Halogen-free resin composition and application thereof

A resin composition, resin technology, applied in the direction of epoxy resin glue, epoxy resin coating, other household appliances, etc.

Active Publication Date: 2015-10-14
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The above existing patents have proposed that the use of active ester curing agent to cure epoxy resin can reduce the dielectric constant, dielectric loss factor and water absorption rate of the cured product. The disadvantage is that it is difficult to further reduce the dielectric constant while maintaining the adhesive force. constant, dielectric loss value and water absorption and increase storage modulus and flexural strength

Method used

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  • Halogen-free resin composition and application thereof
  • Halogen-free resin composition and application thereof
  • Halogen-free resin composition and application thereof

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Embodiment Construction

[0047] The technical solutions of the present invention will be further described below through specific embodiments.

[0048] The embodiments of the present invention are described in detail as follows, but the present invention is not limited to the scope of the embodiments. There is no special description below, the parts represent parts by weight, and the % represents "% by weight".

[0049] (A-1) Dicyclopentadiene type benzoxazine resin

[0050] LZ8260N70 (HUNTSMAN trade name)

[0051] (A-2) Modified PPO

[0052] PP-403 (trade name of Taiwan Jinyi Chemical)

[0053] (A-3) Bisphenol A benzoxazine

[0054] LZ8290H62 (HUNTSMAN trade name)

[0055] (B) epoxy resin

[0056] (B-1) HP-7200H (Dainippon Ink, dicyclopentadiene type epoxy resin)

[0057] (B-2) NC-3000 (Nippon Kayaku, biphenyl type epoxy resin)

[0058] (C) curing agent

[0059] (C-1) HPC-8000-65T (Dainippon Ink, active ester curing agent)

[0060] (C-2) 2812 (Korea MOMENTIVE, novolac curing agent)

[0061...

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Abstract

Disclosed is a halogen-free resin composition. The halogen-free resin composition comprises: (A) 10-60 parts by weight of dicyclopentadiene benzoxazine resin; (B) an epoxy resin; (C) an active ester curing agent; and (D) a phosphorus-containing flame retardant, based on 100 parts by weight of the total amount of organic solids of (A), (B), (C) and (D). A prepreg and a laminate that are manufactured from the halogen-free resin composition have low dielectric constant, low dielectric loss, low water absorption rate, high dimensional stability, and excellent heat resistance, fire resistance, processability and chemical resistance.

Description

technical field [0001] The present invention relates to a halogen-free resin composition and a prepreg and a laminate using the same, which have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high heat resistance and good Flame retardancy, processability, chemical resistance. Background technique [0002] Traditional printed circuit laminates usually use brominated flame retardants to achieve flame retardancy, especially tetrabromobisphenol A epoxy resin, this brominated epoxy resin has good flame retardancy, but it is in Combustion produces hydrogen bromide gas. In addition, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, so the application of brominated epoxy resins is limited. On July 1, 2006, the EU's two environmental protection directives "Directive on Waste E...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/00C08G59/42C08J5/24C08J5/04B32B15/092B32B27/04
CPCB32B5/26C08G59/4223C08L63/00C08L79/04C08J2363/00C08J2379/04C08L2201/02C08L2201/08C08L2201/22C08K2201/003C08J2463/00C08J2479/02B32B2260/046B32B2260/021B32B2307/306B32B2307/3065B32B2307/734B32B2307/714B32B2307/546B32B2457/08C08J5/244C08J5/249C08K5/5399C08K5/34928C08K7/18C08K5/3437C08K5/50C08G59/4276C08G59/686C09J163/00C08G59/4215C09D163/00C08K3/36C08K5/5313C08L67/00C08G59/58C08G73/02C08L79/02C08L79/06C08J2479/04C09D179/04
Inventor 游江何岳山
Owner GUANGDONG SHENGYI SCI TECH
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