Method for preparing reinforcing epoxy resin material capable of being fast cured at medium/low temperature
An epoxy resin and rapid curing technology, which is applied in the field of preparation of epoxy resin materials for medium and low temperature rapid curing reinforcement, can solve the problems of accelerated reaction progress, few types of epoxy resin, product defects, etc., to ensure dimensional stability, Moderate curing temperature and excellent heat resistance
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Embodiment 1
[0020] Configuration of component A: Preheat 75 parts by mass of epoxy resin and 25 parts by mass of epoxy diluent to 60-70°C for 20-30 minutes, and seal and store the obtained resin component A;
[0021] Configuration of component B: heat 25 parts by mass of triethylenetetramine and 2 parts by mass of tertiary amine accelerator to 50-70°C, stir evenly, and seal and store the obtained curing agent component B;
[0022] Mix the resin component A and the curing agent component B with each other, mechanically stir for 60 minutes, and finally vacuum defoam for 60 minutes, heat until the epoxy resin solution is completely cured, and after demolding, the epoxy resin system for rapid curing and reinforcement is obtained.
Embodiment 2
[0024] Configuration of component A: Preheat 95 parts by mass of epoxy resin and 5 parts by mass of epoxy diluent to 60-70°C for 20-30 minutes, and seal and store the obtained resin component A;
[0025] Configuration of component B: heat 40 parts by mass of hydroxymethylethylenediamine and 8 parts by mass of phenolic accelerator to 50-70°C, stir evenly, and seal and store the obtained curing agent component B;
[0026] Mix the resin component A and the curing agent component B with each other, mechanically stir for 60 minutes, and finally vacuum defoam for 30 minutes, heat until the epoxy resin solution is completely cured, and after demolding, the epoxy resin system for rapid curing and reinforcement is obtained.
Embodiment 3
[0028] Configuration of component A: Preheat 85 parts by mass of epoxy resin and 15 parts by mass of epoxy diluent to 60-70°C for 20-30 minutes, and seal and store the obtained resin component A;
[0029] Configuration of component B: heat 35 parts by mass of hydroxymethylethylenediamine and 5 parts by mass of imidazole accelerator to 50-70°C, stir evenly, and seal and store the obtained curing agent component B;
[0030] Mix the resin component A and the curing agent component B with each other, stir mechanically for 60 minutes, and finally vacuum defoam for 40 minutes, heat until the epoxy resin solution is completely cured, and after demolding, the epoxy resin system for rapid curing and reinforcement is obtained.
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