High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof

Abstract

The invention provides a high-temperature resistant halogen-free fire-resistant adhesive used in flexible copper-clad baseplates and a preparation method thereof. The adhesive consists essentially of aromatic amine modified bismaleimide performed polymer, phosphorus epoxy resin, chemigum, phenolic resin, inorganic filler, a curing catalyst and a solvent. The preparation method comprises the steps that: first of all, toluene is taken as the solvent; under the reflow temperature of the toluene, aromatic diamine, aniline and bismaleimide polymerize to obtain a aromatic amine modified bismaleimide performed polymer solution which is then added with the phosphorus epoxy resin and then added with the chemigum, the phenolic resin, the inorganic filler, the curing catalyst and the solvent after chemical reaction or physical mixture so as to form the high-temperature resistant halogen-free fire-resistant adhesive which is used for bonding the polyimide film and copper foil of the flexible copper-clad baseplate; the prepared flexible copper-clad baseplate has excellent heat resistance, flame resistance, dimensional stability and comparatively high peeling strength.

Description

technical field [0001] The invention relates to a high-temperature-resistant halogen-free flame-retardant adhesive in the field of fine chemicals and a preparation method thereof, in particular to a polymer adhesive used for bonding polyimide films and copper foils in flexible copper-clad substrates. technical background [0002] With the rapid development of the modern electronic information industry, electronic equipment is developing towards integration, miniaturization and high reliability; at the same time, people also put forward higher demands for electronic products such as short, small, light, thin and excellent comprehensive performance. Therefore, the circuit board base material used for electronic equipment and products has changed from the traditional hard copper clad substrate to the lighter and thinner flexible copper clad substrate. [0003] Flexible copper clad substrates can be divided into two-layer boards and three-layer boards according to whether there ...

AI Technical Summary

Problems solved by technology

Although this type of adhesive has achieved good flame retardant effect and high peel strength, it has the disadvantage of poor high temperature resistance. Adding phosphorus-containing flame retardants can achieve good flame retardant effects

The addition of additive-type organic phosphorus-containing flame retardants inevitably has some disadvantages, such as organic flame retardants are easily dissolved or extracted by organic solvents during processing; the addition of organic phosphorus flame retardants will lead to some performance degradation of the substrate , such as moisture resistance, heat resistance reduction, etc.

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