Thermosetting resin composition, presoaking materials and laminated sheet for printed circuit using same

Abstract

The thermosetting resin composition consists of four components: component An of thermosetting resin with phosphorous epoxy resin as main component in 46-70 wt%; component B of dihydrobenzazine compound in 20-44 wt%; component C of condensate of phenol, cyclic triazine compound and aldehyde in 2-9 wt%; and component D of one or several kinds of imidazole compound as promoter in 0.1-1.0 wt%. The thermosetting resin composition has low dielectric loss factor, high heat resistance, low water absorption, high glass temperature, low C.T.E, less combustion, easy curing and easy machining, and may be used in pre-soaking material, laminated printed circuit board, etc.

Description

technical field [0001] The present invention relates to a kind of thermosetting resin composition and its prepreg, laminated plate for printed circuit, especially a kind of high-frequency circuit substrate that effectively utilizes low dielectric loss factor and high glass transition temperature (TG) and is suitable for Halogen-free environment-friendly thermosetting resin composition for impregnating high-multilayer substrates. Background technique [0002] At present, the electronics and electrical industries are developing rapidly, and have become one of the important symbols to measure social and economic development and scientific and technological progress; thermosetting resins such as phenolic resin, melamine resin, epoxy resin, unsaturated polyester resin, dihydrobenzoxamate Oxazine and bis(maleimide) resins, etc., have been used in various industrial fields due to their reliability and heat resistance produced by thermosetting; however, these resins have their own d...

AI Technical Summary

Problems solved by technology

[0002] At present, the electronics and electrical industries are developing rapidly, and have become one of the important symbols to measure social and economic development and scientific and technological progress; thermosetting resins such as phenolic resin, melamine resin, epoxy resin, unsaturated polyester resin, dihydrobenzoxamate Oxazine and bis(maleimide) resins, etc., have been used in various industrial fields due to their reliability and heat resistance produced by thermosetting; however, these resins have their own disadvantages in the use process, such as phenolic Resins and melamine resins will produce volatile by-products when they are cured, and these resins are flammable. Due to the inability to control their burning point, it is inconvenient for industrial production or use. At present, a large number of flame retardants added in industry, such as bromine When the copper clad laminates applied to these halides and antimonides are on fire, not only the amount of smoke is large, the smell is unpleasant, but also the toxic and corrosive halogenated Hydrogen gas not only pollutes the environment, but also endangers human health; it is also reported that brominated flame retardants can produce carcinogenic dioxins when burned, and antimony trioxide dust produced by burning can also cause cancer when inhaled into the lungs. The use of halogens and antimonides as flame retardants in copper plates is becoming more and more popular. Therefore, the development of environmentally friendly flame retardant copper clad laminates without halogen and antimonide elements has become an important research topic and development trend of the copper clad laminate industry; Phosphorus-containing resins are used to achieve flame retardant effects, such as epoxy resins corresponding to phosphorus-containing phenanthrene-type compounds DOPO or ODOPB, or epoxy resins containing phosphorus-containing resins such as trimeric phosphonitrile chloride, but the board after soaking There are many problems such as low heat resistance, high water absorption and poor chemical resistance

[0003] In order to solve the above problems, the industry uses resins containing dihydrobenzoxazine to improve heat resistance, chemical resistance, and reduce water absorption, but it is difficult for resins containing dihydrobenzoxazine to reach V-0 in UL94 Flame retardant standard, and itself is very brittle, it is difficult to meet the processing requirements of printed circuit boards. In addition, the curing temperature of dihydrobenzoxazine itself is very high, and it is required to reach about 200 degrees Celsius

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