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Polyphenyl ether resin composition and application thereof

A technology of polyphenylene ether resin and composition, which is applied in synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of insufficient curing and crosslinking, high viscosity, poor processing performance, etc. Storage stability, high Tg, toughness enhancement effect

Active Publication Date: 2019-05-14
SHANGHAI RES INST OF MATERIALS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the viscosity of conventional polyphenylene ether resin is too high, and the processing performance is poor. At the same time, polyphenylene ether is a thermoplastic resin, which cannot be fully cured and cross-linked to form a stable structure with high heat resistance.

Method used

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  • Polyphenyl ether resin composition and application thereof
  • Polyphenyl ether resin composition and application thereof
  • Polyphenyl ether resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-6 comparative example 1-3

[0046] Fully dissolve hydroxyl-terminated polyphenylene ether, cyanate resin, and hydroxyl-terminated polybutadiene in toluene solution, and then mix them evenly with inorganic filler, flame retardant, organic metal salt catalyst, and organic acid accelerator to obtain polyphenylene ether Toluene solution of the resin composition.

[0047] Immerse the NE glass cloth (Nittobo Co., Ltd., NEA2116) into the resin composition, and bake it at 120°C for 8 minutes to remove the solvent, so that the volatile matter is less than 1%, and the gel time of the resin is about 160s to obtain the resin A prepreg with a content of about 65%.

[0048] Cover each side of 8 overlapping prepregs with an inverted copper foil, hot press at 180°C and a pressure of 3.0MPa for 90min, and then press at 220°C for 120min to obtain a double-sided copper-clad laminate .

[0049] Polyphenylene ether SA90 and cyanate resin CE01MO are common models on the market.

[0050] Wherein specific embodiment result i...

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Abstract

The invention relates to a polyphenyl ether resin composition and application thereof. The composition specifically comprises hydroxyl-terminated polyphenyl ether, cyanate ester, hydroxyl-terminated polybutadiene, an organic metal salt catalyst, an organic acid promoter as well as an inorganic filler, a flame retardant and an organic solvent. Compared with the prior art, the polyphenyl ether resincomposition has the advantages that a reaction temperature for curing hydroxyl-terminated polybutadiene and cyanate ester can be greatly reduced by introducing the organic acid promoter, cyanate ester resin further can be prevented from being crystallized and separated out from a glue solution, and storage stability of the glue solution is improved; and hydroxyl-terminated polybutadiene is introduced, so that a copper-clad plate prepared from the resin composition effectively improves toughness and solvent resistance, and further improves adhesive property of a copper foil.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a polyphenylene ether resin composition that can be used for preparing high-frequency copper-clad laminates and applications thereof. Background technique [0002] With the rapid development of the electronics industry, the requirements for the performance of copper clad laminates are getting higher and higher, especially the three major portable electronic products, satellite transmission and communication electronic products are developing in the direction of miniaturization, high frequency and high speed. Especially in the field of high-frequency and high-speed mobile communications, with the development of 5G signal transmission, the speed of signal transmission must be faster and faster, and the frequency of signals is also higher and higher. Therefore, printed circuits as signal transmission carriers are required The plate material must have a low dielectric constant, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L79/04C08L47/00C08L25/06C08K3/36C08K5/03C08K5/523C08J5/24B32B27/28B32B15/20B32B15/08
Inventor 段家真金石磊侯李明李小慧韩瑞
Owner SHANGHAI RES INST OF MATERIALS CO LTD
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