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Electronic material glue solution and preparation method thereof

A technology of electronic materials and glue, which is applied in the direction of adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve the problems of glue viscosity increase, affecting processing performance, mechanical performance, etc., to achieve moderate curing temperature, Effects of life extension and high dielectric properties

Active Publication Date: 2022-03-22
中科检测技术服务(重庆)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high filling will lead to negative effects, such as a serious increase in the viscosity of the glue and a decrease in fluidity, which will affect the processing performance; in addition, the mechanical properties will also be affected

Method used

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  • Electronic material glue solution and preparation method thereof
  • Electronic material glue solution and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] An electronic material glue, which is made by mixing component A and curing agent in a weight ratio of 100:8. The component A is composed of the following raw materials in the following weight ratio: 80 parts of improved high thermal conductivity components, epoxy resin 10 parts, 1 part of coupling agent, 2 parts of viscosity modifier, 0.05 parts of catalyst, 1 part of dispersant and 1 part of toughening agent.

[0036] Specifically, the curing agent is 650 low molecular weight polyamide resin.

[0037] Specifically, the preparation method of the improved high thermal conductivity component includes the following steps:

[0038] S1: Grinding non-spherical alumina in a ball mill to obtain fine-grained alumina powder for later use;

[0039] S2: Put anhydrous ethanol: fine-grained alumina powder: silicone resin: Brunei glue in a mixer in a ratio of 30:6:1:1 to disperse evenly to make a spray liquid;

[0040] S3: Carry out spray granulation to the spray liquid, and then c...

Embodiment 2

[0053] An electronic material glue, which is formed by mixing component A and curing agent in a weight ratio of 100:10. The component A is composed of the following raw materials in the following weight ratio: 90 parts of improved high thermal conductivity components, epoxy resin 15 parts, 3 parts of coupling agent, 3 parts of viscosity modifier, 0.1 part of catalyst, 1.5 parts of dispersant and 2 parts of toughening agent.

[0054] Specifically, the curing agent is 650 low molecular weight polyamide resin.

[0055] Specifically, the preparation method of the improved high thermal conductivity component includes the following steps:

[0056] S1: Grinding non-spherical alumina in a ball mill to obtain fine-grained alumina powder for later use;

[0057] S2: Put anhydrous ethanol: fine-grained alumina powder: silicone resin: Brunei glue in a mixer in a ratio of 30:6:1:1 to disperse evenly to make a spray liquid;

[0058] S3: Carry out spray granulation to the spray liquid, and ...

Embodiment 3

[0071] An electronic material glue, which is made by mixing component A and curing agent in a weight ratio of 100:8.5. The component A is composed of the following raw materials in the following weight ratio: 85 parts of improved high thermal conductivity components, epoxy resin 12 parts, 1.5 parts of coupling agent, 2.3 parts of viscosity modifier, 0.07 parts of catalyst, 1.3 parts of dispersant and 1.3 parts of toughening agent.

[0072] Specifically, the curing agent is 650 low molecular weight polyamide resin.

[0073] Specifically, the preparation method of the improved high thermal conductivity component includes the following steps:

[0074] S1: Grinding non-spherical alumina in a ball mill to obtain fine-grained alumina powder for later use;

[0075] S2: Put anhydrous ethanol: fine-grained alumina powder: silicone resin: Brunei glue in a mixer in a ratio of 30:6:1:1 to disperse evenly to make a spray liquid;

[0076] S3: Carry out spray granulation to the spray liqui...

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Abstract

The invention relates to the technical field of electronic glue, in particular to an electronic material glue solution and a preparation method thereof. The high-thermal-conductivity modified epoxy resin is prepared by mixing a component A and a curing agent according to the weight ratio of 100: (8-10), and the component A is prepared from the following raw materials in parts by weight: 80-90 parts of an improved high-thermal-conductivity component, 10-15 parts of epoxy resin, 1-3 parts of a coupling agent, 2-3 parts of a viscosity modifier, 0.05-0.1 part of a catalyst, 1-1.5 parts of a dispersing agent and 1-2 parts of a toughening agent. The prepared electronic material glue solution is moderate in curing temperature and convenient to operate, the epoxy glue has the advantages of high heat-conducting property, high dielectric property, low viscosity and high filling amount after being cured, the preparation process is simple, and the epoxy glue has stronger protection capability when being applied to electronic packaging, so that the service life of an electronic appliance is correspondingly prolonged, and the practicability is good.

Description

technical field [0001] The invention relates to the technical field of electronic glue, in particular to an electronic material glue and a preparation method thereof. Background technique [0002] Thermally conductive adhesives are mostly used for bonding and packaging of electronic and electrical components in electrical insulation applications. With the development of integrated circuits and assembly technology in the electronics industry, the volume of electronic components and logic circuits tends to be miniaturized, and their development towards multi-functionalization and integration will inevitably result in a substantial increase in heat generation, which is harmful to bonding and The thermal conductivity of packaging materials puts forward very high requirements, so improving thermal conductivity is an increasingly urgent problem. [0003] There are two ways to improve the thermal conductivity of polymers: 1. Synthesize structural polymers with high thermal conduct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00C09J163/02C09J11/08
CPCC09J1/00C09J11/08C09J2203/326
Inventor 唐毅陈婷张熙胡洪伟张丽张颖
Owner 中科检测技术服务(重庆)有限公司
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