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Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same

A resin composition and thermosetting technology, which is applied in the fields of metal-clad laminates and printed circuit boards, prepregs, and thermosetting resin compositions. It can solve the problems of low crosslink density, low glass transition temperature, and high thermal expansion coefficient. Problems, to achieve excellent dielectric properties, low water absorption, low dielectric constant effect

Active Publication Date: 2019-04-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the cross-linking density of the double-end group multifunctional active ester resin and epoxy resin reaction is not high, and the PPO main chain in the middle is a thermoplastic segment, the coefficient of thermal expansion (CTE) is high, and the glass transition temperature of the final cured product or plate Low, high coefficient of thermal expansion (CTE)

Method used

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  • Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same
  • Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same
  • Thermosetting resin composition, and prepreg, metal foil-coated laminated board and printed circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-16

[0110] Embodiments 1-16 provide a thermosetting resin composition glue, a prepreg and a copper-clad laminate using it, and the preparation method is as follows:

[0111] (1) Preparation of thermosetting resin composition glue:

[0112] Component (B) phosphorus-containing curing agent, (C) co-curing agent and (D) phenoxyphosphazene compound SPB-100 are prepared into solutions with solid content of 60%, 50% and 25% respectively with MEK solvent, Add it to a 1000mL beaker in turn, then add (A) halogen-free epoxy resin and (F) filler in turn, add an appropriate amount of (E) curing accelerator 4-dimethylaminopyridine, and adjust the gelation time (GT) to 200- 300s, add MEK solvent to control the solid content to 65%, continue to stir for 2 hours to mature, and obtain the thermosetting resin composition glue;

[0113] Wherein, the kind and consumption (in parts by weight) of each component are as shown in Table 1 and Table 2.

[0114] (2) Preparation of prepreg:

[0115] Prepare...

Embodiment 10

[0153] In embodiment 10, use ester curing agent with formula I structure and phosphorus-containing bisphenol OL3001 composite curing 78 parts of dicyclopentadiene novolac epoxy resin HP-7200H, due to the amount of dicyclopentadiene novolac epoxy resin HP-7200H Exceeding the preferred dosage range will lead to incomplete reaction, lower Tg of the final plate, higher CTE and water absorption, poor dielectric properties and unsatisfactory heat resistance.

Embodiment 11

[0154] In Example 11, 38 parts of dicyclopentadiene novolac epoxy resin HP-7200H were compositely cured with an ester curing agent having a structure of formula I and phosphorus-containing bisphenol OL3001. The plate had a higher Tg and a lower CTE, but due to Insufficient epoxy resin, excessive curing agent, the final board has high water absorption, poor dielectric properties and unsatisfactory heat resistance.

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Abstract

The invention provides a thermosetting resin composition, and a prepreg, a metal foil-coated laminated board and a printed circuit board using the same. The thermosetting resin composition includes anepoxy resin, a phosphorus-containing bisphenol, and an ester curing agent having a structure represented by formula I. The ester curing agent having the structure represented by the formula I and thephosphorus-containing bisphenol are used to synergistically cure the epoxy resin, and the phosphorus-containing bisphenol is used as the main curing agent, so the obtained cured epoxy resin has excellent dielectric properties, high heat resistance and high adhesion, and can realize no halogen and flame retardation; and the ester curing agent of the formula I is combined to make no polar groups such as secondary hydroxyl groups generated in the curing process, so excellent dielectric properties are ensured, the glass transition temperature of the cured product is significantly improved, and the cured product contains a large amount of hydrophobic groups, thereby the water absorption rate of the cured product is greatly reduced, and the dielectric constant and the dielectric loss factor ofthe cured product are stable. The produced laminated board and metal foil-coated laminated board have the advantages of good heat resistance, good moisture resistance, good peel strength, good dielectric properties and good flame retardancy.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a thermosetting resin composition and a prepreg using the same, a metal foil-clad laminate and a printed circuit board. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and the dielectric constant (Dk) and dielectric loss value (Df) are required to be lower and lower. Therefore, reducing Dk / Df has become the pursuit of the substrate industry. hotspot. At the same time, under the global trend of strengthening "green" and "environmental protection", the development of halogen-free flame-retardant copper-clad laminates has become a hot spot in the industry, and various copper-clad laminate manufacturers have launched their own halogen-free flame-retardant copper-clad laminates. foil laminate. [0003] In order to achieve low Dk / Df a...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/42C08J5/24B32B15/092B32B27/06B32B27/08B32B27/18B32B27/38H05K1/03
CPCB32B15/092B32B27/06B32B27/08B32B27/18B32B27/38B32B2457/08C08G59/4284C08G59/62C08J5/24C08J2363/00H05K1/0353
Inventor 游江林伟黄天辉
Owner GUANGDONG SHENGYI SCI TECH
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