High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof

A technology of copper-clad substrates and flame-retardant adhesives, which is applied in the direction of adhesives, adhesive types, conjugated diene adhesives, etc., and can solve the problems of poor high temperature resistance, moisture resistance, heat resistance, and substrate performance degradation and other problems, to achieve the effects of reducing adverse effects, improving solubility, and improving high temperature solder resistance

Inactive Publication Date: 2008-12-17
WUHAN TEXTILE UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this type of adhesive has achieved good flame retardant effect and high peel strength, it has the disadvantage of poor high temperature resistance. Adding phosphorus-containing flame retardants can achieve good flame retardant effects
The addition of additive-type organic phosphorus-containing flame retardan

Method used

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  • High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof
  • High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof
  • High temperature resistant halogen-free flame-retardant adhesive for flexible copper clad foil substrate and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Embodiment 1. Get 5 grams of bismaleimide (in the bismaleimide structure, R 1 for -O-, R 2 , R 3 Both are -H), 1.42 grams of aromatic diamine (in the structure of aromatic diamine, R 4 for -O-, R 5 , R 6 Both are -H), 0.14 grams of aniline and 10 grams of toluene are heated to transparency in a 100 milliliter three-necked bottle with a stirrer, a condenser and a temperature sensor (industrially it can be enlarged to 100 liters of reactor production). , reacted at reflux temperature for 30 minutes, discharged after cooling, and with 100 gram phosphorus-containing epoxy resin (phosphorus content is 2.55%), 40 gram liquid end carboxyl nitrile rubber, 30 gram phenol type phenolic resin (polymerization degree is 3 ), 40 grams of aluminum hydroxide, 0.2 grams of 2-ethyl-4-methylimidazole, and finally add 200 grams of butanone and mix evenly to obtain a high-temperature-resistant halogen-free flame-retardant adhesive for flexible copper-clad laminates.

[0061] Apply this...

Embodiment 2

[0062] Embodiment 2. Get 2 kilograms of bismaleimide (in the bismaleimide structure, R 1 for -CH 2 -, R 2 , R 3 Both are -H), 0.51 kg of aromatic diamine (in the structure of aromatic diamine, R 4 for -O-, R 5 , R 6 Both are -CH 3 ), 8 grams of aniline and 3 kilograms of toluene were heated to transparency in a 10-liter three-necked flask with a stirrer, a condenser and a temperature sensor, and reacted at reflux temperature for 20 minutes, and discharged after cooling, and mixed with 10 kilograms of Phosphorus epoxy resin (phosphorus content is 3.66%), 3.5 kilograms of liquid carboxy-terminated nitrile rubber, 0.5 kilograms of bisphenol A type phenolic resin (polymerization degree is 4), 4 kilograms of aluminum hydroxide and 1 kilogram of silicon dioxide, 10 grams 2-Methylimidazole, and finally add 25 kg of acetone and 25 kg of methyl ethyl ketone and mix evenly to obtain a high-temperature-resistant halogen-free flame-retardant adhesive for flexible copper-clad laminat...

Embodiment 3

[0064] Embodiment 3. Get 1 kilogram of bismaleimide (in the bismaleimide structure, R 1 for -CH 2 -, R 2 , R 3 Both are -C 2 h 5 ), 0.24 kg of aromatic diamine (in the structure of aromatic diamine, R 4 for -O-, R 5 , R 6 All are-H), 11.1 grams of aniline and 2 kilograms of toluene, after being heated to transparent in 5 liters of three-neck bottles with stirrer, condenser, temperature sensor, react 35 minutes at reflux temperature, discharge after cooling, and With 6.5 kilograms of phosphorus-containing epoxy resin (phosphorus content is 4.3%), 2.5 kilograms of liquid end carboxyl nitrile rubber, 0.13 kilograms of cresol type phenolic resin (polymerization degree is 4), 2.25 kilograms of aluminum hydroxide and 1 kilogram of basic carbonic acid Aluminum sodium, 0.13 kg of 2-ethylimidazole, and finally 20 kg of butanone and 3.4 kg of toluene were added and mixed evenly to obtain a high-temperature-resistant halogen-free flame-retardant adhesive for flexible copper clad l...

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PUM

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Abstract

The invention provides a high-temperature resistant halogen-free fire-resistant adhesive used in flexible copper-clad baseplates and a preparation method thereof. The adhesive consists essentially of aromatic amine modified bismaleimide performed polymer, phosphorus epoxy resin, chemigum, phenolic resin, inorganic filler, a curing catalyst and a solvent. The preparation method comprises the steps that: first of all, toluene is taken as the solvent; under the reflow temperature of the toluene, aromatic diamine, aniline and bismaleimide polymerize to obtain a aromatic amine modified bismaleimide performed polymer solution which is then added with the phosphorus epoxy resin and then added with the chemigum, the phenolic resin, the inorganic filler, the curing catalyst and the solvent after chemical reaction or physical mixture so as to form the high-temperature resistant halogen-free fire-resistant adhesive which is used for bonding the polyimide film and copper foil of the flexible copper-clad baseplate; the prepared flexible copper-clad baseplate has excellent heat resistance, flame resistance, dimensional stability and comparatively high peeling strength.

Description

technical field [0001] The invention relates to a high-temperature-resistant halogen-free flame-retardant adhesive in the field of fine chemicals and a preparation method thereof, in particular to a polymer adhesive used for bonding polyimide films and copper foils in flexible copper-clad substrates. technical background [0002] With the rapid development of the modern electronic information industry, electronic equipment is developing towards integration, miniaturization and high reliability; at the same time, people also put forward higher demands for electronic products such as short, small, light, thin and excellent comprehensive performance. Therefore, the circuit board base material used for electronic equipment and products has changed from the traditional hard copper clad substrate to the lighter and thinner flexible copper clad substrate. [0003] Flexible copper clad substrates can be divided into two-layer boards and three-layer boards according to whether there ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/00C09J109/02C09J161/06
Inventor 赵三平徐卫林
Owner WUHAN TEXTILE UNIV
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