Method for preparing reinforcing epoxy resin material capable of being fast cured at medium/low temperature
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 佛山市沃隆化工有限公司
- Publication Date
- 2014-02-05
- Estimated Expiration
- Not applicable · inactive patent
Abstract
Description
technical field
[0001] The invention discloses a method for preparing an epoxy resin material for medium and low temperature rapid curing reinforcement. It belongs to the field of material technology, and specifically relates to a mixture of resin component A and curing agent component B, wherein resin component A is composed of epoxy resin and epoxy diluent, and curing agent component B is composed of curing agent and accelerator A method for preparing an epoxy resin material for medium and low temperature rapid curing reinforcement composed of an agent. Background technique
[0002] Epoxy resin is a synthetic resin widely used in many fields. It has excellent mechanical properties, bonding properties, heat resistance, and dimensional stability. It is widely used in structures, aerospace, adhesives, coatings and other fields. Since the 1990s, my country's epoxy resin industry has developed rapidly, but its production capacity only accounts for 9% of the world's total produ...