Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same

A resin composition and thermosetting technology, which is applied in the fields of metal-clad laminates and printed circuit boards, prepregs, and thermosetting resin compositions. It can solve the problems of low crosslink density, low glass transition temperature, and high thermal expansion coefficient. Problems, to achieve excellent dielectric properties, low water absorption, low dielectric constant effect

Active Publication Date: 2019-04-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the cross-linking density of the double-end group multifunctional active ester resin and epoxy resin reaction is not high, and the PPO main chain in the middle is a thermoplas

Method used

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  • Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same
  • Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same
  • Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0109] Example 1-16

[0110] Examples 1-16 provide thermosetting resin composition glue, prepregs and copper clad laminates using the same. The preparation methods are as follows:

[0111] (1) Preparation of thermosetting resin composition glue:

[0112] Use MEK solvent to formulate component (B) phosphorus-containing curing agent, (C) co-curing agent and (D) phenoxy phosphazene compound SPB-100 into solutions with solid content of 60%, 50% and 25%, respectively. Add them to a 1000mL beaker, then add (A) halogen-free epoxy resin and (F) fillers in sequence, add an appropriate amount (E) curing accelerator 4-dimethylaminopyridine, and adjust the gelation time (GT) to 200- 300s, add MEK solvent to control the solid content to 65%, continue to stir for 2h to mature to obtain the thermosetting resin composition glue;

[0113] Among them, the type and amount of each component (in parts by weight) are shown in Table 1 and Table 2.

[0114] (2) Preparation of prepreg:

[0115] Prepare 6 piece...

Example Embodiment

[0153] In Example 10, an ester curing agent with the structure of formula I and phosphorus-containing bisphenol OL3001 were used to compound and cure 78 parts of dicyclopentadiene novolac epoxy resin HP-7200H, due to the amount of dicyclopentadiene novolac epoxy resin HP-7200H Exceeding the preferred dosage range will result in incomplete reaction, resulting in a decrease in the Tg of the final sheet, an increase in CTE and water absorption, poor dielectric properties and unsatisfactory heat resistance.

Example Embodiment

[0154] In Example 11, an ester curing agent with the structure of formula I and phosphorus-containing bisphenol OL3001 were used to compositely cure 38 parts of dicyclopentadiene novolac epoxy resin HP-7200H. The board has a higher Tg and a lower CTE, but due to Insufficient epoxy resin and excessive curing agent result in higher water absorption, poor dielectric properties and unsatisfactory heat resistance.

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Abstract

The invention provides a thermosetting resin composition, and a prepreg, a metal foil-coated laminated board and a printed circuit board using the same. The thermosetting resin composition includes anepoxy resin, a phosphorus-containing bisphenol, and an ester curing agent having a structure represented by formula I. The ester curing agent having the structure represented by the formula I and thephosphorus-containing bisphenol are used to synergistically cure the epoxy resin, and the phosphorus-containing bisphenol is used as the main curing agent, so the obtained cured epoxy resin has excellent dielectric properties, high heat resistance and high adhesion, and can realize no halogen and flame retardation; and the ester curing agent of the formula I is combined to make no polar groups such as secondary hydroxyl groups generated in the curing process, so excellent dielectric properties are ensured, the glass transition temperature of the cured product is significantly improved, and the cured product contains a large amount of hydrophobic groups, thereby the water absorption rate of the cured product is greatly reduced, and the dielectric constant and the dielectric loss factor ofthe cured product are stable. The produced laminated board and metal foil-coated laminated board have the advantages of good heat resistance, good moisture resistance, good peel strength, good dielectric properties and good flame retardancy.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a thermosetting resin composition and a prepreg using the same, a metal foil-clad laminate and a printed circuit board. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and the dielectric constant (Dk) and dielectric loss value (Df) are required to be lower and lower. Therefore, reducing Dk / Df has become the pursuit of the substrate industry. hotspot. At the same time, under the global trend of strengthening "green" and "environmental protection", the development of halogen-free flame-retardant copper-clad laminates has become a hot spot in the industry, and various copper-clad laminate manufacturers have launched their own halogen-free flame-retardant copper-clad laminates. foil laminate. [0003] In order to achieve low Dk / Df a...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/42C08J5/24B32B15/092B32B27/06B32B27/08B32B27/18B32B27/38H05K1/03
CPCB32B15/092B32B27/06B32B27/08B32B27/18B32B27/38B32B2457/08C08G59/4284C08G59/62C08J5/24C08J2363/00H05K1/0353
Inventor 游江林伟黄天辉
Owner GUANGDONG SHENGYI SCI TECH
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