Epoxy resin composition as well as prepreg and laminated board made of same
A technology of epoxy resin and prepreg, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of high dielectric loss tangent, Tg drop, signal attenuation, etc., to ensure stability and consistency, high glass transition temperature, heat resistance improvement effect
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[0038] Example 1
[0039] Add 100g of dicyclopentadiene epoxy resin (brand: HP-7200H Japan DIC company, epoxy equivalent: 272~284) in the beaker, and then add 100g of modified PPO (polyphenylene ether) resin (homemade, Mn= 1000~5000), 130g of active ester curing agent (Japan DIC company, brand: 94605), start the mixer, stir the above components evenly, then add 0.3g of imidazole curing accelerator, adjust the solid content of the glue with methyl ethyl ketone For viscosity, add spherical silicon differential, BT-93 flame retardant, dispersing aid, etc. at the end. Stir for 6-8 hours at room temperature for curing, take the glass fiber cloth for impregnation and gluing, and perform semi-curing treatment in an oven to make a semi-cured sheet. Finally, the 8 prepregs prepared above are stacked neatly, covered with 1OZ copper foil on both sides, and cured in a hot oil press under a curing condition of 200°C / 120min to obtain a copper clad laminate. The board properties are shown in ...
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[0040] Example 2
[0041] The production process and conditions are the same as in Example 1, and the resin composition ratio is changed as shown in the following table;
Example Embodiment
[0042] Example 3
[0043] The production process and conditions are the same as in Example 1, and the resin composition ratio is changed as shown in the following table;
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