Method for preparing reinforcing epoxy resin material capable of being fast cured at medium/low temperature

An epoxy resin and rapid curing technology, which is applied in the field of preparation of epoxy resin materials for medium and low temperature rapid curing reinforcement, can solve the problems of accelerated reaction progress, few types of epoxy resin, product defects, etc., to ensure dimensional stability, Moderate curing temperature and excellent heat resistance

Inactive Publication Date: 2014-02-05
佛山市沃隆化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the 1990s, my country's epoxy resin industry has developed rapidly, but its production capacity only accounts for 9% of the world's total production capacity, and the epoxy resins produced are few in variety and poor in quality. needs
However, the epoxy resin room temperature curing system often reacts too slowly, the efficiency is too low, and the mechanical properties of the cured product are poor
While high temperature curing accelerates the progress of the reaction, it often causes a large amount of energy consumption and various defects and damages of the product.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Configuration of component A: Preheat 75 parts by mass of epoxy resin and 25 parts by mass of epoxy diluent to 60-70°C for 20-30 minutes, and seal and store the obtained resin component A;

[0021] Configuration of component B: heat 25 parts by mass of triethylenetetramine and 2 parts by mass of tertiary amine accelerator to 50-70°C, stir evenly, and seal and store the obtained curing agent component B;

[0022] Mix the resin component A and the curing agent component B with each other, mechanically stir for 60 minutes, and finally vacuum defoam for 60 minutes, heat until the epoxy resin solution is completely cured, and after demolding, the epoxy resin system for rapid curing and reinforcement is obtained.

Embodiment 2

[0024] Configuration of component A: Preheat 95 parts by mass of epoxy resin and 5 parts by mass of epoxy diluent to 60-70°C for 20-30 minutes, and seal and store the obtained resin component A;

[0025] Configuration of component B: heat 40 parts by mass of hydroxymethylethylenediamine and 8 parts by mass of phenolic accelerator to 50-70°C, stir evenly, and seal and store the obtained curing agent component B;

[0026] Mix the resin component A and the curing agent component B with each other, mechanically stir for 60 minutes, and finally vacuum defoam for 30 minutes, heat until the epoxy resin solution is completely cured, and after demolding, the epoxy resin system for rapid curing and reinforcement is obtained.

Embodiment 3

[0028] Configuration of component A: Preheat 85 parts by mass of epoxy resin and 15 parts by mass of epoxy diluent to 60-70°C for 20-30 minutes, and seal and store the obtained resin component A;

[0029] Configuration of component B: heat 35 parts by mass of hydroxymethylethylenediamine and 5 parts by mass of imidazole accelerator to 50-70°C, stir evenly, and seal and store the obtained curing agent component B;

[0030] Mix the resin component A and the curing agent component B with each other, stir mechanically for 60 minutes, and finally vacuum defoam for 40 minutes, heat until the epoxy resin solution is completely cured, and after demolding, the epoxy resin system for rapid curing and reinforcement is obtained.

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Abstract

The invention discloses a method for preparing a reinforcing epoxy resin material capable of being fast cured at medium / low temperature and belongs to the technical field of materials. The epoxy resin material is characterized in that the epoxy resin material is formed by mixing a resin component A and a curing agent component B, wherein the resin component A consists of epoxy resin and an epoxy diluent; the curing agent component B consists of a curing agent and an accelerant. The method comprises the following steps: uniformly mixing and stirring the component A and the component B, and performing vacuum defoamation treatment; pouring the components into a preheated die, heating the components under the vacuumizing condition until the components are completely cured, thus obtaining the reinforcing epoxy resin system capable of being fast cured. The problems that the epoxy resin product is high in energy consumption during high-temperature curing and the dimensional accuracy of the product is difficultly controlled are solved. The composite material prepared by the method has the advantages of being fast cured and low in manufacturing cost. The method is simple and feasible in operation; the cured product is high in strength, excellent in heat resistance and high in adhesive property and is particularly suitable for repairing and reinforcing various equipment, pipelines and other epoxy resin composite material products.

Description

technical field [0001] The invention discloses a method for preparing an epoxy resin material for medium and low temperature rapid curing reinforcement. It belongs to the field of material technology, and specifically relates to a mixture of resin component A and curing agent component B, wherein resin component A is composed of epoxy resin and epoxy diluent, and curing agent component B is composed of curing agent and accelerator A method for preparing an epoxy resin material for medium and low temperature rapid curing reinforcement composed of an agent. Background technique [0002] Epoxy resin is a synthetic resin widely used in many fields. It has excellent mechanical properties, bonding properties, heat resistance, and dimensional stability. It is widely used in structures, aerospace, adhesives, coatings and other fields. Since the 1990s, my country's epoxy resin industry has developed rapidly, but its production capacity only accounts for 9% of the world's total produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08G59/50
Inventor 何宏伟丁敏高峰刘巧玲
Owner 佛山市沃隆化工有限公司
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