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Low-shrinkage phenolic moulding compound

A phenolic molding compound and low-shrinkage technology, which is applied in the field of thermosetting plastics, can solve the problems of low shrinkage characteristics and lack of reference, and achieve the effect of improving strength and shrinkage resistance and improving mechanical strength

Active Publication Date: 2011-02-16
常熟东南塑料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The technical solution of the phenolic molding compound found in the Chinese patent literature is not limited to the preparation method of the phenolic molding compound disclosed in CN1105143C and the wear-resistant phenolic molding compound without sewage discharge and its preparation method introduced in CN1290923C, but these two The patent scheme is not technically referenceable for the planning of phenolic molding compounds with ideal low shrinkage characteristics

Method used

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  • Low-shrinkage phenolic moulding compound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 28.0 parts of thermoplastic novolac resins;

[0029] 2.0 parts of epoxy resin;

[0030] 5.0 parts of hexamethylenetetramine;

[0031] Alkali-free chopped glass fiber (length 3mm, diameter 11-13μm) 35.0 parts;

[0032] Cotton fiber (length is 1mm) 5.0 parts;

[0033] 15.0 parts of nano calcium carbonate;

[0034] 1.0 parts of silane coupling agent;

[0035] Zinc stearate 1.0 parts;

[0036] 1.3 parts of stearic acid;

[0037] 1.5 parts of magnesium oxide;

[0038] 2.0 parts of polyvinyl acetate;

[0039] Ink 1.4 parts.

[0040] During implementation, the thermosetting novolak molding resin and epoxy resin produced by the acid method are first pulverized to obtain powdery resin, and the various raw materials weighed above are mixed in a kneader with the powdery resin according to the formula requirements (kneading) to obtain the kneaded material, then the kneaded material is masticated on two rollers, the temperature is 95 ℃, masticated for 6min, after being shee...

example 2

[0042] 20 parts of thermoplastic novolac resins;

[0043] 5.0 parts of liquid phenolic resin;

[0044] 4.0 parts of hexamethylenetetramine;

[0045] Alkali-free chopped glass fiber (length 2.5mm, diameter 11-13μm) 50.0 parts;

[0046] Cotton fiber (length 0.8mm) 1.0 parts;

[0047] 4.3 parts of nanoscale talcum powder;

[0048] 10.7 parts of nanometer mica powder;

[0049] 0.5 part of titanate coupling agent;

[0050] 1.2 parts of aluminum stearate;

[0051] 0.5 parts of ethylene bis stearic acid amide;

[0052] Zinc oxide 0.2 parts;

[0053] 0.1 parts of slaked lime;

[0054] 3.0 parts of methyl methacrylate;

[0055] Ink 0.5 parts.

[0056] All the other are the same as the description to embodiment 1.

example 3

[0058] 35.0 parts of thermoplastic novolac resins;

[0059] 4.0 parts of thermosetting phenolic resin;

[0060] 3.0 parts of melamine resin;

[0061] 3.0 parts of unsaturated polyester;

[0062] 8.0 parts of hexamethylenetetramine;

[0063] Alkali-free chopped glass fiber (length 3.5mm, diameter 11-13μm) 30.0 parts;

[0064] Cotton fiber (length 1.2mm) 3.0 parts;

[0065] 10.0 parts of nanoscale talcum powder;

[0066] 5.0 parts of nanometer mica powder;

[0067] 5.0 parts of nanometer calcium carbonate;

[0068] 5.0 parts of nanoscale barium sulfate;

[0069] 0.5 part of silane coupling agent;

[0070] 0.8 part of titanate coupling agent;

[0071] 1.0 parts of calcium stearate;

[0072] Zinc stearate 1.5 parts;

[0073] 1.5 parts of magnesium stearate;

[0074] 1.0 parts of magnesium oxide;

[0075] 1.0 parts of slaked lime;

[0076] 0.25 part of polymethyl methacrylate;

[0077] 0.25 parts of polystyrene;

[0078] Ink 2.0 parts.

[0079] All the other are the ...

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Abstract

The invention discloses a low-shrinkage phenolic moulding compound, belonging to the technical field of thermosetting plastics. The low-shrinkage phenolic aldehyde moulding compound comprises the following raw materials in parts by weight: 20.0-35.0 parts of phenolic resin, 2.0-10.0 parts of thermosetting resin, 1.0-8.0 parts of curing agent, 0.2-2.0 parts of curing accelerator, 1.0-3.0 parts of lubricant, 30.0-50.0 parts of glass fiber, 1.0-10.0 parts of cotton fiber, 15.0-25.0 parts of nanoscale inorganic filler, 0.5-2.0 parts of coupling agent, and 0.5-4.0 parts of low shrinkage agent. In the technical scheme of the invention, the glass fibers and the cotton fibers are combined to improve mechanical strength, the strength and the shrinkage resistance of a material is improved completely by adopting the nanoscale inorganic filler and the adding the coupling agent and the low shrinkage agent, and the invention can meet the usage requirements of the industries of vehicles, electrical appliances, machineries and textiles on plastic products.

Description

technical field [0001] The invention belongs to the technical field of thermosetting plastics, in particular to a low-shrinkage phenolic molding compound. Background technique [0002] Phenolic molding compound is widely used because of its simple production process, easy availability of raw materials, low price and excellent comprehensive performance of injection molding products. Phenolic molding compound is made of phenolic resin as the matrix, supplemented with fillers and other additives such as curing agent through mixing and masticating. Because the phenolic molding compound in the prior art generally uses wood powder as a filler, its mechanical strength and dimensional stability are not ideal, thus restricting its application field. [0003] With the development of the automobile industry, the electrical industry and the textile industry, phenolic molding compounds with high mechanical strength and low shrinkage, that is, good dimensional stability, are more and mor...

Claims

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Application Information

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IPC IPC(8): C08L67/06C08L1/02C08K7/14C08L61/06C08K13/04C08L61/28C08L63/00
Inventor 王伟江王康建王可强唐轶雯
Owner 常熟东南塑料有限公司
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