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Halogen-free flame retardant resin composition and use thereof

A technology of resin composition and flame retardant resin, which can be applied to other household appliances, synthetic resin layered products, applications, etc., can solve the problem that the performance of resin cured products is difficult to further improve, and achieve low amine value, low activity, and high performance. Effect of Tg and heat resistance

Active Publication Date: 2013-04-03
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, this technical solution ignores the role of the auxiliary curing agent, making it difficult to further improve the performance of the resin cured product obtained by this solution.

Method used

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  • Halogen-free flame retardant resin composition and use thereof
  • Halogen-free flame retardant resin composition and use thereof
  • Halogen-free flame retardant resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 13

[0099] A halogen-free flame-retardant resin composition, comprising:

[0100] (A) Phenoxyphosphazene compound (A 1 ) with compounds having a dihydrobenzoxazine ring (A 2 ) mixture: 45 parts by weight, phenoxyphosphazene compound (A 1 ) with compounds having a dihydrobenzoxazine ring (A 2 ) with a weight ratio of 1:25; (B) bisphenol A type epoxy resin with an epoxy equivalent of 1500: 45 parts by weight; (C) nitrogen-containing phenolic resin: 10 parts by weight, and (D) diaminodiphenyl Ether: 0.5 parts by weight.

[0101] A 1 The softening point (100~110°C) is a mixture of cyclic phenoxyphosphazene compounds and chain phenoxyphosphazene compounds shown in the following structural formula:

[0102]

[0103] m is an integer from 3 to 25; X is -N=P(OC 6 h 5 ) 3 ; Y is -P(OC 6 h 5 ) 4 ; n is an integer of 3-100.

[0104] A 2 Be the bisphenol A type benzoxazine resin described in following structural formula:

[0105]

[0106] R is -C(CH 3 ) 2 -, R 1 for

Embodiment 14

[0108] A halogen-free flame-retardant resin composition, comprising:

[0109] (A) Phenoxyphosphazene compound (A 1 ) with compounds having a dihydrobenzoxazine ring (A 2 ) mixture: 90 parts by weight, phenoxyphosphazene compound (A 1 ) with compounds having a dihydrobenzoxazine ring (A 2 ) in a weight ratio of 1:2; (B) bisphenol A type epoxy resin with an epoxy equivalent of 500: 30 parts by weight; (C) phenol novolac resin: 20 parts by weight, and (D) diaminodiphenyl sulfone : 10 parts by weight.

[0110] A 1 The softening point (100~110°C) is a mixture of cyclic phenoxyphosphazene compounds and chain phenoxyphosphazene compounds shown in the following structural formula:

[0111]

[0112] m is an integer from 3 to 25; X is -N=P(O)C 6 h 5 ; Y is -P(O)(C 6 h 5 ) 2 ; n is an integer of 3-100.

[0113] A 2 Be the bisphenol F type benzoxazine resin described in following structural formula:

[0114]

Embodiment 15

[0116] A halogen-free flame-retardant resin composition, comprising:

[0117] (A) Phenoxyphosphazene compound (A 1 ) with compounds having a dihydrobenzoxazine ring (A 2 ) mixture: 65 parts by weight, phenoxyphosphazene compound (A 1 ) with compounds having a dihydrobenzoxazine ring (A 2 ) in a weight ratio of 1:10; (B) bisphenol A type epoxy resin with an epoxy equivalent of 1000: 10 parts by weight; (C) bisphenol A type phenolic resin: 25 parts by weight, and (D) m-benzene Dimethylamine: 5 parts by weight.

[0118] A 1 The softening point (100~110°C) is a mixture of cyclic phenoxyphosphazene compounds and chain phenoxyphosphazene compounds shown in the following structural formula:

[0119]

[0120] m is an integer from 3 to 25; X is -N=P(OC 6 h 5 ) 3 ; Y is -P(OC 6 h 5 ) 4 ; n is an integer of 3-100.

[0121] A 2 It is a phenolphthalein type benzoxazine resin.

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Abstract

The invention relates to a halogen-free flame retardant resin composition which comprises the following materials in parts by weight: (A) 45-90 parts of mixture of a phenoxy phosphonitrile compound (A1) and a compound (A2) with dihydrobenzene benzoxazine, wherein the weight ratio of the phenoxy phosphonitrile compound (A1) to the compound (A2) with dihydrobenzene benzoxazine is (1:25)-(1:2); (B) 10-45 parts of epoxy resin of which the epoxide equivalent is 500-2000; (C) 10-25 parts of phenolic resin; and (D) 0.5-10 parts of amine curing agent. By being prepared from the halogen-free flame retardant resin composition disclosed by the invention, the prepregs, laminated boards and metal foil-clad laminated boards applied to printed circuits have performances of high glass-transition temperature (Tg), high heat resistance, low dielectric loss factor, low water-absorbing quality and low C.T.T and the like.

Description

technical field [0001] The present invention relates to a halogen-free flame-retardant resin composition and its application, specifically, the present invention relates to a halogen-free flame-retardant resin composition and prepregs, laminates and laminates for printed circuits made of it . Background technique [0002] In recent years, people's calls for environmentally friendly electronic products have become higher and higher, which has also made great progress in halogen-free technology. On the other hand, with the advent of the lead-free era, in addition to the halogen-free flame retardancy of printed circuit boards, the role of being able to cooperate with lead-free soft soldering electrodes has also become important. Therefore, laminated boards for printed circuits are also required to have higher heat resistance and reliability than before. At present, the main technologies are concentrated on phosphorus-modified epoxy resin and benzoxazine resin. It is well kno...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L61/06C08K13/02C08K5/5399C08K5/357C08K3/22C08K3/34C08K3/36C08G59/50B32B27/06B32B27/38B32B15/092H05K1/03
CPCC08K5/357B32B15/092H05K3/022C08K13/02C08L61/06H05K1/0373C08K5/5399H05K2201/0209C08L63/00B32B27/06B32B27/38H05K1/03H05K2201/012H05K1/0366C08G59/50C08J2361/06C08J2363/00B32B15/16B32B27/20B32B2260/025B32B2260/046B32B2264/102B32B2264/104B32B2307/306B32B2457/08C08G59/621C08J5/244C08J5/249C08L79/04C08L85/02C08L71/00H05K1/0353
Inventor 何岳山苏世国
Owner GUANGDONG SHENGYI SCI TECH
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