Halogen-free resin composition and application thereof
A resin composition, resin technology, applied in the direction of epoxy resin glue, epoxy resin coating, other household appliances, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0047] The technical solutions of the present invention will be further described below through specific embodiments.
[0048] The embodiments of the present invention are described in detail as follows, but the present invention is not limited to the scope of the embodiments. There is no special description below, the parts represent parts by weight, and the % represents "% by weight".
[0049] (A-1) Dicyclopentadiene type benzoxazine resin
[0050] LZ8260N70 (HUNTSMAN trade name)
[0051] (A-2) Modified PPO
[0052] PP-403 (trade name of Taiwan Jinyi Chemical)
[0053] (A-3) Bisphenol A benzoxazine
[0054] LZ8290H62 (HUNTSMAN trade name)
[0055] (B) epoxy resin
[0056] (B-1) HP-7200H (Dainippon Ink, dicyclopentadiene type epoxy resin)
[0057] (B-2) NC-3000 (Nippon Kayaku, biphenyl type epoxy resin)
[0058] (C) curing agent
[0059] (C-1) HPC-8000-65T (Dainippon Ink, active ester curing agent)
[0060] (C-2) 2812 (Korea MOMENTIVE, novolac curing agent)
[0061...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com