The invention relates to porous
ceramic for a high-air-permeability
semiconductor device as well as a preparation method and application of the porous
ceramic, raw materials comprise 35-55 wt% of
alumina powder and 10-55 wt% of a
polymer microsphere pore-forming agent, and the
polymer microsphere pore-forming agent comprises one or more of
agarose,
polylactic acid,
polyacrylamide and organic
silicon resin. The porous
ceramic for the high-air-permeability
semiconductor device, which is obtained by the preparation method provided by the invention, has relatively high
porosity and air permeability, and also has relatively high
mechanical strength and
dielectric strength. According to the present invention, the gas volume flow rate is applied to the internal pore size characterization, and the high
porosity and the high gas permeability can be achieved by accurately measuring the gas flow
transmittance, accurately characterizing the pore size and the opening degree in the porous ceramic, and adjusting the particle size and the addition amount of the
polymer microsphere pore forming agent; through the preparation process, the
porosity and
mechanical strength of the porous ceramic for the high-air-permeability
semiconductor device can be balanced, meanwhile, high air permeability and high
compressive strength are obtained, and the porous ceramic is particularly suitable for electrostatic chucks of different manufacture procedures.