A microscale selective laser sintering (μ-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm3 / hr while achieving a feature-size resolution of approximately 1 μm. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering μ-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 μm scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.
The invention which discloses a lithium secondary battery with a metalfluoride as a cathode material belongs to the technical field of environmentally friendly secondary batteries. The lithium secondary battery is characterized in that: the lithium secondary battery comprises a positive electrode, a negative electrode, a membrane, an electrolyte or a polymerdielectric, a current collector, a positive electrode shell, and a negative electrode shell; the membrane or the polymerdielectric immersed with the electrolyte separates the positive electrode and the negative electrode; the positive electrode material which is coated on the current collector is connected with the positive electrode shell of the battery; the negative electrode is connected with the negative electrode shell of the battery; the positive electrode shell and the negative electrode shell mutually insulate; the positive electrode comprises the metalfluoride, a conductive agent, a binder, and the current collector; and the positive electrode material is the metalfluoride, and the chemical composition of the positive electrode material is MFa(H2O)b, wherein a is equal to or less than 3 and equal to or more than 1, and b which is equal to or less than 4 and equal to or more than 0 is an integer. The lithium secondary battery of the present invention has the advantages of simple preparation method, easily realized reaction condition, easily available raw material, low energy consumption in the preparation process, good security, and good electrochemical performance.
A multilayer dielectric structure is formed by vacuum depositing two-dimensional matrices of nanoparticles embedded in polymerdielectriclayers that are thicker than the effective diameter of the nanoparticles, so as to produce a void-free, structured, three-dimensional lattice of nanoparticles in a polymeric dielectric material. As a result of the continuous, repeated, and controlled deposition process, each two-dimensional matrix of nanoparticles consists of a layer of uniformly distributed particles embedded in polymer and separated from adjacent matrix layers by continuous polymer dielectric layers, thus forming a precise three-dimensional nanoparticle matrix defined by the size and density of the nanoparticles in each matrix layer and by the thickness of the polymer layers between them. The resulting structured nanodielectric exhibits very high values of dielectric constant as well as high dielectric strength.
The invention discloses two-dimensional ordered organic semiconductor compound nanometer film and the special-purpose substrate thereof, and the preparation method thereof. Polymerdielectric ultra film provided by the invention is obtained by rubbing or stretching the polymer. The provided two-dimensional ordered organic semiconductor compound nanometer film is formed by compounding the polymerdielectric ultra film and the organic semiconductor compound nanometer film. Through adjusting and controlling the orientation degree, the thickness, the heating temperature, the solution spin coating speed and the vacuum evaporationcoating speed of the pre orientated polymerdielectric ultra film, the two-dimensional ordered organic semiconductor compound nanometer film which can meet the ordered structure and the film thickness of different demands is prepared. The preparation method is simple and feasible, the efficiency is high, the cost is low, the performance of the thin film can be greatly improved, the stability is high, and the two-dimensional ordered organic semiconductor compound nanometer film can be used for the fields such as sensing material, electrical conduction material and electro-optical transformation material, etc.
The invention provides a composite flexible pressure sensor based on a bionic microstructure and a preparation method of the composite flexible pressure sensor. The pressure sensor is divided into a capacitor layer, a common substrate layer and a piezoresistive layer from top to bottom. The capacitor layer comprises a protective film layer, a first electrode layer, a dielectric layer and a secondelectrode layer from top to bottom; the piezoresistive layer comprises a transverse electrode layer, a longitudinal electrode layer, a dielectric layer, a staggered electrode layer and a substrate film from top to bottom; the dielectric layer adopts a double-layer double-stage dome bionic microstructure and is made of a polymer with adjustable elasticity modulus, which is the same as that of the common substrate layer. The dielectric layer adopts a single-layer two-stage dome bionic microstructure, and is made of a nanoscale conductive composite material prepared by filling a flexible polymerwith multi-walled carbon nanotubes (MWCNT) and carbon black (CB); and the bottom staggered electrode layer adopts a multi-stage S-shaped interconnected wire structure. The composite flexible pressuresensor has the characteristics of relatively large detection range, high sensitivity, good stability and strong anti-interference performance.
The invention discloses a method for preparing a nanocompositedielectric film. The method comprises the following steps of: firstly obtaining a polymerdielectric film by a Langmuir-Blodgett (LB) film method; secondly preparing a high-dielectric inorganic / organic composite nanoparticle film on the polymer dielectric film by the LB film method; and finally preparing a polymer dielectric film on the composite nanoparticle film by the LB film method, thereby forming a high-dielectric composite film material with nanoparticles dispersed in a polymer. The polymer-nanoparticle composite dielectric film material prepared by the method overcomes the shortcomings of the prior art, and the preparation method is reasonable and simple, and easy to operate.
The invention relates to a COFs film material with a ultra-low dielectric constant, which belongs to the field of a dielectric material. The film material is the novel highly crystalline, uniform thickness, porous, flexible, moisture-resistant, ultra-low dielectric constant film material formed by reacting between two immiscible solution interfaces, and the dielectric constant can be as low as 1.19; and the regulation of properties and thickness can be achieved by regulating the composition and concentration of the components of two solutions. Compared with the conventional inorganic dielectric material and the organic high-molecular polymer dielectric material, the film material of the invention has the advantages of good stability of the inorganic dielectric material, low dielectric constant, as well as good flexibility and easy processing, good humidity resistance and the like, and develops the system of low dielectric constant dielectric materials.
The invention discloses a silicon substrate air-impermeability sealing structure and a manufacturing method thereof. The sealing structure comprises a silicon substrate provided with a complete through hole filled with first metal, the surface of the silicon substrate is passivated, and the back face of the silicon substrate is provided with a bonding pad. The front face of the silicon substrate is filled with a polymerdielectric layer provided with an opening which is filled with second metal. The upper surface of the polymerdielectric layer is provided with a metal wiring layer and an insulating layer. The second metal wiring layer and the second metal are in contact to form electric connection. A chip is mounted on the upper surface of a second insulating layer. A pin of the chip is electrically connected with the second metal wiring layer through a bonding wire, and the second metal wiring layer and the second metal are in direct contact to form electric connection. The second metal and the first metal are in direct contact to form electric connection. A cover plate and the silicon substrate are sealed together through sealing materials to form a cavity. The silicon substrate air-impermeability sealing structure and the manufacturing method thereof can effectively reduce the packaging size, improve structural strength, and simplify the production technology.
This invention discloses a gel polymerelectrolyte, a preparation method for the same, a super capacitor and an application thereof. The gel polymerelectrolyte preparation method includes steps of preparing viscous liquid containing PEO polymer, preparing gel polymer dielectric films through curtain coating and dipping and absorbing the electrolyte. The super capacitor contains the gel polymer electrolyte. The preparation method for the gel polymer electrolyte is simple in preparation, mature in technology and high in rate of finish products and efficiency, and effectively reduces the production cost. The gel polymer electrolyte prepared by the method has strong mechanical strength and high conductivity. The super capacitor containing the gel polymer electrolyte is high in the rate of finished products and low in production cost, and has excellent chemical properties and expands the application range of the super capacitor.
Semiconductor devices employing siloxaneepoxy polymers as low-κ dielectric films are disclosed. The devices include a semiconductor substrate, one or more metallayers or structures and one or more dielectric films, wherein at least one dielectric film in the devices is a siloxaneepoxypolymer. Use of siloxaneepoxy polymers is advantageous, in part, because the polymers adhere well to metals and have dielectric constants as low as 1.8. Thus, the disclosed semiconductor devices offer much better performance than devices fabricated using conventional dielectric materials. Furthermore, the siloxane epoxy polymer dielectrics are fully curable at low temperatures, exhibit low leakage currents, and remain stable at temperatures greater than 400° C. making them particularly attractive for use in the semiconductor industry