Light pressure-resistant buoyancy material for deep submergence vehicle and preparation method of buoyancy material
A technology of buoyancy materials and submersibles, which is applied in the field of marine engineering materials, can solve problems such as excessive buoyancy structure size, insufficient net buoyancy, and obstacles to submersible exploration, and achieve solidification at medium temperature, increase stirring efficiency, and excellent miscibility Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0025] Example 1:
[0026] Prepare light-weight pressure-resistant buoyancy materials for deep-sea submersibles according to the proportions in Table 1. The specific preparation methods are as follows:
[0027] (1) Measured in parts by mass, take 56 parts of bisphenol A epoxy resin, 14 parts of low viscosity modifier, 30 parts of reinforcing modifier, 50 parts of liquid organic acid anhydride curing agent and 4 parts of liquid imidazole The curing agent is added to the mixing container with stirring and turning, and stirred evenly to obtain a resin glue with low viscosity characteristics;
[0028] (2) Measured in parts by mass, take 32 parts of the dried hollow glass beads and add them to the mixer, and then add the resin glue obtained above into the mixer and stir in vacuum;
[0029] (3) The stirring process temperature is room temperature 25℃~30℃, the stirring speed is slowly increased from 0r / min to 30r / min, and the rising speed is controlled to increase by 1r / min every 2 seconds. ...
Example Embodiment
[0039] Example 2:
[0040] Prepare light-weight pressure-resistant buoyancy materials for deep-sea submersibles according to the proportions in Table 3. The specific preparation methods are:
[0041] (1) Measured in parts by mass, take 60 parts of bisphenol A epoxy resin, 20 parts of low viscosity modifier, 20 parts of reinforcing modifier, 45 parts of liquid organic anhydride curing agent and 6 parts of liquid imidazole The curing agent is added to the mixing container with stirring and turning, and evenly stirred to obtain a resin glue with low viscosity characteristics;
[0042] (2) Measured in parts by mass, take 33 parts of the dried hollow glass beads and add them to the mixer, and then add the resin glue obtained above into the mixer, and stir in vacuum;
[0043] (3) The stirring process temperature is room temperature 25℃~30℃, the stirring speed is slowly increased from 0r / min to 30r / min, and the rising speed is controlled to increase by 1r / min every 2 seconds. Start timing w...
Example Embodiment
[0053] Example 3:
[0054] Prepare light-weight pressure-resistant buoyancy materials for deep-sea submersibles according to the proportions in Table 5. The specific preparation methods are as follows:
[0055] (1) Measured in parts by mass, take 52 parts of bisphenol A epoxy resin, 10 parts of low viscosity modifier, 38 parts of reinforcing modifier, 55 parts of liquid organic acid anhydride curing agent and 3 parts of liquid imidazole The curing agent is added to the mixing container with stirring and turning, and stirred evenly to obtain a resin glue with low viscosity characteristics;
[0056] (2) Measured in parts by mass, take 32 parts of the dried hollow glass microbeads and add them to the mixer, and then add the resin glue obtained above into the mixer and stir in vacuum;
[0057] (3) The stirring process temperature is room temperature 25℃~30℃, the stirring speed is slowly increased from 0r / min to 30r / min, and the rising speed is controlled to increase by 1r / min every 2 seco...
PUM
Property | Measurement | Unit |
---|---|---|
Particle size | aaaaa | aaaaa |
Density | aaaaa | aaaaa |
Compressive strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap