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Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof

A composition and carboxyl technology, applied in chemical instruments and methods, aldehyde/ketone condensation polymer adhesives, printed circuit manufacturing, etc., can solve the problems of poor adhesion, poor processing performance, poor flexibility, etc. The effect of knot force, low equipment cost and low cost requirements

Active Publication Date: 2013-09-11
CHENGDU DO ITC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The linear polyester whose end group is hydroxyl (-OH) or carboxyl (-COOH) is formed by the condensation polymerization of aliphatic dibasic acid and aliphatic dihydric alcohol. Between 150,000, it has good compatibility and reactivity with polyimide, and without affecting the excellent heat resistance, mechanical properties, and electrical insulation properties of polyimide resin, it improves its poor flexibility and adhesion. Defects of poor junction and poor processability

Method used

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  • Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof
  • Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof
  • Composition, LED (light-emitting diode) circuit board substrate comprising same and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0070] At room temperature, in a 500ml three-neck flask, add 200g of dimethylformamide, then add 9.8g of m-phenylenediamine and 4.3g of 3,3-diaminodiphenyl ether sulfone, under nitrogen protection, stir at a medium speed to dissolve completely , then gradually add 5.1g bisphenol A type diether tetraacid dianhydride, 33.5g 5-hydroxytriphenyl ether tetraacid dianhydride, add 0.5h, then stir for 4h, then add 0.6g4-hydroxyphthalic anhydride, stir for reaction 2h, forming a viscous polyamic acid resin solution. Mix 2g of acetic anhydride and 2g of triethylamine in 5g of dimethylformamide, and then slowly add it into the polyamic acid resin solution with a constant pressure dropping funnel. After 0.2h, the reaction is stirred for 0.5h, and then the temperature is raised to 120°C, stirred for 2 hours and then cooled to room temperature to obtain a viscous polyimide resin solution.

Embodiment 2

[0072] At room temperature, in a 500ml three-neck flask, add 205g of dimethylacetamide, then add 8.0g of m-phenylenediamine, 4.3g of 3,3-diaminodiphenyl ether sulfone, 4.0g of 3,4-diaminodiphenyl ether, Under the protection of nitrogen, stir at a medium speed to dissolve completely, and then gradually add 5.1g bisphenol A type diether tetraacid dianhydride, 25.0g 5-hydroxytriphenyl ether tetraacid dianhydride, 6.4g triphenylene ether tetraacid dianhydride , After adding 0.5h, stir and react for 4h, then add 0.4g of 4-hydroxyphthalic anhydride, stir and react for 2h to form a viscous polyamic acid resin solution. Mix 2g of acetic anhydride and 2g of triethylamine in 8g of dimethylacetamide, and then slowly add it into the polyamic acid resin solution with a constant pressure dropping funnel. After 0.2h, the reaction is stirred for 0.5h, and then the temperature is raised to 120°C, stirred for 2 hours and then cooled to room temperature to obtain a viscous polyimide resin soluti...

Embodiment 3

[0074] At room temperature, in a 500ml three-neck flask, add 200g of dimethylformamide and dimethylacetamide (ratio of mass and number: 60:50), and then add 6.5g of m-phenylenediamine and 4.0g of 3,4-diaminodiamine Phenyl ether, 5.1 o-diaminobisphenol A, under the protection of nitrogen, stir at medium speed to dissolve completely, then gradually add 5.1g of bisphenol A type diether tetraacid dianhydride, 20.1g of 5-hydroxytriphenyl ether tetraacid dianhydride , 12.0g benzophenone tetra-acid dianhydride, 2.2g pyromellitic dianhydride, add 0.5h, then stir and react for 4h, then add 0.5g 4-hydroxyphthalic anhydride, stir and react for 2h to form a viscous polyamic acid resin solution. Mix 2g of acetic anhydride and 2g of triethylamine in 10g of dimethylformamide, and then slowly add it into the polyamic acid resin solution with a constant pressure dropping funnel. After 0.2h, the reaction is stirred for 0.5h, and then the temperature is raised to 120°C, stirred for 2 hours and ...

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Abstract

The invention discloses a composition comprising soluble polyimide resin, an LED (light-emitting diode) soft light bar circuit board substrate prepared by using the composition and a preparation method. The composition comprises soluble polyimide resin, linear polyester with the end group of hydroxyl or carboxyl, etherified methyl alcohol or ethyl alcohol melamine formaldehyde resin and a solvent; the LED soft light bar circuit board substrate is a double-sided substrate, and comprises two copper foils, wherein each side of each copper foil is coated with the composition coating layer; through solvent hot removal, a semi-solidified single-side copper coated plate is obtained. The semi-solidified coating layer surfaces of the two semi-solidified single-side copper coated plates are pressed side by side though a vacuum press, and are cured in a baking oven so as to prepare the LED soft light bar circuit board substrate. The composition provided by the invention can improve the bonding force of the composition and the copper foils; additionally, the components can form an interpenetration or semi-interpenetration network structure through the esterification, ester exchanging or ether exchanging reaction under the effects of hot and hot pressing or a cross-linking curing agent. The composition has high heat resistance and dimension stability, and simultaneously implements halogen-free flame retardance and high rupture property.

Description

technical field [0001] The invention relates to a composition, in particular to a composition of a soluble polyimide resin, a substrate for a circuit board of an LED flexible light bar containing the composition, and a method for manufacturing the substrate for a circuit board of a flexible LED light bar. Background technique [0002] In recent years, LED flexible light strips combined with FPC (flexible circuit board) technology have greatly promoted the rapid development of the LED lighting industry. Due to the relatively simple structure of the LED flexible light strip circuit board, the process requirements are lower than that of the traditional FPC. At the same time, the over-soldering (or packaging) process adopts reflow soldering, and the temperature does not exceed 280°C. Therefore, the heat resistance and dimensional stability requirements of materials are lower than those of traditional FPC. [0003] The use of new insulating adhesive layers of suitable materials ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L67/00C08L67/02C08L61/32C08G73/10C09D179/08C09D167/00C09D167/02C09D161/32H05K1/02H05K3/00F21V23/00B32B15/08B32B27/28B32B37/10C09J179/08C09J167/00C09J167/02C09J161/32C09D11/10F21Y101/02C09D11/102C09D11/103C09D11/104F21Y103/00F21Y115/10
Inventor 杨刚青志保伍旭云
Owner CHENGDU DO ITC NEW MATERIAL
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