1results about How to "Avoid tarnishing" patented technology

The substrate cleaning device and the overturning device thereof comprises a groove, a lifting mechanism and an overturning mechanism. The lifting mechanism is arranged on one side of the groove and is configured to receive the substrate and drive the substrate to lift. The overturning mechanism is arranged on the groove and is configured to overturn the substrate and move between a receiving position and a taking position relative to the lifting mechanism. The receiving position is the position where the overturning mechanism receives the substrate from the lifting mechanism. The taking position is the position where the overturning mechanism takes out the substrate. In the present application, the multiple substrates which are cleaned in the groove can be transferred to the lifting mechanism at one time and then are quickly transferred to the process robot by the overturning mechanism for multiple times. This not only reduces the residence time of the substrates which are cleaned in the groove, but also improves the efficiency of the substrate cleaning device and the transmission speed of the substrate overturning device.