of phenol, 36.5-41.5% of industrial formaldehyde with weight concentration of 37%, 0.8-12wt% of potassium ion alkali compound, 0-12wt% of extender and the balance of solvent. The preparation method comprises the following processing steps: 1) taking the components; 2) preparing the potassium ion alkali compound into solution with the weight concentration of 30% or 50%; 3) starting a stirrer, placing phenol, potassium ion alkali compound, formaldehyde with the weight concentration of 37%, extender and solvent into a reaction vessel, performing reaction for 1-3 hours, cooling to the temperature below 40 DEG C, and discharging, so that the phenolic resin glue containing the potassium ion alkali compound is obtained, wherein solid content of the phenolic resin glue is 36.5-45wt%, and viscosity determined under the condition of coating four cups of the phenolic resin is 17-90 seconds. The phenolic resin glue containing the potassium ion alkali compound has the advantages that bonding strength is high, cost is low (phenol raw material amount is less), content of free phenol and free formaldehyde in the phenolic resin glue containing the potassium ion alkali compound is low, environmental performance is good, and the traditional phenolic resin glue can be replaced.

Description

technical field [0001] The invention relates to a phenolic resin glue containing a potassium ion basic compound and a preparation method thereof, belonging to the technical field of phenol-formaldehyde resin glue production. Background technique [0002] Phenolic resin glue is a wood adhesive with excellent properties. The boards made of it have high bonding strength, weather resistance, water resistance, and heat resistance. It is one of the important types of glue in the wood industry. However, it also has shortcomings. , high cost (phenol accounts for 30% of the weight of the glue), expensive, high free phenol content in the glue, not environmentally friendly, and harmful to the human body. In addition, due to the high price of phenol, the cost of phenolic resin glue has greatly increased, affecting its However, it is predicted that the production of phenolic resin glue for the wood industry will reach 1 million tons (that is, the amount of phenol used will reach 300,000 ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/10C08G8/10
Inventor 刘启明刘超刘纲
Owner 刘启明
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