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Low-temperature preparation method of polyimide coated optical fiber

A technology of polyimide coating and polyamic acid, which is applied in the direction of cladding optical fiber, glass optical fiber, optical waveguide and light guide, etc., can solve the problem of high curing reaction temperature and achieve the effect of reducing the curing reaction temperature

Inactive Publication Date: 2019-07-12
徐圣最
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Aiming at the deficiencies of the prior art, the present invention provides a low-temperature preparation method of polyimide-coated optical fiber, which solves the preparation method of polyimide-coated optical fiber in the prior art. During the preparation process, there are The technical problem of relatively high curing reaction temperature

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] S101. Add 50mL N,N-dimethylformamide to the reactor equipped with stirrer and condenser tube, feed N 2 Protect, heat up to 40°C, add 10.8g of phenylenediamine into the reactor, stir until completely dissolved, and slowly add 21.8g of pyromellitic dianhydride into the reactor at a temperature of 50°C and a stirring rate of 120r / min, After the addition is complete, react at a temperature of 40°C and a stirring rate of 120r / min for 1h to prepare polyamic acid;

[0025] S102. Add 20g of maleic anhydride monomer to the reactor in step S101, react at a temperature of 80°C and a stirring rate of 120r / min for 1h, and then react at a temperature of 180°C and a stirring rate of 120r / min for 3h to prepare get viscous liquid;

[0026] S103. Repeatedly washing the viscous liquid in step S102 with absolute ethanol to remove the organic solvent N,N-dimethylformamide;

[0027] S104. Add the viscous liquid in step S103 to 15mL PDADMAC, stir evenly, and prepare polyamic acid slurry;

...

Embodiment 2

[0031] S101. Add 50mL N,N-dimethylformamide to the reactor equipped with stirrer and condenser tube, feed N 2 Protect, heat up to 65°C, add 10.8g of phenylenediamine into the reactor, stir until completely dissolved, and slowly add 21.8g of pyromellitic dianhydride into the reactor at a temperature of 50°C and a stirring rate of 120r / min, After the addition is complete, react at a temperature of 65°C and a stirring rate of 120r / min for 1h to prepare polyamic acid;

[0032] S102. Add 20g of maleic anhydride monomer to the reactor in step S101, react at a temperature of 80°C and a stirring rate of 120r / min for 1h, and then react at a temperature of 180°C and a stirring rate of 120r / min for 3h to prepare get viscous liquid;

[0033] S103. Repeatedly washing the viscous liquid in step S102 with absolute ethanol to remove the organic solvent N,N-dimethylformamide;

[0034] S104. Add the viscous liquid in step S103 to 30mL PDADMAC, stir evenly, and prepare polyamic acid slurry;

...

Embodiment 3

[0038] S101. Add 50mL N,N-dimethylformamide to the reactor equipped with stirrer and condenser tube, feed N 2 Protect, heat up to 50°C, add 10.8g of phenylenediamine into the reactor, stir until completely dissolved, and slowly add 21.8g of pyromellitic dianhydride into the reactor at a temperature of 50°C and a stirring rate of 120r / min, After the addition is complete, react at a temperature of 50°C and a stirring rate of 120r / min for 1h to prepare polyamic acid;

[0039] S102. Add 20g of maleic anhydride monomer to the reactor in step S101, react at a temperature of 80°C and a stirring rate of 120r / min for 1h, and then react at a temperature of 180°C and a stirring rate of 120r / min for 3h to prepare get viscous liquid;

[0040]S103. Repeatedly washing the viscous liquid in step S102 with absolute ethanol to remove the organic solvent N,N-dimethylformamide;

[0041] S104. Add the viscous liquid in step S103 to 20mL PDADMAC, stir evenly, and prepare polyamic acid slurry;

...

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Abstract

The invention relates to the technical field of preparation of polyimide coated optical fibers, and discloses a low-temperature preparation method of a polyimide coated optical fiber, which comprisesthe following steps: taking pyromellitic dianhydride and phenylenediamine as raw materials, and synthesizing polyimide acid in an N, N-dimethyl formamide solvent; adding a maleic anhydride photocuringinitiator into the polyimide acid, and carrying out an ultraviolet photocuring reaction on polyamic acid slurry adhered to an optical fiber with a PDADMAC binder under the irradiation of ultravioletlight at the temperature of 80 DEG C under an ultraviolet lamp with the wavelength of 365 nm to generate a polyimide coating, so as to prepare the polyimide coated optical fiber. The technical problemthat the curing reaction temperature is relatively high in the preparation process of the preparation method of the polyimide coated optical fiber in the prior art is solved.

Description

technical field [0001] The invention relates to the technical field of preparation of polyimide-coated optical fibers, in particular to a low-temperature preparation method of polyimide-coated optical fibers. Background technique [0002] The main structure of optical fiber includes core layer, cladding layer and coating layer. The application stability and service life of the optical fiber are closely related to the coating. Ordinary optical fiber is coated with UV-cured acrylic resin, and its service temperature is -60C~85℃. If you work in an environment higher than 85°C for a long time, ordinary UV-cured coatings will undergo thermal aging, especially in the presence of O 2 Thermal oxygen aging will occur in the existing environment, which will accelerate the fracture process of the polymer chain of the coating, so that the coating loses its function of protecting the optical fiber, that is, it cannot prevent water molecules from invading the optical fiber, and accelera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/02
CPCG02B6/02395
Inventor 徐圣最
Owner 徐圣最
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