Epoxy resin composition as well as prepreg and laminated board made of same

Abstract

The invention relates to an epoxy resin composition as well as a prepreg and a laminated board made of the same. The epoxy resin composition comprises the following components in parts by weight: 1-50 parts of modified polyphenylene oxide resin, 30-80 parts of epoxy resin, 20-60 parts of active ester curing agent, 0-50 parts of filler and 1-20 parts of assistant. The prepreg made of the epoxy resin composition comprises a base material and the epoxy resin composition which is attached to the base material through soaking and drying. The laminated board made of the epoxy resin composition comprises a plurality of laminated prepregs, wherein each prepreg comprises a base material and the epoxy resin composition which is attached to the base material through soaking and drying. The invention has the advantages of high heat resistance, high fire retardancy, low dielectric constant, low dielectric loss, excellent high-frequency dielectric properties and the like, and is suitable to be used as a high frequency circuit substrate material.

Description

technical field [0001] The invention relates to a composition, in particular to an epoxy resin composition and a prepreg and a laminate made by using the composition. Background technique [0002] In recent years, with the development of high-performance, high-functionality and network technology of computers and communication equipment, in order to transmit and process a large amount of information at high speed, the operating signal tends to be high-frequency, thus putting forward higher requirements for circuit substrate materials . [0003] Among the existing base materials used for printed circuit boards, the widely used base resin is epoxy resin with excellent adhesion and processability, but since the molecular structure of epoxy resin itself contains a certain amount of polar groups , a certain amount of polar groups will be produced during the curing and cross-linking process with dicyandiamide or phenolic resin, resulting in high dielectric constant and dielectric...

AI Technical Summary

Problems solved by technology

[0004] Japanese patent JP, H8-120039, A mentions the use of biphenyl epoxy resin in combination with other curing agents to improve the flame retardancy and dielectric properties of the board. Due to the high carbonation rate of biphenyl epoxy resin, hydrophobicity and Low polarity, so the flame retardancy of the prepared board is better, but the dielectric loss tangent value of the substrate material is too high, which is not suitable for the needs of high-frequency circuits

Japanese patent JP2009-286949 refers to an epoxy resin composition with good heat resistance, flame retardancy and low dielectric loss, which is used in combination with two components: aromatic epoxy resin and curing agent; The aromatic ring of the epoxy resin is replaced by benzyloxy group, the curing agent is Mitsubishi Chemical’s XLC-LL special phenolic resin, and triphenylphosphine is used as a curing accelerator; the flame retardancy of the plate prepared in the experiment is good, but the dielectric loss is close to 0.010 (100MHZ), not conducive to signal transmission

Japanese patent JP2009-286944 refers to an epoxy resin composition with good heat resistance, flame retardancy and low dielectric loss, which is used in combination with epoxy resin and modified phenolic resin; wherein the phenolic resin is cured The aromatic ring of the agent is replaced by benzyloxy; the dielectric loss of the plate prepared in the experiment is 0.0115 (100MHZ) high, which is not conducive to signal transmission; Japanese patent JP07-082348 mentions a heat resistance, dielectric properties, mechanical processing A good epoxy resin composition, which is composed of epoxy resin containing at least two epoxy groups in the molecule, aryl esterified phenolic resin, curing accelerator and filler, etc.

Due to the large amount of brominated novolac epoxy resin and aryl esterified phenolic resin composition used in this patent, the dielectric constant of the prepared board is above 3.9 (100MHZ), which cannot meet the needs of high-frequency communication

The patent 2010-047726 provides a resin composition with high heat resistance and copper foil adhesion. The resin composition is composed of epoxy resin and modified phenolic resin, wherein the phenolic resin substituted by esterification has a softening point of 100 -140°C accounts for 40-95%; PS=1.2-1.4KN / m2, Dk=3.9, Df=0.007 (1GHZ) of copper-clad laminates prepared with this resin composition, but HP-4032 type is used in this formula The Tg of the bifunctional epoxy resin is only 155°C (DMA), and the Tg (glass transition temperature) is low, so it is difficult to adapt to the lead-free copper clad laminate process

[0005] The above-mentioned patents all mention that benzyloxy phenolic resin or epoxy resin is used as the main resin to prepare copper-clad laminates with low dielectric constant and low dielectric loss. However, from the experimental results, the Df of the prepared boards is generally 0.1 ( 100MHZ), it is easy to cause signal attenuation; although the use of esterified phenolic resin and special epoxy resin can improve the dielectric properties of the board to a certain extent, but the Tg has decreased

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