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Thermosetting resin composition, and prepreg, laminated board and metal foil coated laminated board using the same

A resin composition, thermosetting technology, applied in the field of prepreg, laminate and metal foil clad laminate, thermosetting resin composition, can solve the problem of poor dielectric properties, deterioration of dicyclopentadienyl phenol type active ester halogen-free system Dielectric properties and heat resistance, etc., to achieve the effects of low dielectric constant, increased glass transition temperature, and low water absorption

Active Publication Date: 2019-04-19
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Benzoxazine resins are often used in the copper clad laminate industry to reduce the water absorption rate of cured products. However, the dielectric properties of benzoxazine resins are poor, and the molecular structure contains polar groups, which will seriously deteriorate the dicyclopentadienol type active ester. Dielectric properties and heat resistance of halogen-free systems

Method used

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  • Thermosetting resin composition, and prepreg, laminated board and metal foil coated laminated board using the same
  • Thermosetting resin composition, and prepreg, laminated board and metal foil coated laminated board using the same
  • Thermosetting resin composition, and prepreg, laminated board and metal foil coated laminated board using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-16

[0106] Embodiments 1-16 provide a thermosetting resin composition glue, a prepreg and a copper-clad laminate using it, and the preparation method is as follows:

[0107] (1) Preparation of thermosetting resin composition glue:

[0108] Component (B) dicyclopentadiene phenolic active ester, (C) curing agent and (D-2) phenoxyphosphazene compound SPB-100 are prepared respectively with MEK solvent so that the solid content is 60%, 50% and Add the 25% solution into a 1000mL beaker in turn, then add (A) halogen-free epoxy resin, (D-1) phosphorus-containing phenolic XZ92741 and (F) filler in turn, and add an appropriate amount of (E) curing accelerator 4-di For methylaminopyridine, adjust the gelation time (GT) to 200-300s, add MEK solvent to control the solid content to 65%, continue to stir for 2 hours to mature, and obtain a thermosetting resin composition glue;

[0109] Wherein, the type and amount (in parts by weight) of each component are shown in Table 1 and Table 2.

[0110...

Embodiment 11

[0148]In Example 11, 75 parts of dicyclopentadiene novolac epoxy resin HP-7200H were compositely cured with an ester curing agent having a structure of formula I and dicyclopentadiene phenolic active ester HPC-8000-65T, and the plate had high Tg and low CTE, but due to the excessive amount of dicyclopentadiene novolac epoxy resin HP-7200H, the curing is incomplete, and the final board has high water absorption, poor dielectric properties and unsatisfactory heat resistance.

Embodiment 12

[0149] In embodiment 12, use 27 parts of ester curing agents with the structure of formula I and dicyclopentadiene phenolic active ester HPC-8000-65T to cure 38 parts of dicyclopentadiene novolac epoxy resin HP-7200H, and the board has high Tg, High peel strength, high heat resistance and good toughness, but due to the incomplete reaction of excessive curing agent, the board has high water absorption and poor dielectric properties.

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Abstract

The invention provides a thermosetting resin composition, and prepreg, a laminated board and a metal foil coated laminated board using the same. The composition includes epoxy resin, dicyclopentadienephenol type active ester and an ester curing agent having a structure shown as a formula I. The composition adopts the ester curing agent having the structure shown as the formula I and the dicyclopentadiene phenol type active ester to synergistically cure the epoxy resin, so that polar groups like a secondary hydroxyl group cannot be generated during curing, a large amount of hydrophobic groupsare contained in a cured product, and therefore, the cured product can be guaranteed to have higher glass-transition temperature, and water absorption rate and dielectric loss factors can be obviouslyreduced. The laminated board and the metal foil coated laminated board prepared through the composition can have good hear resistance, moisture resistance, dielectric properties, flame resistance, processability and chemical resistance.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a thermosetting resin composition and prepregs, laminates and metal foil-clad laminates using the same. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and the dielectric constant (Dk) and dielectric loss value (Df) are required to be lower and lower. Therefore, reducing Dk / Df has become the pursuit of the substrate industry. hotspot. In order to achieve high glass transition temperature (Tg) and low Df, various low-polarity resins, such as active esters, are widely used, among which dicyclopentadienol-type active esters are the most widely used. The cured product of dicyclopentadienyl phenol-type active ester and epoxy resin has excellent dielectric properties and adhesion, but there are problems of high water absorption and low...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/18C08K3/22C08K7/14C08J5/24C08G59/42H05K1/03H05K3/02B32B17/04B32B17/12B32B17/06B32B27/04B32B27/18B32B27/26B32B27/20B32B27/38B32B15/18B32B15/20
CPCB32B5/02B32B5/26B32B15/14B32B15/18B32B15/20B32B2250/40B32B2260/021B32B2260/046B32B2262/101B32B2264/0214B32B2264/0257B32B2264/101B32B2264/102B32B2264/104B32B2264/12B32B2307/20B32B2307/306B32B2307/3065B32B2307/714B32B2307/726B32B2457/08C08G59/4223C08J5/24C08J2363/00C08K3/22C08K7/14C08K7/18C08K2003/2227C08L63/00H05K1/0353H05K1/036H05K3/022
Inventor 游江黄天辉林伟
Owner GUANGDONG SHENGYI SCI TECH
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