Polymer dielectric medium with low dielectric constant and low loss and preparation method of polymer dielectric medium

A low dielectric constant, polymer technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., to achieve improved dispersion, low dielectric constant and loss, and improved electrical insulation

Inactive Publication Date: 2014-08-13
XIAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is currently difficult to solve the above two difficulties faced by thermally conductive polymer dielectrics

Method used

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  • Polymer dielectric medium with low dielectric constant and low loss and preparation method of polymer dielectric medium
  • Polymer dielectric medium with low dielectric constant and low loss and preparation method of polymer dielectric medium
  • Polymer dielectric medium with low dielectric constant and low loss and preparation method of polymer dielectric medium

Examples

Experimental program
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preparation example Construction

[0028] see image 3 , a kind of preparation method with the polymer dielectric of low dielectric constant and low loss, comprises the following steps:

[0029] 1) Surface modification of BNNTs:

[0030]Take 10g of BNNTs into a hydrogen peroxide solution with a mass concentration of 65%, soak it under ultrasound for about 30-32h, filter to remove impurities, then wash it with deionized water until the pH value is about 7 and dry it, then add it to pure toluene, And add the KH-550 silane coupling agent (structural formula see figure 2 ), reflux and stir at 85-95°C for 10-12h, then continue to reflux at 110-120°C for 4-5h; finally carry out high-speed centrifugation and put the solid obtained by centrifugation into a vacuum oven and dry at 80-100°C After 8-12 hours, the surface-modified BNNTs were obtained, ready for use.

[0031] 2) Surface modification of BNNSs particles

[0032] Take 25g of BNNSs into a nitric acid solution with a mass concentration of 50%, soak for about...

Embodiment 1

[0037] A polymer dielectric with low dielectric constant and low loss, comprising 50% epoxy resin system and 50% hybrid nano boron nitride particles by mass percentage; wherein the hybrid nano boron nitride particles are boron nitride A mixture of nanotubes (BNNTs) and boron nitride nanosheets (BNNSs); the epoxy resin system is composed of 100phr epoxy resin E-51 and 85phr of hexahydromethylphthalic anhydride and 1phr of benzyl di A mixture of methylamines.

[0038] The diameter of boron nitride nanotubes (BNNTs) is about 70-80 nm, and the tube length is about 15-20 μm; the diameter of boron nitride nanosheets (BNNSs) is about 3-5 μm, and the thickness is about 40-60 nm. The optimal weight ratio between BNNTs and BNNSs is 0.3:1.

[0039] A method for preparing a polymer dielectric with low dielectric constant and low loss, comprising the steps of:

[0040] 1) Surface modification of BNNTs:

[0041] Put BNNTs in a hydrogen peroxide solution with a mass concentration of 65%, ...

Embodiment 2

[0047] A polymer dielectric with low dielectric constant and low loss, comprising 60% epoxy resin system and 40% hybrid nano-boron nitride particles by mass percentage; wherein the hybrid nano-boron nitride particles are boron nitride A mixture of nanotubes (BNNTs) and boron nitride nanosheets (BNNSs); the epoxy resin system is composed of 100phr epoxy resin E-51 and 85phr of hexahydromethylphthalic anhydride and 1phr of benzyl di A mixture of methylamines.

[0048] The diameter of boron nitride nanotubes (BNNTs) is about 70-80 nm, and the tube length is about 15-20 μm; the diameter of boron nitride nanosheets (BNNSs) is about 3-5 μm, and the thickness is about 40-60 nm. The optimal weight ratio between BNNTs and BNNSs is 0.4:1.

[0049] A method for preparing a polymer dielectric with low dielectric constant and low loss, comprising the steps of:

[0050] 1) Surface modification of BNNTs:

[0051] Put the BNNTs in a hydrogen peroxide solution with a mass concentration of 6...

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Abstract

The invention discloses a polymer dielectric medium with low dielectric constant and low loss and a preparation method of the polymer dielectric medium. The polymer dielectric medium comprises the following raw materials: 50-60% of epoxy resin system, and 40-50% of mixed boron nitride nanoparticles, wherein the mixed boron nitride nanoparticle is a mixture of a boron nitride nanotube and a boron nitride nanotube; the epoxy resin system is formed by 100phr of epoxy resin E-51, 85phr of methyl hexahydrophthalic anhydride and 1phr of benzyl dimethylamine in a mixing manner. The thermal breakdown voltage of the polymer dielectric medium is significantly improved by the polymer dielectric material with high heat conductivity and high electric breakdown, the service life is prolonged, the dielectric constant and loss and the heat expansion coefficient are reduced, the mechanical strength and the tenacity are improved, the highest heat conductivity can be up to 5.26W/mK, the volume resistivity is about 1014ohm.cm, the thermal breakdown voltage is about 2-3kV/mm higher than that of the similar heat-conducting polymer dielectric medium, and the dielectric constant and the loss are a little lower than those of pure resin.

Description

technical field [0001] The invention belongs to the manufacturing field of polymer dielectrics intersecting electrical materials and chemical engineering, and in particular relates to a polymer dielectric with low dielectric constant and low loss and a preparation method thereof. Background technique [0002] The increasingly miniaturized microelectronic devices and high-power power equipment have brought new severe challenges to the field of engineering dielectric materials used in the electronic packaging and electrical insulation industries. The key to meeting this challenge is to prepare materials with high thermal conductivity, high resistance and Electronic packaging and insulating materials with electrical breakdown strength, low dielectric constant and loss, easy processing, and better mechanical properties. Polymers are widely used in the fields of electronic packaging and electrical insulation materials because of the above-mentioned good comprehensive properties, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K7/00C08K3/38B32B27/06B32B27/18B32B27/38
Inventor 周文英
Owner XIAN UNIV OF SCI & TECH
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