Halogen-free thermosetting resin composition and prepreg, laminated board, coated metal foil laminated board and printed circuit board using it

A resin composition, thermosetting technology, applied in the direction of printed circuit parts, metal layer products, circuit substrate materials, etc., can solve the problems of glass transition temperature, dielectric loss or other performance deterioration, achieve high phosphorus content, Excellent heat resistance and adhesion, excellent heat resistance effect

Active Publication Date: 2018-05-18
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the halogen-free flame retardants commonly used in copper-clad laminate substrates often significantly deteriorate the glass transition temperature, dielectric loss or other...

Method used

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  • Halogen-free thermosetting resin composition and prepreg, laminated board, coated metal foil laminated board and printed circuit board using it
  • Halogen-free thermosetting resin composition and prepreg, laminated board, coated metal foil laminated board and printed circuit board using it
  • Halogen-free thermosetting resin composition and prepreg, laminated board, coated metal foil laminated board and printed circuit board using it

Examples

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preparation example Construction

[0058] (1) Preparation of resin composition

[0059] Put the solid matter into a suitable container first, then add the liquid solvent, stir until the solid matter is completely dissolved, then add the liquid resin, filler and accelerator, continue stirring evenly, and finally use the solvent to adjust the solid content of the solution to 60-80% % to make glue.

[0060] (2) Preparation of prepreg

[0061] The prepreg is made by impregnating fabrics such as glass cloth or organic fabrics with the above-mentioned halogen-free thermosetting resin composition glue, and heating and drying the impregnated glass cloth in an oven at 150-160° C. for 5-10 minutes.

[0062] (3) Copper clad laminate production

[0063] The method of using the above-mentioned prepregs to make copper-clad laminates is illustrated as follows: two or more prepregs are bonded together to form a laminate, and metal foil is placed on one or both sides of the laminate. The foil is copper foil, nickel foil, alu...

Embodiment 1

[0066] (1) Preparation of resin composition:

[0067] Feeding according to the dosage ratio in Table 1 (except for the solvent, the amount of materials used is the amount of solids), the specific preparation method is: sequentially add 35 parts of phosphorus-containing epoxy resin SEN-6075PM60, dicyclopentadienol type active ester 15 parts of HPC-8000, 50 parts of bisphenol fluorene benzoxazine BHF, 30 parts of spherical silica powder as a filler, adding 0.2 parts of accelerator 2-phenylimidazole to adjust GT (gelation time) to 200-300s, Add butanone solvent according to the actual viscosity to control the solid content at about 65%, and continue to stir for 2 hours to mature.

[0068] (2) Preparation of prepreg:

[0069] Prepare 6 pieces of 2116 glass cloth (manufacturer: Taiwan Huber Company), size: 320mm*380mm, first apply the resin composition on each glass cloth, make the resin composition liquid soak into the glass cloth and stick on both surfaces Resin, then pass the ...

Embodiment 2、 Embodiment 3、 Embodiment 4

[0073] The preparation and implementation of Examples 2, 3, and 4 are generally the same as Example 1, except that the addition ratios of SEN-6075PM60, HPC-8000, and BHF benzoxazine are different. Compared with Example 1, Examples 2, 3, and 4 The proportion of SEN-6075PM60 in the medium was increased to 40 parts, 50 parts, and 55 parts in turn.

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Abstract

The invention relates to a halogen-free thermosetting resin composition and a prepreg, a laminated board, a coated metal foil laminated board and a printed circuit board using it. According to 100 parts by weight of organic solid matter, the halogen-free thermosetting resin composition is prepared from, by weight, (A) 25-55 parts of phosphorus containing epoxy resin, (B), 10-40 parts of active ester curing agent, (C), and 20-50 parts of bisphenol fluorine benzoxazine resin. The laminated board prepared by the halogen-free thermosetting resin composition is featured by high glass-transition temperature, low dielectric loss factor, high heat resistance, low water absorption, and good fire resistance, processing performance, and chemical resistance.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a halogen-free thermosetting resin composition and a prepreg, a laminate, a metal foil-clad laminate and a printed circuit board using the same. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restrict...

Claims

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Application Information

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IPC IPC(8): C08L61/34C08L63/00C08K7/18C08K5/3445D06M15/55D06M15/423B32B17/04B32B17/06B32B15/00B32B15/14B32B27/04B32B27/38B32B27/28B32B27/18B32B33/00H05K1/03
CPCB32B15/14B32B33/00B32B2260/021B32B2260/046B32B2262/101B32B2307/204B32B2307/306B32B2307/3065B32B2307/7265B32B2457/08C08L61/34C08L2201/02C08L2201/08C08L2201/22C08L2203/20D06M15/423D06M15/55C08L63/00C08K7/18C08K5/3445
Inventor 游江黄天辉林伟
Owner GUANGDONG SHENGYI SCI TECH
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