41results about How to "Low dielectric loss factor" patented technology

The invention relates to a halogen-free Tg resin composite and a presoaked material and a laminated board made by adopting the composite. Counted by part by weight of organic solid matters, the halogen-free high-Tg resin composite contains the following components according to part by weight: (A) 10 to 50 parts by weight of cyanate resin; (B) 10 to 50 parts by weight of at least one compound withdihydro-benzoxazine ring; (C) 10 to 50 parts by weight of at least one kind of bismaleimides resin; (D) 10 to 50 parts by weight of at least one kind of poly-epoxy compound; and (E) 5 to 30 parts by weight of at least one kind phosphonium flame retardant. The halogen-free high-Tg resin composite has the performances of low water absorption, low CTE (coefficient of thermal expansion), high Tg, good dielectric property and the like, and the presoaked material and laminated board made by adopting the composite has the characteristics of high vitrification transition temperature, low CTE, low dielectric constant, low water absorption, high thermal resistance and the like, thus being application to multi-layer circuit boards.

The invention discloses a halogen-free resin composition, a prepreg prepared from the halogen-free resin composition and a laminated board prepared from the halogen-free resin composition and used for a printed circuit. The halogen-free resin composition comprises alkylphenol epoxy resin, benzoxazine resin, an alkylphenol aldehyde curing agent and a phosphorus-contained flame retardant. The molecular structure of alkylphenol epoxy resin adopted in the halogen-free resin composition contains more branched alkyls, so that the halogen-free resin composition is relatively high in glass transition temperature, low in water absorption rate, favorable in heat resistance and excellent in dielectric performance; benzoxazine resin is mixed, so that the dielectric constant, dielectric loss value and water absorption rate of a solid can be further reduced; alkylphenol aldehyde is used as a curing agent, so that the advantages of excellent dielectric performance and low water absorption rate generated by more alkyls in the structure are sufficiently exerted. The prepreg prepared from the halogen-free resin composition and the laminated board prepared from the halogen-free resin composition and used for the printed circuit have the advantages of low dielectric constant, low dielectric loss factor, low water absorption rate, high size stability, high heat resistance, and favorable flame retardance, processability and chemical resistance.

The invention discloses a low-temperature co-fired glass ceramic composite material with adjustable dielectric constant and a preparation method thereof. The composite material is prepared from the following raw materials in percentage by mass: 0.5 to 20 percent of BaxSrl-xTiO3(x=0.3-1) and 80 to 99.5 percent of fluorinated aluminosilicate glass; wherein, the fluorinated aluminosilicate glass is prepared from the following raw materials in percentage by mass: 30 to 70 percent of SiO2, 20 to 50 percent of AlF3, and 5 to 30 percent of CaF2. After being mixed by the ratio, the components are added with ethanol or water, ball milled for 24h and dried to obtain low-temperature co-fired glass ceramic powder. The low-temperature co-fired glass ceramic composite material has the advantages that: (1) the sintering temperature is low (750 to 850DEG C) and the sintering shrinkage rate is 8 to 15 percent; and (2) the dielectric constant is adjustable from 8 to 50 (1GHz), and the dielectric loss is below 0.002 and the mechanical strength is higher. Consequently, the invention is applicable to low-temperature co-fired ceramic materials and electronic packaging materials.

Disclosed is a halogen-free resin composition. The halogen-free resin composition comprises: (A) 10-60 parts by weight of dicyclopentadiene benzoxazine resin; (B) an epoxy resin; (C) an active ester curing agent; and (D) a phosphorus-containing flame retardant, based on 100 parts by weight of the total amount of organic solids of (A), (B), (C) and (D). A prepreg and a laminate that are manufactured from the halogen-free resin composition have low dielectric constant, low dielectric loss, low water absorption rate, high dimensional stability, and excellent heat resistance, fire resistance, processability and chemical resistance.

The invention discloses a halogen-free thermosetting resin composition which comprises the following components calculated according to solid weight: 10-90 parts of epoxy resin (a), 0.5-60 parts of phosphor-containing curing agent (b), 1-65 parts of nitrogen-containing curing agent (c) and a promoter (d), wherein the total weight of the components a, b and c is 100 parts; and the ratio of the content of the component d to that of front three components is (0.01-1):100. The nitrogen-containing curing agent comprises a strengthening agent and a triazine compound; and the strengthening agent is selected from one or more of dicyandiamide, benzoxazine, diamino diphenyl methane, diamino diphenyl sulfone and diaminodiphenyl sulfide. According to the halogen-free thermosetting resin composition disclosed by the invention, a phosphor-nitrogen synergic flame retardance principle, the phosphor content in the system is reduced, the humidity resistance and heat resistance of products are improved and the toughness and the processability of the products are improved.

The invention provides a light-emitting low-temperature co-fired ceramic powder, a preparation method thereof and a light-emitting low-temperature co-fired ceramic prepared from the light-emitting low-temperature co-fired ceramic powder. The light-emitting low-temperature co-fired ceramic powder is prepared from 15-20mol% of CaCO3, 60-70mol% of Si(OC2H5)4, 10-25mol% of B2O3, 3-11mol% of photoactivating agent, 0.9-3.2mol% of sensitizing agent and charge compensation agent gel equivalent to the total content of the photoactivating agent and the sensitizing agent by calcination. The low-temperature co-fired ceramic powder has the advantages of low sintering temperature, small dielectric loss, high mechanical strength and high light intensity, and can be used in the fields of ceramic base plates, electronic devices such as resonators and the like, other micro electronic potting materials and white light LED potting materials.

The invention relates to a halogen-free flame retardant resin composition which comprises the following materials in parts by weight: (A) 45-90 parts of mixture of a phenoxy phosphonitrile compound (A1) and a compound (A2) with dihydrobenzene benzoxazine, wherein the weight ratio of the phenoxy phosphonitrile compound (A1) to the compound (A2) with dihydrobenzene benzoxazine is (1:25)-(1:2); (B) 10-45 parts of epoxy resin of which the epoxide equivalent is 500-2000; (C) 10-25 parts of phenolic resin; and (D) 0.5-10 parts of amine curing agent. By being prepared from the halogen-free flame retardant resin composition disclosed by the invention, the prepregs, laminated boards and metal foil-clad laminated boards applied to printed circuits have performances of high glass-transition temperature (Tg), high heat resistance, low dielectric loss factor, low water-absorbing quality and low C.T.T and the like.

The invention discloses a multilayer printed circuit board structure which is obtained through successively stacking the components of: an aluminum foil base layer, a first prepreg, an aluminum foil middle layer, a second prepreg and a copper foil surface layer, wherein the first prepreg and the second prepreg are respectively prepared through dipping fiber cloth into a heat-conductive material, so that the heat-conductive material can be filled in the gaps of the fiber cloth, wherein the heat-conductive material is prepared through mixing a resin and a filler at least. According to the multilayer printed circuit board structure, through stacking and combining the aluminum foil base layer, the first prepreg, the aluminum foil middle layer, the second prepreg and the copper foil surface layer, and through the resin component contained in the first prepreg and the second prepreg, the multilayer printed circuit board structure can possess the advantages of: high heat conductivity, low moisture absorption property, high heat resistance, high melting point, low dielectric constant, low dielectric loss coefficient, no easy board delamination, etc.

The thermosetting resin composition consists of four components: component An of thermosetting resin with phosphorous epoxy resin as main component in 46-70 wt%; component B of dihydrobenzazine compound in 20-44 wt%; component C of condensate of phenol, cyclic triazine compound and aldehyde in 2-9 wt%; and component D of one or several kinds of imidazole compound as promoter in 0.1-1.0 wt%. The thermosetting resin composition has low dielectric loss factor, high heat resistance, low water absorption, high glass temperature, low C.T.E, less combustion, easy curing and easy machining, and may be used in pre-soaking material, laminated printed circuit board, etc.

The invention relates to a graphene modified resin packaging material and a preparation method thereof. The invention discloses a graphene modified resin packaging material. The graphene modified resin packaging material is formed by combining a component A and a component B according to the mass ratio of 1: (0.9-1.4), wherein the component A is prepared from 18 to 25 parts by weight of bisphenolA type epoxy resin, 0.5 to 2 parts by weight of a toughening agent, 1 to 10 parts by weight of a graphene resin dispersion liquid and 48 to 52 parts by weight of silica powder; and the component B comprises the following components in parts by weight: 15-25 parts of a curing agent, 0.05-0.15 part of an accelerant and 1-5 parts of a toughening agent. The invention relates to a graphene modified resin packaging material and a preparation method thereof. Through graphene pre-dispersion treatment, controllable graphene layer number and sheet diameter, and components, a formula and a preparation method of the graphene modified resin packaging material for a dry-type transformer, the graphene modified resin packaging material has a good heat dissipation effect while meeting the electrical performance.

The invention relates to a halogen-free thermosetting resin composition and a prepreg, a laminated board, a coated metal foil laminated board and a printed circuit board using it. According to 100 parts by weight of organic solid matter, the halogen-free thermosetting resin composition is prepared from, by weight, (A) 25-55 parts of phosphorus containing epoxy resin, (B), 10-40 parts of active ester curing agent, (C), and 20-50 parts of bisphenol fluorine benzoxazine resin. The laminated board prepared by the halogen-free thermosetting resin composition is featured by high glass-transition temperature, low dielectric loss factor, high heat resistance, low water absorption, and good fire resistance, processing performance, and chemical resistance.

The invention discloses a poly(aryl ether ketone) cable material resin and a synthesis method thereof. According to the synthesis method, perfluorocyclobutylaryl ether-phenol polymer, hexafluorobisphenol A, dihalobenzonitrile / dihalo-para-phthalonitrile, and 4,4'-difluorobenzophenone are taken as the raw materials; and after two temperature controlled reactions in a nitrogen atmosphere in the presence of a catalyst, the reaction product is subjected to precipitation, filtration, washing, and centrifugal drying to obtain the poly(aryl ether ketone) cable material resin. The thermal stability, crystallinity, and dissolvability of the polymer are effectively improved; the polymer dielectric constant, polymer dielectric loss factor, and signal attenuation ratio of high speed transmission frequency band are reduced; at the same time, the excellent properties of poly(aryl ether ketone) material are preserved; and the poly(aryl ether ketone) material has the advantages of poly(arylene ether nitrile), polyether ether ketone, and a material having a fluorine containing structure.

The invention discloses polyaryletherketone containing nitrile group and perfluorocyclobutyl aryl-ether structure, wherein m represents degree of polymerization, and X+Y is less than or equal to 50 and greater than or equal to 10. The invention also discloses a synthetic method of the polyaryletherketone containing nitrile group and perfluorocyclobutyl aryl-ether structure. The synthetic method comprises the following steps: placing a perfluorocyclobutyl aryl-ether polymer, dihalogenated benzonitrile or dihalogenated para-Phthalonitrile, 4,4'-difluorobenzophenone and a catalyst into a solvent, carrying out multiple temperature-control reactions, precipitating, filtering, washing and carrying out centrifugal drying to obtain a polyaryletherketone sample containing nitrile group and perfluorocyclobutyl aryl-ether structure. The prepared polyaryletherketone containing nitrile group and perfluorocyclobutyl aryl-ether structure has high temperature resistance and corrosion resistance, radiation resistance and flame retardant property, and has multiple cross-linking points.

The invention discloses a composite adsorbent and a preparation method and application thereof. The composite adsorbent comprises the following components in parts by mass: 40-66.6 parts of aluminum oxide, 33.3-60 parts of carclazyte and 0.1-5 parts of lanthanum hydroxide. The preparation method of the composite adsorbent comprises the following steps: (1) preparing raw materials, and adding aluminum oxide, carclazyte and lanthanum hydroxide into a solvent to obtain a mixed solution; and (2) controlling the pH value of the mixed solution to be 7.5-8.5, and carrying out filtering after the reaction is completed to obtain filter residues, namely, the composite adsorbent. The composite adsorbent can be applied to impurity removal and adsorption processes of vegetable insulating oil, has the advantages of strong adsorption capacity and stable chemical properties, and can significantly reduce the acid value and dielectric loss factor of the vegetable insulating oil.

The invention discloses a liquid crystal polymer thin film and TPX glue blocking film synchronous preparation method. The method is characterized by comprises the steps that: LCP resin and TPX resin are dried; three-layer co-extrusion film blowing is conducted by an extruding machine, LCP is in a middle layer and TPX is in surface layers; an obtained three-layer co-extrusion thin film is subjectedto framing and then rolling; a three-layer co-extrusion thin film coil is subjected to offline stripping, three rolling machines are configured, a middle rolling machine is for an LCP thin film, theother two rolling machines are for TPC glue blocking films; and the stripped LCP thin film is subjected to hot treatment in a high-temperature furnace, and a liquid crystal polymer thin film and the TPX glue blocking films are prepared. The prepared liquid crystal polymer thin film is high in mechanical strength, even in horizontal and vertical tensile strength, and better in folding resistance performance, and can be widely applied to the fields of high-frequency high-speed copper-clad plates, solar cell back panels, and wireless charging insulating sheets; and the synchronously produced TPXglue blocking films are good in release force, good in flexibility, and high in tensile strength, and can be used for copper-clad plate glue blocking films.

The inventionbelongs to the technical field of electrical equipment, and in particular relates to a method for reducing the dielectric loss factor of dielectric oil. The method provided by the invention comprises the following steps: step 1, performing first-order molecular distillation on the dielectric oil to obtain first-order molecular distillation dielectric oil; and step 2, performing second-order molecular distillation on the first-order molecular distillation dielectric oil to obtain dielectric oil with the low dielectric loss factor, wherein the dielectric loss factor of the dielectric oil is greater than 0.01. The method for reducing the dielectric loss factor of the dielectric oil, disclosed in the invention, can be used for effectively overcoming a technical defect in the priorart that the dielectric loss factor of the dielectric oil in a transformer is over high after the dielectric oil in the transformer is used for a long time.

The invention discloses a preparation method of a liquid crystal polymer thin film. The preparation method of the liquid crystal polymer thin film is characterized by comprising the steps of feeding dried liquid crystal polymer (LCP) resin into melt spinning equipment, carrying out melt spinning through compressed air, and obtaining an LCP fiber formed by melt blowing; naturally cooling, cooling and setting on a large cold drum, and forming an LCP non-woven fabric; protecting two sides of the LCP non-woven fabric through polyimide films, sequentially hot-pressing through a first group of preheat rollers and a second group of hot-press rollers, cooling through a cooling roller, and obtaining a three-layer composite thin film; stripping the polyimide film, and obtaining an LCP thin film; andafter heat treatment through a high-temperature furnace, cooling to obtain the liquid crystal polymer thin film. By adopting the preparation method of the liquid crystal polymer thin film provided bythe invention, equipment is simple and can carry out continuous production; and the prepared LCP thin film has the characteristics of high lateral strength, thin and adjustable thickness, good toughness and the like, and is suitable for the fields such as high-frequency high-speed copper-clad plates, solar cell back plates, wireless charging insulation sheets and the like.

The invention relates to C-grade modified bismaleimide glass fiber reinforced mould plastic and a preparation method thereof. The mould plastic is formed by covering modified bismaleimide resin on an alkali-free glass fiber yarn, wherein the modified bismaleimide resin is formed from the following components in parts by mass: 7.7-8.1 parts of bismaleimide resin, 4.5-4.7 parts of 4,4'-diphenyl sulfone diamine, 4.5-4.7 parts of diamino diphenyl ether, 20-22 parts of heat-resisting epoxy resin, 33-35 parts of solvent and 0.5-0.7 parts of auxiliary agent. According to the C-grade modified bismaleimide glass fiber reinforced mould plastic disclosed by the invention, the normal-state bending strength is 669 MPa, the thermal-state bending strength is 230 MPa (at 200 DEG C), the thermal deformation temperature is 265 DEG C and the electric strength reaches 21 MV / m which is better than that of a Germany Siemens product.

The invention relates to the electrical field, and particularly relates to a manufacturing method of a novel dry-type capacitive impregnated fiber high-voltage bushing. The method specifically comprises the following steps: manufacturing a core rod and a core mold, manufacturing a matrix glue solution, manufacturing an insulating layer, winding a core body, manufacturing a capacitive screen, manufacturing an end screen leading-out wire and manufacturing an external insulating layer. The flange is sealed.

Capsule (1) for protecting an electronic device (2) inside a wear element (3) of an earth moving machine, corresponding wear element and machine. The capsule (1) has a central axis (4) defining an axial direction, a front end (8), and a rear end (9). The capsule (1) comprises a container (5), extending in the axial direction from said front end (8), provided with an inner chamber (53) for housing said electronic device (2), and has a front part (51) provided with a flange (7), and a rear part (52). The capsule (1) also comprises a cover (6) that can be removably coupled to said container (5) and configured for covering said rear part (52) of said container (5).

The invention provides a light-emitting low-temperature co-fired ceramic powder, a preparation method thereof and a light-emitting low-temperature co-fired ceramic prepared from the light-emitting low-temperature co-fired ceramic powder. The light-emitting low-temperature co-fired ceramic powder is prepared from 15-20mol% of CaCO3, 60-70mol% of Si(OC2H5)4, 10-25mol% of B2O3, 3-11mol% of photoactivating agent, 0.9-3.2mol% of sensitizing agent and charge compensation agent gel equivalent to the total content of the photoactivating agent and the sensitizing agent by calcination. The low-temperature co-fired ceramic powder has the advantages of low sintering temperature, small dielectric loss, high mechanical strength and high light intensity, and can be used in the fields of ceramic base plates, electronic devices such as resonators and the like, other micro electronic potting materials and white light LED potting materials.

Disclosed is a halogen-free flame-retardant resin composition. The resin composition comprises the following in parts by weight: (A) a mixture of a phenoxyphosphazene compound (A1) and a compound (A2) with a dihydrobenzoxazine ring: 45-90 parts by weight, the weight ratio of A1 to A2 being 1:25-1:2; (B) an epoxy resin with an epoxy equivalent of 500-2000: 10-45 parts by weight; (C) a phenolic resin: 10-25 parts by weight; and (D) an amine curing agent: 0.5-10 parts by weight. The pre-preg, laminated board and metal foil-coated laminated board for printed circuits prepared using the composition have the properties of high glass transition temperature (Tg), high heat resistance, low dielectric loss factor, low water absorption, low C.T.E and the like.

The invention discloses a method for preparing a liquid crystal polymer film, which is characterized by the steps of: putting dried LCP resin into melt spinning equipment, and performing melt spinning by compressed air to obtain LCP fibers formed by melt blowing; Cool, and then cool and set on a large cold drum to form LCP non-woven fabric; protect both sides of the LCP non-woven fabric with polyimide film, and then pass through the first group of preheating rollers and the second group of hot pressing rollers in turn for heating. Pressing, then cooling through cooling rollers to obtain a three-layer composite film; peeling off the polyimide film to obtain an LCP film; heat treatment in a high-temperature furnace and cooling to obtain a liquid crystal polymer film. By adopting the invention, the equipment is simple and continuous production is possible, and the prepared LCP film has the characteristics of high lateral strength, thin and adjustable film thickness, good film toughness, etc. Charging insulation sheets and other fields.

The invention relates to a preparation method of polymeric polyaryletherketone containing a DOPO side group. The preparation method comprises following steps: (1) adding dual component bisphenol, difluorobenzophenone, and a catalyst into an organic solvent (I) according to a certain mole ratio, under the action of N2 flow, carrying out reactions for two times at a controlled temperature, immediately pouring the reaction liquid into water under stirring, dialyzing the precipitates by flowing water for 24 hours, and freeze-drying the precipitates to obtain a polyaryletherketone base material containing an allyl substituent; and (2) dissolving the polyaryletherketone base material containing an allyl substituent into an organic solvent (II), under the protection of N2, slowly heating the organic solvent (II), adding mercapto- DOPO derivatives and an initiator into the organic solvent (II), carrying out reactions at a constant temperature, immediately adding the reaction system into water,dialyzing the precipitates by flowing water for 24 hours, and drying the precipitates in vacuum to obtain the polymeric polyaryletherketone containing a DOPO side group. The polymeric polyaryletherketone cable material is synthesized by click reactions and the method is simple and easy to perform. The prepared cable material has the characteristics of high strength, strong wear resistant property, strong oilproof property, good electrical insulating property, low smoke, no pollution, halogen-free property, and flame retardant performance and is suitable for prepare cables with an ultrathin wall; the cable material meets the requirements of processing technology and technique of ultrathin wall insulation cables; the production is convenient, good economic benefits are generated, and the popularization value is high.

The invention provides insulating oil base oil and a preparation method thereof, and insulating oil, and relates to the technical field of insulating oil for power equipment. The preparation method ofthe insulating oil base oil comprises the following steps: uniformly blending 60-90 parts of a first component, 7-30 parts of a second component and 3-10 parts of a third component, wherein the preparation method of the first component comprises: carrying out first hydrofining, furfural refining and white clay refining on first cycloalkyl distillate oil, and taking a distillate at 280-320 DEG C to obtain the first component, the preparation method of the second component comprises: carrying out second hydrofining and fractionation on second cycloalkyl distillate oil to obtain a distillate at280-320 DEG C so as to obtain the second component, and the third component is benzyl toluene oil.