The invention discloses a preparation method for a circuit board. The preparation method comprises the following steps: a, performing chemical splitting treatment on fiberglass cloth; b, mixing
epoxy resin adhesives A and B, and adding a
metal compound for uniform stirring; c, placing the fiberglass cloth into the mixture obtained by uniform stirring in the step b for impregnation, and heating, pressing and shaping the fiberglass cloth into a substrate; d, performing high-temperature
laser sintering on the substrate in the step c to convert the
metal compound exposed from the surface of the substrate into
metal ions, wherein multiple
layers of substrates can be stacked after
laser drilling on the substrate; e, carrying out a
chemical plating process on the substrate subjected to high-temperature
laser sintering in the step d to form a circuit on the substrate to conduct the front and back surfaces of the substrate. According to the preparation method, environment friendliness is achieved,
machining time is shortened, and efficiency is improved; moreover, the metal compound is added during
epoxy resin modulation, so that the resistance value and
dielectric constant of the circuit board are more stable.