Halogen-free thermosetting resin composition and prepreg and laminated board manufactured by same

Abstract

The invention discloses a halogen-free thermosetting resin composition which comprises the following components calculated according to solid weight: 10-90 parts of epoxy resin (a), 0.5-60 parts of phosphor-containing curing agent (b), 1-65 parts of nitrogen-containing curing agent (c) and a promoter (d), wherein the total weight of the components a, b and c is 100 parts; and the ratio of the content of the component d to that of front three components is (0.01-1):100. The nitrogen-containing curing agent comprises a strengthening agent and a triazine compound; and the strengthening agent is selected from one or more of dicyandiamide, benzoxazine, diamino diphenyl methane, diamino diphenyl sulfone and diaminodiphenyl sulfide. According to the halogen-free thermosetting resin composition disclosed by the invention, a phosphor-nitrogen synergic flame retardance principle, the phosphor content in the system is reduced, the humidity resistance and heat resistance of products are improved and the toughness and the processability of the products are improved.

Description

Technical field [0001] The present invention belongs to the technical field of electronic materials, and relates to a halogen-free thermosetting resin composition and prepregs and laminates produced using the same. The resin composition can be applied to the fields of integrated circuit packaging, high-frequency high-speed and high-density interconnection. Background technique [0002] With the full implementation of the European RoHS and WEEE directives (the directive on the restriction of the use of certain hazardous substances in electrical and electronic products and the directive on waste electrical and electronic products) on July 1, 2006, the halogen-free lead-free of electronic products has become The general trend, and the copper clad laminate (ie laminate) as the substrate material is the first to bear the brunt. [0003] Traditional copper clad laminate materials generally use brominated flame retardants (such as brominated epoxy resin, tetrabromobisphenol A, etc.) to en...

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Problems solved by technology

[0004] At present, the method commonly used in the industry is to use phosphorus-containing epoxy resin to replace the previous brominated flame retardants, but its products have insufficient heat resistance of immersion tin, easy to absorb moisture, and insufficient heat resistance of immersion tin after moisture treatment The problem

[0005] In view of the above problems, the currently popular route in the industry is to choose phenolic resin to cure phosphorus-containing epoxy resin, which improves the moisture resistance of the system, but because phosphorus-containing epoxy resin is easy to absorb moisture, the heat resistance of tin-immersion after moisture treatment is relatively low. Poor, and the phenolic curing system has poor processability and low cohesiveness, which will lead to problems such as poor processability and low cohesiveness

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